Abstract: A heat sink connector pin includes a pin assembly with linkage that provides the movement of a pin head or cap in a downward movement to cause multiple movable fingers at an opposing end of the pin to mechanically move from a retracted position that allows insertion of the heat sink connector pin through an opening in the substrate, such as a through-hole, to move to an outward extended position so that the multiple fingers engage or grasp a bottom surface of the substrate. In one example, the movable fingers are rotatably connected to share a same rotational axis with each other. In one example, the pin assembly includes a sleeve adapted to receive the shaft structure and is adapted to engage with the pin head. The sleeve includes a substrate stop surface adapted to contact a top surface of the substrate during insertion of the pin through the substrate.

Abstract: A heat sink connector pin includes a pin assembly with linkage that provides the movement of a pin head or cap in a downward movement to cause multiple movable fingers at an opposing end of the pin to mechanically move from a retracted position that allows insertion of the heat sink connector pin through an opening in the substrate, such as a through-hole, to move to an outward extended position so that the multiple fingers engage or grasp a bottom surface of the substrate. In one example, the movable fingers are rotatably connected to share a same rotational axis with each other. In one example, the pin assembly includes a sleeve adapted to receive the shaft structure and is adapted to engage with the pin head. The sleeve includes a substrate stop surface adapted to contact a top surface of the substrate during insertion of the pin through the substrate.

Abstract: Various box embodiments are disclosed. In one aspect, a box is provided that includes a container. The container has a bottom panel, a front panel, a first side panel, a second side panel, a back panel, a first reinforcement structure adjacent the back panel and the first side panel and a second reinforcement structure adjacent the back panel and the second side panel. The first and second reinforcement structures reinforce the back panel against compressive forces. A lid is coupled to the container.

Abstract: An apparatus for testing an electrical device which includes fuses has a resilient, compressive, insulating base amounted to the underside of a thermal head. A plurality of conductive elements are mounted to the base in parallel relation. A number of these conductive elements are caused to be brought into contact with and bridge a fuse of the device when the thermal head is brought in dose proximity to the device. The conductive elements cause the fuse to be bridged, so that connection is provided between one side of the fuse and the other.

Abstract: In order to simplify the process of preparing and packaging of semiconductor chips and the like type of items for transport to customers who use the items in the production of larger devices such as computers and the like, the items are placed in the trays. An o-ring or the like type of gasket is disposed between each of the trays (wherein the upper tray acts as lid for the lower one). This resilient member has a predetermined shape/configuration which maintains a gap or non-sealing condition between the trays sufficient to permit moisture to escape from the trays during baking in an oven. When the interiors of the trays are desiccated, the upper tray is strapped down on the lower tray or trays, with sufficient force as to be deform the gasket to the degree that a hermetic seal is produced at each interface. Stacks of trays can be baked, desiccated, cooled in a dry/desiccated atmosphere, and then strapped together to cause each container to become hermetically sealed.

Abstract: A JEDEC-compatible universal shipping tray is provided for transporting packaged semiconductor devices. Embodiments include a tray having an array of hollow short pedestals that are commonly connected to a manifold, such as a sealed chamber. A flexible membrane, such as a polymer sheet, is placed over the top ends of the pedestals, then holes are punched in the membrane, as with a needle, to expose the top ends of selected pedestals. Packages to be shipped in the tray are placed over the exposed top ends of the pedestals, and a vacuum is drawn through a manifold vacuum valve to hold the packages to the pedestals against the membrane. Since the internal configuration of the tray of the present invention is not customized to fit a particular package, packages of different sizes and shapes can be shipped using a tray of the same design. Furthermore, partially filled trays can be shipped simply by leaving the membrane unpierced at the ends of pedestals that are not needed to support packages.

Abstract: Apparatus is illustrated for converting nonlinear or compressed digital information representative of an analog signal from a plurality of sources into a single composite digital signal. As specifically used and illustrated, a plurality of digital voice signals are summed to produce a new digital nonlinear signal representative of a combination of original voice signals for transmittal to each of the conferees in a conference call. This is accomplished without reverting to analog signals during the combination process.