Abstract: An electronic vaporizer for generating an aerosol includes a housing to be installed to an electronic device by being coupled to the electronic device through a connecting interface of the electronic device, and including: a connecting interface that receives power from a battery included in the electronic device when coupled to the connecting interface of the electronic device, a liquid storage for storing a liquid aerosol generating material and supplying the liquid aerosol generating material to a wick when the housing is disposed in a predetermined posture, an atomizer that includes a wick and a heater for generating an aerosol by heating the liquid aerosol generating material supplied to the wick, and a control circuit that controls heating of the heater for generating the aerosol, based on the power supplied from the battery.

Abstract: Disclosed herein are a method, an apparatus and a storage medium for encoding/decoding using a transform-based feature map. An optimal basis vector is extracted from one or more feature maps, and a transform coefficient is acquired through a transform using the basis vector. The basis vector and the transform coefficient may be transmitted through a bitstream. In an embodiment, one or more feature maps are reconstructed using the basis vector and the transform coefficient, which are decoded from the bitstream.

Abstract: A method of manufacturing a printed circuit board includes providing an insulating layer, forming a plating seed layer on the insulating layer, forming a first circuit pattern on the plating seed layer and a second circuit pattern on the first circuit pattern, and forming a top metal layer on the second circuit pattern. The second circuit pattern can be thinner than the first circuit pattern, and the top metal layer can be wider than the second circuit pattern.

Abstract: Disclosed are a material for plasma spray coating having high plasma resistance and a method for producing the same. The method includes: feeding yttrium compound into an air plasma jet; melting the yttrium compound; and cooling droplets of the molten yttrium compound.

Abstract: Disclosed are a material for spray for plasma spray coating having high plasma resistance and a method for producing the same. The material for plasma spray comprises an yttrium compound, and the numbers of moles of Y (yttrium), O (oxygen), and F (fluorine) in the yttrium compound satisfy 1.5<(O+F)/Y<2.0.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: Disclosed herein is a method of manufacturing a plasma-resistant coating film. The method includes (1) forming a lower coating layer through a thermal spray process, on a base member, from a first rare earth metal compound powder including 90 to 99.9 wt % of first rare earth metal compound particles and 0.1 to 10 wt % of silica (SiO2) particles, (2) processing the surface of the lower coating layer formed in step (1) to have an average surface roughness of 1 to 6 ?m, and (3) forming an upper coating layer through a suspension plasma spray process, on the lower coating layer which is surface-treated in step (2), from second rare earth metal compound particles, to obtain a structurally dense and chemically stable plasma-resistant coating film with improved plasma resistance.

Abstract: Proposed is a method for manufacturing a spherical YOF-based powder. Specifically, proposed is a method for manufacturing a spherical YOF-based powder. The YOF-based powder injected into the plasma jet and melted into the refrigerant in a droplet state is sprayed and quenched, thereby improving density and controlling the component ratio through particle spheroidization.

Abstract: The present disclosure relates to an yttrium-based granular powder for thermal spraying. More particularly, the yttrium-based granular powder is a mixture including one or more yttrium compound powders selected from among Y2O3, YOF, YF3, Y4Al2O9, Y3Al5O12, and YAlO3, and a silica (SiO2) powder. A Y—Si—O intermediate phase is included therein in a content of less than 10 wt %. The thermal spray coating manufactured using the same has a low porosity, and forms a very dense thin film, thus ensuring excellent plasma resistance.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: Proposed is a method of producing an yttrium-based thermal spray coating. The method includes forming a coating on a substrate by atmospheric plasma spraying of an yttrium-based granular powder including at least one yttrium compound powder selected from the group consisting of Y2O3, YOF, YF3, Y4Al2O9, Y3Al5O12, and YAlO3, and a silica (SiO2) powder. The yttrium-based granular powder includes less than 10 w % of a Y—Si—O mesophase. Then yttrium-based thermal spray coating can exhibit low porosity, high density, and excellent plasma resistance.

Abstract: The present disclosure relates to an yttrium-based granular powder for thermal spraying. More particularly, the yttrium-based granular powder is a mixture including one or more yttrium compound powders selected from among Y2O3, YOF, YF3, Y4Al2O9, Y3Al5O12, and YAlO3, and a silica (SiO2) powder. A Y—Si—O intermediate phase is included therein in a content of less than 10 wt %. The thermal spray coating manufactured using the same has a low porosity, and forms a very dense thin film, thus ensuring excellent plasma resistance.

Abstract: Proposed is an yttrium-based granular powder for thermal spraying. The yttrium-based granular powder includes at least one yttrium compound powder selected from the group consisting of Y2O3, YOF, YF3, Y4Al2O9, Y3Al5O12, and YAlO3, and a silica (SiO2) powder. The yttrium-based granular powder is prepared by mixing the yttrium compound powder having a mean grain diameter of 50 nm to 900 nm and the silica powder having a mean grain diameter of 50 nm to 900 nm. The yttrium-based granular powder includes less than 10 wt % of a Y—Si—O mesophase. A thermal spray coating produced using the yttrium-based granular powder can exhibit low porosity, high density, and excellent plasma resistance.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: A method of manufacturing a printed circuit board includes providing an insulating layer, forming a plating seed layer on the insulating layer, forming a first circuit pattern on the plating seed layer and a second circuit pattern on the first circuit pattern, and forming a top metal layer on the second circuit pattern. The second circuit pattern can be thinner than the first circuit pattern, and the top metal layer can be wider than the second circuit pattern.

Abstract: A method of manufacturing a printed circuit board includes providing an insulating layer, forming a plating seed layer on the insulating layer, forming a first circuit pattern on the plating seed layer and a second circuit pattern on the first circuit pattern, and forming a top metal layer on the second circuit pattern. The second circuit pattern can be thinner than the first circuit pattern, and the top metal layer can be wider than the second circuit pattern.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.