Patents by Inventor Don W. NELSON

Don W. NELSON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dual-sided die packages
    Patent number: 10361142
    Abstract: An apparatus including a die, a first side of the die including a first type of system level contact points and a second side including a second type of contact points; and a package substrate coupled to the die and the second side of the die. An apparatus including a die, a first side of the die including a plurality of system level logic contact points and a second side including a second plurality of system level power contact points. A method including coupling one of a first type of system level contact points on a first side of a die and a second type of system level contact points on a second side of the die to a package substrate.
    Type: Grant
    Filed: June 16, 2017
    Date of Patent: July 23, 2019
    Assignee: Intel Corporation
    Inventors: Henning Braunisch, Feras Eid, Adel A. Elsherbini, Johanna M. Swan, Don W. Nelson
  • DUAL-SIDED DIE PACKAGES
    Publication number: 20170287808
    Abstract: An apparatus including a die, a first side of the die including a first type of system level contact points and a second side including a second type of contact points; and a package substrate coupled to the die and the second side of the die. An apparatus including a die, a first side of the die including a plurality of system level logic contact points and a second side including a second plurality of system level power contact points. A method including coupling one of a first type of system level contact points on a first side of a die and a second type of system level contact points on a second side of the die to a package substrate.
    Type: Application
    Filed: June 16, 2017
    Publication date: October 5, 2017
    Inventors: Henning BRAUNISCH, Feras EID, Adel A. ELSHERBINI, Johanna M. SWAN, Don W. NELSON
  • Dual-sided die packages
    Patent number: 9711428
    Abstract: An apparatus including a die, a first side of the die including a first type of system level contact points and a second side including a second type of contact points; and a package substrate coupled to the die and the second side of the die. An apparatus including a die, a first side of the die including a plurality of system level logic contact points and a second side including a second plurality of system level power contact points. A method including coupling one of a first type of system level contact points on a first side of a die and a second type of system level contact points on a second side of the die to a package substrate.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: July 18, 2017
    Assignee: Intel Corporation
    Inventors: Henning Braunisch, Feras Eid, Adel A. Elsherbini, Johanna M. Swan, Don W. Nelson
  • DUAL-SIDED DIE PACKAGES
    Publication number: 20160211190
    Abstract: An apparatus including a die, a first side of the die including a first type of system level contact points and a second side including a second type of contact points; and a package substrate coupled to the die and the second side of the die. An apparatus including a die, a first side of the die including a plurality of system level logic contact points and a second side including a second plurality of system level power contact points. A method including coupling one of a first type of system level contact points on a first side of a die and a second type of system level contact points on a second side of the die to a package substrate.
    Type: Application
    Filed: September 27, 2013
    Publication date: July 21, 2016
    Inventors: Henning BRAUNISCH, Feras EID, Adel A. ELSHERBINI, Johanna M. SWAN, Don W. NELSON