Abstract: Methods for cleaning a side edge of a thin film photovoltaic substrate are provided. A cleaning solution can be applied to a cleaning wheel that has a cleaning surface and is rotatable about an axis. The substrate can then be transported in a machine direction to move the substrate past the cleaning wheel such that the cleaning surface of the cleaning wheel contacts the side edge of the substrate allowing the cleaning solution to remove any thin film present on the side edge of the substrate. Apparatus is also generally provided for cleaning a side edge of a thin film photovoltaic substrate.

Abstract: A lamp comprising a light-transmissive envelope, the inner surface of which is only partially coated by a reflective barrier coating layer such that an aperture is created in the coating for light emission, the lamp exhibiting asymmetric light output through the aperture and lumens substantially equivalent to a lamp wherein the envelope inner surface is completely coated with a reflective barrier coating layer having no aperture, and a laser ablation process for creating the reflective barrier coating layer aperture.

Abstract: A solar cell comprising at least one electrode having a plurality of fingers. Specifically, an electrode comprising a planar surface and a plurality of fingers extending therefrom is provided. A second electrode is provided. The second electrode comprises a planar surface and may comprise a plurality of fingers which are interdigitated with the fingers of the first electrode. The second electrode provides a catalyst material for the electron transfer to an oxidant during the photovoltaic process. A semiconductor material is disposed between the electrodes. The semiconductor material is saturated with dye and injected with an electrolyte solution. The fingers are arranged to provide a reduced migration path for the oxidant through the electrolyte and for the electrons through the semiconductor material when exposed to incident light.

Abstract: A solar cell having a plurality of micro-channels. Specifically, a plurality of micro-channels are formed in a semiconductor material that has been disposed on the surface of a planar electrode. The semiconductor material is saturated with dye and injected with an electrolyte solution. The micro-channels are insulated and filled with a material that provides a catalyst material for the electron transfer to an oxidant during the photovoltaic process. The catalyst disposed in the micro-channels forms the upper electrode of the solar cell. The micro-channels are arranged to provide a reduced migration path for the oxidant.

Abstract: Large, light-weight organic devices and methods of preparing large, light-weight organic devices. Specifically, flexible and rigid light-weight plastics are implemented. The flexible plastic may be disposed from a reel. A metal grid is fabricated on the flexible plastic to provide current conduction over the large area. A transparent oxide layer is provided over the metal grid to form the bottom electrode of the organic device. A light emitting or light gathering organic layer is disposed on the transparent oxide layer. A second electrode is disposed over the organic layer. Electrodes are coupled to the metal grid and the second electrode to provide electrical current to or from the organic layer. Depending on the type of materials used for the organic layer, the organic device may comprise an area light device or a photovoltaic device.

Abstract: Large, light-weight organic devices and methods of preparing large, light-weight organic devices. Specifically, flexible and rigid light-weight plastics are implemented. The flexible plastic may be disposed from a reel. A metal grid is fabricated on the flexible plastic to provide current conduction over the large area. A transparent oxide layer is provided over the metal grid to form the bottom electrode of the organic device. A light emitting or light gathering organic layer is disposed on the transparent oxide layer. A second electrode is disposed over the organic layer. Electrodes are coupled to the metal grid and the second electrode to provide electrical current to or from the organic layer. Depending on the type of materials used for the organic layer, the organic device may comprise an area light device or a photovoltaic device.

Abstract: A solar cell comprising at least one electrode having a plurality of fingers. Specifically, an electrode comprising a planar surface and a plurality of fingers extending therefrom is provided. A second electrode is provided. The second electrode comprises a planar surface and may comprise a plurality of fingers which are interdigitated with the fingers of the first electrode. The second electrode provides a catalyst material for the electron transfer to an oxidant during the photovoltaic process. A semiconductor material is disposed between the electrodes. The semiconductor material is saturated with dye and injected with an electrolyte solution. The fingers are arranged to provide a reduced migration path for the oxidant through the electrolyte and for the electrons through the semiconductor material when exposed to incident light.

Abstract: A solar cell having a plurality of micro-channels. Specifically, a plurality of micro-channels are formed in a semiconductor material that has been disposed on the surface of a planar electrode. The semiconductor material is saturated with dye and injected with an electrolyte solution. The micro-channels are insulated and filled with a material that provides a catalyst material for the electron transfer to an oxidant during the photovoltaic process. The catalyst disposed in the micro-channels forms the upper electrode of the solar cell. The micro-channels are arranged to provide a reduced migration path for the oxidant.

Abstract: A method of removing iodine from an environment which had been previously treated with a composition containing iodine and an iodide salt is disclosed. The method involves the addition to the environment of at least one reagent which is a metal sulfite salt or a hydroxide-producing compound, in an amount sufficient to water-solubilize substantially all of the iodine, followed by recovery of the iodine. This technique is particularly useful for recovering iodine from extractant solutions used in the removal of mercury from contaminated materials.

Abstract: Increases in surface resistivity of electroless nickel coatings on polycarbonate-containing substrates are inhibited by employing two electroless nickel plating solutions. The first solution is one which deposits a metal layer containing phosphorus, if any, in an amount up to 5% by weight and is used to deposit a layer at least 0.5 micron thick. The second solution is one which deposits a layer containing phosphorus in the amount of at least 5% and preferably at least 6% by weight. Another metal layer may be interposed between the two nickel layers.

