Patents by Inventor Donald E. Cleary

Donald E. Cleary has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stable electroless copper plating compositions and methods for electroless plating copper on substrates
    Patent number: 10655227
    Abstract: Select carboxymethyl-thio compounds are added to electroless copper plating compositions to improve the stability of the electroless copper plating compositions such that the plating activity of the electroless plating copper compositions is not compromised even when electroless plating at low plating temperatures and high stabilizer and high leached catalyst concentrations.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: May 19, 2020
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Alejo M. Lifschitz Arribio, Donald E. Cleary
  • Electroless copper plating compositions and methods for electroless plating copper on substrates
    Patent number: 10590541
    Abstract: Stable electroless copper plating baths include di-cation viologen compounds to improve rate of copper deposition on substrates. The copper from the electroless plating baths can be plated at low temperatures and at high plating rates.
    Type: Grant
    Filed: June 15, 2018
    Date of Patent: March 17, 2020
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Alejo M. Lifschitz Arribio, Donald E. Cleary
  • ELECTROLESS COPPER PLATING COMPOSITIONS AND METHODS FOR ELECTROLESS PLATING COPPER ON SUBSTRATES
    Publication number: 20190382899
    Abstract: Stable electroless copper plating baths include di-cation viologen compounds to improve rate of copper deposition on substrates. The copper from the electroless plating baths can be plated at low temperatures and at high plating rates.
    Type: Application
    Filed: June 15, 2018
    Publication date: December 19, 2019
    Inventors: Alejo M. Lifschitz Arribio, Donald E. Cleary
  • Stable electroless copper plating compositions and methods for electroless plating copper on substrates
    Patent number: 10294569
    Abstract: A specific cysteine derivative is added to electroless copper plating compositions to improve the stability of the electroless copper plating compositions such that the plating activity of the electroless plating copper compositions is not compromised even when electroless plating at low plating temperatures and high stabilizer and high leached catalyst concentrations.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: May 21, 2019
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Alejo M. Lifschitz Arribio, Donald E. Cleary
  • STABLE ELECTROLESS COPPER PLATING COMPOSITIONS AND METHODS FOR ELECTROLESS PLATING COPPER ON SUBSTRATES
    Publication number: 20190106793
    Abstract: Select carboxymethyl-thio compounds are added to electroless copper plating compositions to improve the stability of the electroless copper plating compositions such that the plating activity of the electroless plating copper compositions is not compromised even when electroless plating at low plating temperatures and high stabilizer and high leached catalyst concentrations.
    Type: Application
    Filed: July 13, 2018
    Publication date: April 11, 2019
    Inventors: Alejo M. Lifschitz Arribio, Donald E. Cleary
  • STABLE ELECTROLESS COPPER PLATING COMPOSITIONS AND METHODS FOR ELECTROLESS PLATING COPPER ON SUBSTRATES
    Publication number: 20190106792
    Abstract: A specific cysteine derivative is added to electroless copper plating compositions to improve the stability of the electroless copper plating compositions such that the plating activity of the electroless plating copper compositions is not compromised even when electroless plating at low plating temperatures and high stabilizer and high leached catalyst concentrations.
    Type: Application
    Filed: July 13, 2018
    Publication date: April 11, 2019
    Inventors: Alejo M. Lifschitz Arribio, Donald E. Cleary
  • Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds
    Patent number: 9914115
    Abstract: Catalysts include five-membered nitrogen containing heterocyclic compounds as ligands for metal ions which have catalytic activity. The catalysts are used to electrolessly plate metal on metal clad and un-clad substrates.
    Type: Grant
    Filed: October 23, 2015
    Date of Patent: March 13, 2018
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Kristen M. Milum, Donald E. Cleary, Maria A. Rzeznik
  • ENVIRONMENTALLY FRIENDLY STABLE CATALYSTS FOR ELECTROLESS METALLIZATION OF PRINTED CIRCUIT BOARDS AND THROUGH-HOLES
    Publication number: 20170171987
    Abstract: Catalysts include nanoparticles of catalytic metal and starch as a stabilizer in molar ratios which enable stabilization of the catalyst during storage and during electroless metal plating. The catalysts are environmentally friendly and are tin free. The catalysts adhere well to dielectric materials of printed circuit boards including the walls of through-holes.
    Type: Application
    Filed: December 5, 2016
    Publication date: June 15, 2017
    Inventor: Donald E. Cleary
  • ENVIRONMENTALLY FRIENDLY STABLE CATALYSTS FOR ELECTROLESS METALLIZATION OF PRINTED CIRCUIT BOARDS AND THROUGH-HOLES
    Publication number: 20170171988
    Abstract: Catalysts include nanoparticles of catalytic metal and dextrin as a stabilizer in molar ratios which enable stabilization of the catalyst during storage and during electroless metal plating. The catalysts are environmentally friendly and are tin free. The catalysts adhere well to dielectric materials of printed circuit boards including the walls of through-holes.
