Abstract: A heat dissipation device includes a primary heat sink (10) contacting a central processing unit and a secondary heat sink (20) attached on heat-generating electronic components adjacent the central processing unit. The primary heat sink includes a base (12) and a heat-dissipation portion (14) disposed on a middle of the base. The secondary heat sink includes a substrate (22) and a plurality of fin assemblies (24) arranged on the substrate. The base is laid on the substrate with the fin assemblies arranged around the heat-dissipation portion. The primary heat sink is partly superposed on the secondary heat sink with a compact structure. The heat-dissipation portion can simultaneously dissipate heat from the central processing unit and its adjacent heat-generating electronic components.

Abstract: A heat dissipation device includes a primary heat sink (10) contacting a central processing unit and a secondary heat sink (20) attached on heat-generating electronic components adjacent the central processing unit. The primary heat sink includes a base (12) and a heat-dissipation portion (14) disposed on a middle of the base. The secondary heat sink includes a substrate (22) and a plurality of fin assemblies (24) arranged on the substrate. The base is laid on the substrate with the fin assemblies arranged around the heat-dissipation portion. The primary heat sink is partly superposed on the secondary heat sink with a compact structure. The heat-dissipation portion can simultaneously dissipate heat from the central processing unit and its adjacent heat-generating electronic components.

Abstract: A heat dissipation device is for contacting with a heat generating electronic device to remove heat from the electronic device. The heat dissipation device includes a base, a plurality of fins arranged on the base and at least one heat pipe thermally positioned on the base. The heat pipe includes a U-shaped first portion, a second portion and a connecting portion interconnecting the first and second portions. The first portion of the heat pipe thermally engages the base. The second portion of the heat pipe is located above the base, and thermally engages with the plurality of fins.