Abstract: Disclosed herein is an improved method for measuring the presence and amount of a variety of metals contained in a sample. In the first step, all of the various forms of each metal are converted to a soluble metallic complex which is capable of being electrochemically reduced. Voltammetry is then used to determine the stripping current or charge characteristic of each metallic complex. Finally, the concentration of each metal can be calculated by insertion of the stripping current or charge value into an equation which correlates peak current or charge values with metal concentration.The metals which can be detected and quantified by using this method are gold, silver, bismuth, cadmium, thallium, and mercury.

Abstract: Mercury and mercury-containing compounds can be removed from soil, sand, and similar materials by a remediation method in which the contaminated material is treated with an aqueous composition comprising an oxidant, such as iodine, and a complexing or solubilizing agent, such as potassium iodide, the liquid and solid phases are separated, and further processed as needed.

Abstract: Method of modifying a polycarbonate surface to improve adhesion of a metal layer thereon and to the articles produced therefrom. The surface is first rendered hydrophilic by an exposure to actinic light such as ultraviolet light. The surface is then impregnated with a diffuser such as hydrochloric acid. The surface after impregnation is etched with a base such as potassium hydroxide and cleaned by oxidizing it with a solution of an oxidizing agent such as potassium permanganate. The cleaned surface is then neutralized by contacting it with a mild reducing agent. The chemically and physically modified surface is electrolessly plated with a primary metal layer. A secondary metal layer is then electrolessly or electrolytically applied on top of the primary metal layer until a metal layer of a desired thickness is attained.

Abstract: A method for the preparation a photo-mask used for photo-imaging selected areas on the surfaces of a three-dimensional printed circuit board substrate. The photo-mask comprises a membrane transparent and degradation resistant to UV light, having at least one side with a contoured shape conforming, and flexible enough to comply with surface irregularities on the surfaces of the three-dimensional substrate being photo-imaged. A pattern of tracks opaque to UV light is posiitoned along the contoured shape of the membrane. The pattern of tracks on the photo-mask is in accordance with a desired conductive metal trace pattern on the surfaces of the three-dimensional printed circuit board substrate. The photo-mask is prepared by photo-imaging and then depositing a track material on a film that conformed to the surfaces of the three-dimensional substrate. An adhesive layer applied over the film cements a membrane material poured upon the adhesive layer.

Abstract: A metal mold core which is partially insulated includes a metal continuous hard skin layer over the core and over the insulation to avoid discontinuity caused delamination in the presence of flowing injected plastic. The skin layer includes abrasion resistant nickel deposited over electroytically and electrolessly deposited copper applied over an interface metal layer on the core. The insulation layer includes multiple layers of a polyimide resin one of which layers includes glass micro spheres for decreasing the thermal conductivity to increase its insulation property and for decreasing the coefficient of thermal expansion (CTE) of the insulation to more closely match the core CTE to further preclude delamination in the presence of temperature excursions.

Abstract: The method is provided for treating the surface of a polyetherimide substrate to improve its adhesion characteristics for electrolessly deposited metal, such as copper. There is employed a series of surface treatments including the initial immersion of the polyetherimide substrate in sulfuric acid, contact with aqueous base, such as potassium hydroxide, followed by oxidation with an alkali metal permanganate such as potassium permanganate, and surface treatment with a reducing agent, such as a hydroxylamine salt. Polyetherimide metal composites are also provided.

Abstract: A polyimide surface is pretreated in preparation for an adhesion promotion treatment and subsequent metallization on the surface, wherein the pretreatment comprises the steps of:(A) contacting the polyimide surface with an aqueous solution of nitric acid having a concentration of about 35 to about 70% by weight or an aqueous solution of hydrochloric acid having a concentration of about 10 to about 38% by weight;(B) rinsing the acid-treated polyimide surface with water so as to substantially remove the acid from the surface of the polyimide;(C) contacting the rinsed polyimide surface with a mild etching agent, resulting in the formation of a residual film on the polyimide surface;(D) contacting the etched polyimide surface with a basic solution, and(E) removing the residual film formed on the surface of the polyimide after contact with the mild etching agent in step (C).

Abstract: A method for removing residual precious metal catalyst from a plastic, metal-plated surface is disclosed. The method involves the oxidation of the precious metal without degrading the plated metal or the plastic, followed by washing away the oxidized precious metal. This invention further includes methods for the plating of metal directly on the surface of a plastic substrate.

Abstract: An improved method for pretreating a polyimide surface in preparation for an adhesion promotion treatment and subsequent metallization is disclosed, wherein the pretreatment comprises mild etching of the surface, contact of the surface with a basic solution, and contact of the surface with a cationic surfactant which is capable of removing a residual film formed on the surface after the mild etching step. This invention further includes articles such as printed circuit boards, which comprise a polyimide substrate pretreated as described above and then treated with an adhesion promoter, wherein an electrolessly-applied metal layer is disposed on the substrate, and an electrolytically-applied metal layer free of chemical additives is disposed on the electrolessly-applied layer. The article may include an additional electrolytically-applied layer containing chemical additives and disposed on top of the first electrolytic layer.

Abstract: A method for treating a polyimide surface is disclosed, in which an adhesion-promoting compound such as thiourea contacts the surface prior to the electroless plating of metal thereon. Articles formed by such a method are also disclosed.