Abstract: A material polishing device for substantially dry polishing of flat items, such as rock slabs, mineral samples, geode sections, and the like, includes a support structure having a drive means mounted thereon for rotating a circular, planar table having a polishing member mounted on the table and rotatable therewith. A plurality of standards are mounted on the support structure and support thereon material holding means for retaining the flat items or material to be polished in engagement with the polishing member.