Abstract: The invention provides a real-time method and computer-implemented system of monitoring animal health comprising sensing at least one physical characteristic by means of an active physical sensor attached to the animal, and sensing at least one activity of the animal by means of an activity sensor attached to the animal; positioning an active activity signal generator in the environment, such that the activity signal generator is associated with an activity, gathering physical characteristic data and activity data, and wirelessly transmitting all such data to a network receiver/converter, in real-time; converting all such data if necessary, and transmitting all such data over a computer network to one or more users, in real-time.

Abstract: The semiconductor package includes two electrical contacts and a semiconductor device coupled to opposing sides of a substrate. The substrate defines at least one via extending at least partially there through. The semiconductor device includes a semiconductor low-speed interface electrically coupled to one of the electrical contacts through the via, and a semiconductor high-speed interface electrically coupled to flexible tape. The flexible tape is also electrically coupled to the other one of the electrical contacts.

Abstract: The semiconductor module includes a circuit board substrate, multiple semiconductor devices, a layer of thermal interface material, a heat spreader, and a heat spreader clamping mechanism. Each semiconductor device has a semiconductor first side coupled to the substrate, and a semiconductor second side opposing the semiconductor first side. The thermal interface material has a thermal interface material first side at least partially covering the semiconductor second side, and a thermal interface material second side opposing the thermal interface material first side. The heat spreader has a heat spreader first side contacting the thermal interface material second side, and a heat spreader second side opposing the heat spreader first side. The heat spreader clamping mechanism includes at least one clamp coupled to the heat spreader.

Abstract: The system includes a circuit board, a semiconductor module, a heat dissipator, and at least one thermal via. The circuit board has substantially flat opposing first and second sides. The semiconductor module includes multiple semiconductor devices. The semiconductor module is oriented substantially parallel to the circuit board near the first side, while the heat dissipator is disposed near the second side. The thermal via extends through the circuit board to thermally couple the semiconductor module to the heat dissipator, which may be a heat spreader, heat sink, cooling fan, or heat pipe.

Abstract: An integrated circuit cover incorporating a spring portion is described. The spring portion may include any structure that allows displacement between a plate portion of the integrated circuit cover and an attachment portion of the integrated circuit cover and that provides a substantially equalizing effect of pressure on the plate portion. The spring portion is preferably more flexible than the plate portion. The integrated circuit cover accommodates variations in the mounted height of integrated circuits over which the integrated circuit cover is installed. The integrated circuit cover may be formed as a unitary structure or may be constructed as an assembly of multiple components.