Patents by Inventor Donald T. Campbell

Donald T. Campbell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of bumping substrates by contained paste deposition
    Patent number: 5880017
    Abstract: A solder bump is stenciled onto a substrate, providing bumped substrate at pitches below 400 microns. The solder is applied through stencil/mask and paste method; the mask, however, remains attached to the substrate during reflow. Pitches of greater than 400 microns may also be obtained through the invention. The invention further provides for generation of uniform, controllable volume metal balls.
    Type: Grant
    Filed: August 25, 1997
    Date of Patent: March 9, 1999
    Assignee: Hewlett-Packard Co.
    Inventors: Matthew K. Schwiebert, Donald T. Campbell, Matthew Heydinger, Robert E. Kraft, Hubert A. Vander Plas
  • Method of making solder balls by contained paste deposition
    Patent number: 5672542
    Abstract: A solder bump is stenciled onto a substrate, providing bumped substrate at pitches below 400 microns. The solder is applied through stencil/mask and paste method; the mask, however, remains attached to the substrate during reflow. Pitches of greater than 400 microns may also be obtained through the invention. The invention further provides for generation of uniform, controllable volume metal balls.
    Type: Grant
    Filed: March 19, 1996
    Date of Patent: September 30, 1997
    Assignee: Hewlett Packard Company
    Inventors: Matthew K. Schwiebert, Donald T. Campbell, Matthew Heydinger, Robert E. Kraft, Hubert A. Vander Plas
  • Method of making solder balls by contained paste deposition
    Patent number: 5586715
    Abstract: A solder bump is stenciled onto a substrate, providing bumped substrate at pitches below 400 microns. The solder is applied through stencil/mask and paste method; the mask, however, remains attached to the substrate during reflow. Pitches of greater than 400 microns may also be obtained through the invention. The invention further provides for generation of uniform, controllable volume metal balls.
    Type: Grant
    Filed: March 19, 1996
    Date of Patent: December 24, 1996
    Assignee: Hewlett-Packard Company
    Inventors: Matthew K. Schwiebert, Donald T. Campbell, Matthew Heydinger, Robert E. Kraft, Hubert A. Vander Plas
  • Method of bumping substrates by contained paste deposition
    Patent number: 5539153
    Abstract: A solder bump is stenciled into a substrate, providing bumped substrate at pitches below 400 microns. The solder is applied through stencil/mask and paste method; the mask, however, remains attached to the substrate during reflow. Pitches of greater than 400 microns may also be obtained through the invention.
    Type: Grant
    Filed: August 8, 1994
    Date of Patent: July 23, 1996
    Assignee: Hewlett-Packard Company
    Inventors: Matthew K. Schwiebert, Donald T. Campbell, Matthew Heydinger, Robert E. Kraft, Hubert A. Vander Plas