Patents by Inventor Donald W. Baudrand

Donald W. Baudrand has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate
    Patent number: 5565235
    Abstract: A process for simultaneously selectively depositing a high purity nickel containing alloy (i.e. a nickel-boron alloy having a nickel content in excess of 99.5 percent) over a preformed metallurgy pattern (including the individual, electrically isolated contact pads and the seal band area thereon) on the top-side dielectric surface of a multi-layer ceramic module. The metallurgy pattern on such top-side surface of such module is appropriately catalyzed and then immersed in a bath which is essentially lead-free and which includes a source of nickel ions, a borane reducing agent, and an effective amount of an organic divalent sulfur compound, preferably thiodiglycollic acid.
    Type: Grant
    Filed: March 30, 1995
    Date of Patent: October 15, 1996
    Inventors: Donald W. Baudrand, Rebecca P. Fleming, John J. Gniewek, Joseph M. Harvilchuck, Arnold F. Schmeckenbecher
  • Process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate and products produced thereby
    Patent number: 5403650
    Abstract: A process for simultaneously selectively depositing a high purity nickel containing alloy (i.e. a nickel-boron alloy having a nickel content in excess of 99.5 percent) over a preformed metallurgy pattern (including the individual, electrically isolated contact pads and the seal band area thereon) on the top-side dielectric surface of a multi-layer ceramic module. The metallurgy pattern on such top-side surface of such module is appropriately catalyzed and then immersed in a bath which is essentially lead-free and which includes a source of nickel ions, a borane reducing agent, and an effective amount of an organic divalent sulfur compound, preferably thiodiglycollic acid.
    Type: Grant
    Filed: August 18, 1993
    Date of Patent: April 4, 1995
    Inventors: Donald W. Baudrand, Rebecca P. Fleming, John J. Gniewek, Joseph M. Harvilchuck, Arnold F. Schmeckenbecher
  • Electrical contact materials
    Patent number: 4503131
    Abstract: Electrical contact materials are provided which belong to the general category of copper that is overplated with a noble metal, usually gold. The improvement resides in the provision of an electroless nickel deposit laid down over the copper layer and under the gold layer, which electroless nickel deposit is laid down from a particular class of nickel-boron or nickel-phosphorus baths.
    Type: Grant
    Filed: January 18, 1982
    Date of Patent: March 5, 1985
    Assignee: Richardson Chemical Company
    Inventor: Donald W. Baudrand