Patents by Inventor Dong-Hak Bae

Dong-Hak Bae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Epoxy-modified encapsulation composition
    Patent number: 5140075
    Abstract: Epoxy-grafted, low molecular weight amorphous polymer compositions are employed in pourable, liquid telecommunication cable encapsulation compositions. Also disclosed is a method for encapsulating telecommunication cables as well as cables encapsulated with such an epoxy-grafted liquid encapsulant.
    Type: Grant
    Filed: January 18, 1990
    Date of Patent: August 18, 1992
    Assignee: Uniroyal Chemical Company, Inc.
    Inventors: Richard F. Tomko, Revati Ranganathan, William D. Sigworth, Dong-Hak Bae
  • Epoxy-modified encapsulation composition
    Patent number: 5128086
    Abstract: Epoxy-grafted, low molecular weight amorphous polymer compositions are employed in pourable, liquid telecommunication cable encapsulation compositions. Also disclosed is a method for encapsulating telecommunication cables as well as cables encapsulated with such an epoxy-grafted liquid encapsulant.
    Type: Grant
    Filed: August 15, 1988
    Date of Patent: July 7, 1992
    Assignee: Uniroyal Chemical Company, Inc.
    Inventors: Richard F. Tomko, Revati Ranganathan, William D. Sigworth, Dong-Hak Bae
  • Cable containing epoxy-modified encapsulation composition
    Patent number: 4787703
    Abstract: Epoxy-grafted, low molecular weight amorphous polymer compositions are employed in pourable, liquid telecommunication cable encapsulation compositions. Also disclosed is a method for encapsulating telecommunication cables as well as cables encapsulated with such an epoxy-grafted liquid encapsulant.
    Type: Grant
    Filed: June 4, 1987
    Date of Patent: November 29, 1988
    Assignee: Uniroyal Chemical Company, Inc.
    Inventors: Richard F. Tomko, Revati Ranganathan, William D. Sigworth, Dong-Hak Bae
  • Moisture-curable halosilane-substituted polymer composition
    Patent number: 4767814
    Abstract: Amorphous moisture-curable, halosilane-substituted polymers having a saturated carbon backbone and a viscosity average molecular weight of between about 500 and about 20,000 provide desirable protection for weatherable substrates upon curing. Also disclosed are coating compositions containing such halosilane-substituted polymers; a method of protecting weatherable substrates employing such compositions; and composites produced by the method disclosed herein.
    Type: Grant
    Filed: September 11, 1986
    Date of Patent: August 30, 1988
    Assignee: Uniroyal Chemical Company, Inc.
    Inventors: Dong-Hak Bae, William D. Sigworth, William Cummings