Patents by Inventor Dong-Ho Ryu
Dong-Ho Ryu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240162113Abstract: In one example, an electronic device comprises a substrate comprising a conductive structure and an inner side and an outer side, a first electronic component over the inner side of the substrate and coupled with the conductive structure, a lid over the substrate and the first electronic component and comprising a first hole in the lid, and a thermal interface material between the first electronic component and the lid. The thermal interface material is in the first hole. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: November 11, 2022Publication date: May 16, 2024Applicants: Amkor Technology Singapore Holding Pte. Ltd., Amkor Technology Singapore Holding Pte. Ltd.Inventors: Dong Hyeon Park, Yun Ah Kim, Seok Ho Na, Won Ho Choi, Dong Su Ryu, Jo Hyun Bae, Min Jae Kong, Jin Young Khim, Jae Yeong Bae, Dong Hee Kang
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Publication number: 20240069629Abstract: A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.Type: ApplicationFiled: August 28, 2023Publication date: February 29, 2024Inventors: Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Dong Soo Ryu, Choong Hoe Kim
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Publication number: 20240065676Abstract: The present disclosure relates to an apparatus for controlling movement of an ultrasonic wave generating unit, the apparatus characterized by comprising: a transfer unit for moving the ultrasonic wave generating unit; and a control unit for controlling the operation of the ultrasonic wave generating unit and the transfer unit, wherein the control unit controls the ultrasonic wave generating unit such that, when the ultrasonic wave generating unit moves, ultrasonic waves are irradiated at intervals to the skin on a movement path of the ultrasonic wave generating unit.Type: ApplicationFiled: October 24, 2023Publication date: February 29, 2024Applicant: JEISYS MEDICAL INC.Inventors: Eun Ho KIM, Kwang Hyeok JUNG, Si Youn KIM, Dong Hwan KANG, Min Young KIM, Hyun Jin KIM, Kwang Ho RYU
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Patent number: 9793476Abstract: Provided are a substrate treating apparatus and method of manufacturing a phase-change layer having superior deposition characteristics. The substrate treating method of manufacturing a phase-change memory includes forming a bottom electrode on a substrate on which a pattern is formed, performing surface treating for removing impurities generated or remaining on a surface of the substrate while the bottom electrode is formed, performing nitriding on the surface of the substrate from which the impurities are removed, and successively depositing a phase-change layer and a top electrode on the bottom electrode.Type: GrantFiled: October 30, 2012Date of Patent: October 17, 2017Assignee: WONIK IPS CO., LTD.Inventors: Ju Hwan Park, Dong Ho Ryu, Byung Chul Cho
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Publication number: 20170008015Abstract: Provided is a substrate processing apparatus capable of improving thickness uniformity. The substrate processing apparatus includes a process chamber including a shower head, a feeding block including a tube to provide a source gas and a reaction gas to the shower head, and a mixing block configured to provide a channel connected between the shower head and the feeding block to mix the source gas and the reaction gas, and the mixing block includes an internal space having a cross-sectional area larger than the cross-sectional area of the tube provided in the feeding block, and a collision part provided on a path of a gas mixture of the source gas and the reaction gas to collide with the gas mixture.Type: ApplicationFiled: June 29, 2016Publication date: January 12, 2017Inventors: Doo Hyun LA, Dong Ho RYU, Ju Sung PARK, Ju Sung PARK, Sang Woo LEE
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Patent number: 9464353Abstract: The present invention relates to a substrate processing apparatus: including a chamber comprising a body having an inner space and a top lid provided on an upper part of the body, the top lid having at least one gas input port; a substrate supporting unit rotatably installed inside the chamber to support a plurality of substrates; and a gas injection device comprising a central injection unit provided on an upper part of the substrate supporting unit to inject a gas into a central region of the substrate supporting unit, a source gas injection unit provided around the central injection unit to inject a source gas into the substrate supporting unit, a reaction gas injection unit provided around the central injection unit to inject a reaction gas into the substrate supporting unit and a purge gas injection unit disposed between the source gas injection unit and the reaction gas injection unit; wherein at least one of the source gas injection unit and the reaction gas injection unit comprises a main injection unType: GrantFiled: November 21, 2013Date of Patent: October 11, 2016Assignee: WONIK IPS CO., LTD.Inventors: Young Hoon Park, Dong Ho Ryu, Won Jun Yoon
