Abstract: Carriers for microelectronics fabrication may include a strengthened substrate formed from glass or glass-ceramic having an average thickness greater than 1.0 mm and less than or equal to 2.0 mm. The strengthened glass substrate may have a single-side surface area greater than or equal to 70,000 mm2. The substrate may also have a compressive stress greater than or equal to 200 MPa and a depth of layer from about 50 ?m to about 150 ?m. The substrate may further include a tensile stress region having a stored elastic energy of less than 40 kJ/m2 providing for a flat fragmentation factor of less than or equal to 5.

Abstract: Carriers for microelectronics fabrication may include a strengthened substrate formed from glass or glass-ceramic having an average thickness greater than 1.0 mm and less than or equal to 2.0 mm. The strengthened glass substrate may have a single-side surface area greater than or equal to 70,000 mm2. The substrate may also have a compressive stress greater than or equal to 200 MPa and a depth of layer from about 50 ?m to about 150 ?m. The substrate may further include a tensile stress region having a stored elastic energy of less than 40 kJ/m2 providing for a flat fragmentation factor of less than or equal to 5.

Abstract: Methods of strengthening the edge surfaces of a glass substrate, and particularly glass substrates contained within a display panel, are disclosed. The methods include exposing edges of the display panel to an acid solution for a time and at a temperature effective to remove no more than about 20 micrometers of glass from edge surfaces, rinsing the acid solution from the edge and applying a polymer protective coating the rinsed edge to maintain the post-etching strength of the edge surfaces. Electronics on the display panel that may be exposed to the acid solution are masked with a terminal mask prior to the etching. The edge etching may be combined with etching of a surface of the display panel/cover glass substrate.

Abstract: Disclosed are controlled chemical etching processes used to modify the geometry of surface flaws in thin glass substrates and glass substrate assemblies formed therefrom, and in particular glass substrates suitable for the manufacture of active matrix displays that are essentially free of alkali metal oxides such as Na2O, K2O and Li2O.

Abstract: Methods of strengthening the edge surfaces of a glass substrate, and particularly glass substrates contained within a display panel, are disclosed. The methods include exposing edges of the display panel to an acid solution for a time and at a temperature effective to remove no more than about 20 micrometers of glass from edge surfaces, rinsing the acid solution from the edge and applying a polymer protective coating the rinsed edge to maintain the post-etching strength of the edge surfaces. Electronics on the display panel that may be exposed to the acid solution are masked with a terminal mask prior to the etching. The edge etching may be combined with etching of a surface of the display panel/cover glass substrate.

Abstract: Methods and apparatus are provide for: a glass substrate having first and second opposing surfaces, and a plurality of edge surfaces extending transversely between the first and second opposing surfaces; a layer disposed on, and adhered to, at least one of the first, second, and edge surfaces of the substrate, where the layer includes: (i) one of an oligomer and resin; (ii) a monomer; and (iii) nanometer-sized silica particles of at least about 2-50 weight percent.