Abstract: An electrical cord reel includes a metal housing of rectangular shape which is adapted to be mounted set in a wall or on the surface of the wall. The electric cord is mounted on a retractable reel mounted within the housing and may be connected to a source of electricity. An outlet receptacle is mounted to the cord for supplying power to remote locations in the room or work area as the cord is unwound from the reel. A series of guide rollers permit the cord to be paid out in a direction generally perpendicular to the wall, but over a large space for flexible application. The receptacle may be reeled in for storage and used as a wall outlet in the storage position. The receptacle is secured in a recess in the front wall of the housing; and the receptacle may be moved from the storage position to a release position where it is readily removed from the housing for remote use.

Abstract: An electrical cord reel includes a metal housing of rectangular shape which is adapted to be mounted set in a wall or on the surface of the wall. The electric cord is mounted on a retractable reel mounted within the housing and may be connected to a source of electricity. An outlet receptacle is mounted to the cord for supplying power to remote locations in the room or work area as the cord is unwound from the reel. A series of guide rollers permit the cord to be paid out in a direction generally perpendicular to the wall, but over a large space for flexible application. The receptacle may be reeled in for storage and used as a wall outlet in the storage position. The receptacle is secured in a recess in the front wall of the housing; and the receptacle may be moved from the storage position to a release position where it is readily removed from the housing for remote use.

Abstract: An electronic module (20) includes a first circuit substrate (40) and a second circuit substrate (44). The first circuit substrate (40) has a post surface (50) and a post (52) protruding from the post surface (50). The second circuit substrate (44) has an upper surface (46) opposed to a lower surface (48). The second circuit substrate (44) forms an opening (56). The first circuit substrate (40) may be manufactured using a Molded Interconnect Device substrate. The second circuit substrate (44) may be manufactured using a High Density Interconnect substrate. The second circuit substrate (44) is placed on top of the first circuit substrate (40) so that the post (52) of the first circuit substrate (40) is mated with the opening (56) of the second circuit substrate (44).