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Publication number: 20150243490Abstract: The present invention relates to a substrate processing apparatus and a substrate processing method, the substrate processing apparatus including: a load-lock chamber; a transfer chamber disposed on one side of the load-lock chamber; a process chamber disposed on one side of the transfer chamber; and a substrate transfer robot disposed inside the transfer chamber to transfer a substrate between the load-lock chamber and the process chamber, wherein the process chamber includes a plurality of substrate support plates configured to support the substrate, a plurality of gas spray units configured to respectively spray process gases on the plurality of substrate support plates, a turntable configured to transfer the substrate between the plurality of substrate support plates, a first gate through which an unprocessed substrate is taken in, and a second gate through which a processed substrate is taken out; and the substrate transfer robot independently transfers the unprocessed substrate and the processed substraType: ApplicationFiled: February 26, 2015Publication date: August 27, 2015Inventors: Dong Ho RYU, Kyung Eun LEE, Tae Ho HAM, Yong Jin KIM
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Publication number: 20150136028Abstract: The present invention relates to a substrate processing apparatus: including a chamber comprising a body having an inner space and a top lid provided on an upper part of the body, the top lid having at least one gas input port; a substrate supporting unit rotatably installed inside the chamber to support a plurality of substrates; and a gas injection device comprising a central injection unit provided on an upper part of the substrate supporting unit to inject a gas into a central region of the substrate supporting unit, a source gas injection unit provided around the central injection unit to inject a source gas into the substrate supporting unit, a reaction gas injection unit provided around the central injection unit to inject a reaction gas into the substrate supporting unit and a purge gas injection unit disposed between the source gas injection unit and the reaction gas injection unit; wherein at least one of the source gas injection unit and the reaction gas injection unit comprises a main injection unType: ApplicationFiled: November 21, 2013Publication date: May 21, 2015Applicant: WONIK IPS CO., LTD.Inventors: Young Hoon PARK, Dong Ho RYU, Won Jun YOON
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Publication number: 20150037929Abstract: Provided are a substrate treating apparatus and method of manufacturing a phase-change layer having superior deposition characteristics. The substrate treating method of manufacturing a phase-change memory includes forming a bottom electrode on a substrate on which a pattern is formed, performing surface treating for removing impurities generated or remaining on a surface of the substrate while the bottom electrode is formed, performing nitriding on the surface of the substrate from which the impurities are removed, and successively depositing a phase-change layer and a top electrode on the bottom electrode.Type: ApplicationFiled: October 30, 2012Publication date: February 5, 2015Inventors: Ju Hwan Park, Dong Ho Ryu, Byung Chul Cho
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Publication number: 20140034138Abstract: The present invention relates to a semiconductor manufacturing device, which can be applied in a semiconductor metal interconnection process, and a manufacturing method thereof. The semiconductor manufacturing device includes a loadlock chamber, at least one process chamber, a transfer chamber, and an oxidation preventing gas supply unit. The process chamber processes an annealing process by receiving a substrate. The transfer chamber transfers the substrate between the loadlock chamber and the process chamber. The oxidation preventing gas supply unit supplies oxidation preventing gas into either the transfer chamber or the loadlock chamber.Type: ApplicationFiled: April 12, 2012Publication date: February 6, 2014Applicant: WONIK IPS CO., LTD.Inventors: Ki-Hoon Lee, Dong-Ho Ryu
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Publication number: 20120222616Abstract: Provided are a showerhead assembly for depositing a thin film on a substrate and a thin film deposition apparatus having the same. The showerhead assembly includes a plurality of gas injection units radially disposed above a substrate, each of the plurality of gas injection units comprising a receiving part configured to receive a gas supplied from the outside and a plurality of injection holes configured to inject the gas within the receiving part.Type: ApplicationFiled: September 13, 2010Publication date: September 6, 2012Applicant: WONIK IPS CO., LTD.Inventors: Chang-Hee Han, Dong-Ho Ryu, Ki-Hoon Lee