Patents by Inventor Donald L. Conaway

Donald L. Conaway has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9757788
    Abstract: A metal part is hot formed by placing a metal part blank on a forming tool and installing a fabric cover over the forming tool, overlying the metal part blank. The fabric is at least partially wrapped around the metal part blank. The metal part blank is heated to a temperature sufficient to allow forming of the metal part blank. Forming pressure is applied to the metal part blank that conforms the metal part blank to the forming tool by tensioning the fabric.
    Type: Grant
    Filed: May 7, 2015
    Date of Patent: September 12, 2017
    Assignee: THE BOEING COMPANY
    Inventors: David Howard Gane, Donald L. Conaway, Duane Michael Hill, Lonny D. Walz, Justin Michael Poirier, Anthony David Martinez, Jeffrey N. Repsumer
  • Publication number: 20160325331
    Abstract: A metal part is hot formed by placing a metal part blank on a forming tool and installing a fabric cover over the forming tool, overlying the metal part blank. The fabric is at least partially wrapped around the metal part blank. The metal part blank is heated to a temperature sufficient to allow forming of the metal part blank. Forming pressure is applied to the metal part blank that conforms the metal part blank to the forming tool by tensioning the fabric.
    Type: Application
    Filed: May 7, 2015
    Publication date: November 10, 2016
    Inventors: David Howard Gane, Donald L. Conaway, Duane Michael Hill, Lonny D. Walz, Justin Michael Poirier, Anthony David Martinez, Jeffrey N. Repsumer
  • Patent number: 6560843
    Abstract: The present invention relates to an index/seal pin indexed precisely in a resin transfer molding die to assure the desired resin-to-fiber ratio in the mold part, and, thereby, to produce reliably and consistently a part of minimum weight with adequate strength. The index/seal pin seals via replaceable O-rings on the threaded stem of the pin to prevent low viscosity resin from exiting a mold cavity and invading the threads, bolts, pins, or other elements of the internal mandrel. The pin also assures accurate positioning of a mandrel in the die cavity while it allows the entire inner mandrel to be enclosed and sealed within the mold cavity, simplifying the sealing system.
    Type: Grant
    Filed: October 8, 2001
    Date of Patent: May 13, 2003
    Assignee: The Boeing Company
    Inventors: Thomas R. Cundiff, Scott A. Miller, Donald L. Conaway
  • Patent number: 6561478
    Abstract: The present invention relates to a seal pin indexed precisely in a resin transfer molding die to assure the desired resin-to-fiber ratio in the mold part, and, thereby, to produce reliably and consistently a part of minimum weight with adequate strength. The index/resin seal pin of the present invention for RTM mold dies is novel in that it provides the seal (via replaceable O-rings) on the threaded stem of the pin to prevent low viscosity resin from invading the threads, bolts pins, or other elements of the internal mandrel. The pin allows the entire inner mandrel to be enclosed and sealed within the mold cavity, simplifying the sealing system. The invention also relates to a method for using the seal pin in a resin transfer molding process.
    Type: Grant
    Filed: October 8, 2001
    Date of Patent: May 13, 2003
    Assignee: The Boeing Company
    Inventors: Thomas R. Cundiff, Scott A. Miller, Donald L. Conaway
  • Publication number: 20020027310
    Abstract: The present invention relates to a seal pin indexed precisely in a resin transfer molding die to assure the desired resin-to-fiber ratio in the mold part, and, thereby, to produce reliably and consistently a part of minimum weight with adequate strength. The index/resin seal pin of the present invention for RTM mold dies is novel in that it provides the seal (via replaceable O-rings) on the threaded stem of the pin to prevent low viscosity resin from invading the threads, bolts pins, or other elements of the internal mandrel. The pin allows the entire inner mandrel to be enclosed and sealed within the mold cavity, simplifying the sealing system. The invention also relates to a method for using the seal pin in a resin transfer molding process.
    Type: Application
    Filed: October 8, 2001
    Publication date: March 7, 2002
    Inventors: Thomas R. Cundiff, Scott A. Miller, Donald L. Conaway
  • Publication number: 20020015754
    Abstract: The present invention relates to a seal pin indexed precisely in a resin transfer molding die to assure the desired resin-to-fiber ratio in the mold part, and, thereby, to produce reliably and consistently a part of minimum weight with adequate strength. The index/resin seal pin of the present invention for RTM mold dies is novel in that it provides the seal (via replaceable O-rings) on the threaded stem of the pin to prevent low viscosity resin from invading the threads, bolts pins, or other elements of the internal mandrel. The pin allows the entire inner mandrel to be enclosed and sealed within the mold cavity, simplifying the sealing system. The invention also relates to a method for using the seal pin in a resin transfer molding process.
    Type: Application
    Filed: October 8, 2001
    Publication date: February 7, 2002
    Inventors: Thomas R. Cundiff, Scott A. Miller, Donald L. Conaway
  • Patent number: 6319447
    Abstract: The present invention relates to a seal pin indexed precisely in a resin transfer molding die to assure the desired resin-to-fiber ratio in the mold part, and, thereby, to produce reliably and consistently a part of minimum weight with adequate strength. The index/resin seal pin of the present invention for RTM mold dies is novel in that it provides the seal (via replaceable O-rings) on the threaded stem of the pin to prevent low viscosity resin from invading the threads, bolts pins, or other elements of the internal mandrel. The pin allows the entire inner mandrel to be enclosed and sealed within the mold cavity, simplifying the sealing system. The invention also relates to a method for using the seal pin in a resin transfer molding process.
    Type: Grant
    Filed: April 6, 2000
    Date of Patent: November 20, 2001
    Assignee: The Boeing Company
    Inventors: Thomas R. Cundiff, Scott A. Miller, Donald L. Conaway