Patents by Inventor Donald P. Varner

Donald P. Varner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Barrier metallization in ceramic substrate for implantable medical devices
    Patent number: 6284080
    Abstract: The present invention relates to multi-layer ceramic packaging of hybrid micro-electronic devices, including those for implantable medical devices. The invention permits size reduction and design simplification in such packaging by eliminating the need for electrolytic or electroless plating, and by eliminating or substantially eliminating the shrinkage variation typically associated with surface metallization techniques.
    Type: Grant
    Filed: July 26, 2000
    Date of Patent: September 4, 2001
    Assignee: Medtronic, Inc.
    Inventors: Samuel F. Haq, Patrick F. Malone, Donald P. Varner
  • Barrier metallization in ceramic substrate for implantable medical devices
    Patent number: 6146743
    Abstract: The present invention relates to multi-layer ceramic packaging of hybrid micro-electronic devices, including those for implantable medical devices. The invention permits size reduction and design simplification in such packaging by eliminating the need for electrolytic or electroless plating, and by eliminating or substantially eliminating the shrinkage variation typically associated with surface metallization techniques.
    Type: Grant
    Filed: March 31, 1999
    Date of Patent: November 14, 2000
    Assignee: Medtronic, Inc.
    Inventors: Samuel F. Haq, Patrick F. Malone, Donald P. Varner
  • Method of making ceramic substrate
    Patent number: 6041496
    Abstract: The present invention relates to multi-layer ceramic packaging of hybrid micro-electronic devices, including those for implantable medical devices. The invention permits size reduction and design simplification in such packaging by eliminating the need for electrolytic or electroless plating, and by eliminating or substantially eliminating the shrinkage variation typically associated with surface metallization techniques.
    Type: Grant
    Filed: February 11, 1998
    Date of Patent: March 28, 2000
    Assignee: Medtronic, Inc.
    Inventors: Samuel F. Haq, Patrick F. Malone, John H. Fortney, Donald P. Varner
  • Ceramic substrate for implantable medical devices
    Patent number: 5855995
    Abstract: The present invention relates to multi-layer ceramic packaging of hybrid micro-electronic devices, including those for implantable medical devices. The invention permits size reduction and design simplification in such packaging by eliminating the need for electrolytic or electroless plating, and by eliminating or substantially eliminating the shrinkage variation typically associated with surface metallization techniques.
    Type: Grant
    Filed: April 28, 1997
    Date of Patent: January 5, 1999
    Assignee: Medtronic, Inc.
    Inventors: Samuel F. Haq, Patrick F. Malone, John H. Fortney, Donald P. Varner