    Type: Application
    Filed: December 5, 2016
    Publication date: June 15, 2017
    Inventor: Donald E. Cleary
  • ENVIRONMENTALLY FRIENDLY STABLE CATALYSTS FOR ELECTROLESS METALLIZATION OF PRINTED CIRCUIT BOARDS AND THROUGH-HOLES
    Publication number: 20170171982
    Abstract: Catalysts include nanoparticles of catalytic metal and maltodextrin as a stabilizer in molar ratios which enable stabilization of the catalyst during storage and during electroless metal plating. The catalysts are environmentally friendly and are tin free. The catalysts adhere well to dielectric materials of printed circuit boards including the walls of through-holes.
    Type: Application
    Filed: December 5, 2016
    Publication date: June 15, 2017
    Inventor: Donald E. Cleary
  • Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds
    Patent number: 9364822
    Abstract: Catalysts include five-membered nitrogen containing heterocyclic compounds as ligands for metal ions which have catalytic activity. The catalysts are used to electrolessly plate metal on metal clad and un-clad substrates.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: June 14, 2016
    Inventors: Kristen M. Milum, Donald E. Cleary, Maria Anna Rzeznik
  • Stable catalysts for electroless metallization
    Patent number: 9353443
    Abstract: Catalysts include nanoparticles of catalytic metal and gallic acid or gallic acid derivatives or salts thereof. The catalysts are used in electroless metal plating. The catalysts are free of tin.
    Type: Grant
    Filed: August 17, 2012
    Date of Patent: May 31, 2016
    Inventors: Kristen M. Milum, Donald E. Cleary, Maria Anna Rzeznik
  • CATALYSTS FOR ELECTROLESS METALLIZATION CONTAINING FIVE-MEMBERED HETEROCYCLIC NITROGEN COMPOUNDS
    Publication number: 20160038925
    Abstract: Catalysts include five-membered nitrogen containing heterocyclic compounds as ligands for metal ions which have catalytic activity. The catalysts are used to electrolessly plate metal on metal clad and un-clad substrates.
    Type: Application
    Filed: October 23, 2015
    Publication date: February 11, 2016
    Inventors: Kristen M. Milum, Donald E. Cleary, Maria A. Rzeznik
  • Metal plating compositions and methods
    Patent number: 8956523
    Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.
    Type: Grant
    Filed: September 16, 2012
    Date of Patent: February 17, 2015
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo U. Desmaison, Zukra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
  • Plating method
    Patent number: 8945362
    Abstract: Methods for depositing a metal or metal alloy on a substrate and articles made with the methods are described. The metal or metal alloy is deposited on the substrate electrolytically. The current is periodically interrupted during deposition to improve throwing power and reduce nodule formation on the metal or metal alloy deposit.
    Type: Grant
    Filed: January 12, 2009
    Date of Patent: February 3, 2015
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Jacek M. Knop, John G. Carter, Donald E. Cleary
  • CATALYSTS FOR ELECTROLESS METALLIZATION CONTAINING IMINODIACETIC ACID AND DERIVATIVES
    Publication number: 20150024123
    Abstract: Catalysts include iminodiacetic acid and derivatives thereof as ligands for metal ions which have catalytic activity. The catalysts may be used to electrolessly plate metal on metal clad and un-clad substrates.
    Type: Application
    Filed: July 16, 2013
    Publication date: January 22, 2015
    Inventors: Kristen M. MILUM, Donald E. CLEARY, Maria Anna RZEZNIK
  • CATALYSTS FOR ELECTROLESS METALLIZATION CONTAINING FIVE-MEMBERED HETEROCYCLIC NITROGEN COMPOUNDS
    Publication number: 20150004323
    Abstract: Catalysts include five-membered nitrogen containing heterocyclic compounds as ligands for metal ions which have catalytic activity. The catalysts are used to electrolessly plate metal on metal clad and un-clad substrates.
    Type: Application
    Filed: June 28, 2013
    Publication date: January 1, 2015
    Inventors: Kristen M. MILUM, Donald E. CLEARY, Maria Anna RZEZNIK
  • METAL PLATING COMPOSITIONS AND METHODS
    Publication number: 20140081045
    Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.
    Type: Application
    Filed: September 16, 2012
    Publication date: March 20, 2014
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo Urrutia Desmaison, Zukra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
  • STABLE CATALYSTS FOR ELECTROLESS METALLIZATION
    Publication number: 20130230657
    Abstract: Catalysts include nanoparticles of catalytic metal and gallic acid or gallic acid derivatives or salts thereof. The catalysts are used in electroless metal plating. The catalysts are free of tin.
    Type: Application
    Filed: August 17, 2012
    Publication date: September 5, 2013
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Kristen M. Milum, Donald E. Cleary, Maria Anna Rzeznik
  • Metal plating compositions
    Patent number: 8337688
    Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.
    Type: Grant
    Filed: August 15, 2011
    Date of Patent: December 25, 2012
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo U. Desmaison, Zukra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre