Patents by Inventor Dong-Hwan Ko

Dong-Hwan Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11930854
    Abstract: An electronic vaporizer for generating an aerosol includes a housing to be installed to an electronic device by being coupled to the electronic device through a connecting interface of the electronic device, and including: a connecting interface that receives power from a battery included in the electronic device when coupled to the connecting interface of the electronic device, a liquid storage for storing a liquid aerosol generating material and supplying the liquid aerosol generating material to a wick when the housing is disposed in a predetermined posture, an atomizer that includes a wick and a heater for generating an aerosol by heating the liquid aerosol generating material supplied to the wick, and a control circuit that controls heating of the heater for generating the aerosol, based on the power supplied from the battery.
    Type: Grant
    Filed: July 11, 2019
    Date of Patent: March 19, 2024
    Assignee: KT&G CORPORATION
    Inventors: Eun Mi Jeong, Dong Kyun Ko, Ji Hun Yang, In Su Park, Soon Hwan Jung
  • Publication number: 20240074284
    Abstract: A display device includes: a display panel including a first region including a transmissive part configured to transmit light provided from the outside and a second region not including the transmissive part; and a sensor overlapping with the transmissive part, and configured to obtain electrical information based on information provided from the outside, wherein the display panel includes: a thin film transistor layer including a plurality of transistors; a pixel defining layer defining an emission region of a plurality of pixels; and a light blocking layer on the pixel defining layer, and defining the transmissive part, and wherein the pixel defining layer in the first region covers at least a portion of the thin film transistor layer such that light provided through the transmissive part is blocked.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Inventors: Sun Ho KIM, Sun Hee LEE, Gun Hee KIM, Dong Hwan SHIM, Yoo Min KO, Chea Eun KIM
  • Publication number: 20240067668
    Abstract: The present invention relates to a heteroaryl derivative compound and a use thereof. Since the heteroaryl derivative of the present invention exhibits excellent inhibitory activity against EGFR, the heteroaryl derivative can be usefully used as a therapeutic agent for EGFR-associated diseases.
    Type: Application
    Filed: December 29, 2021
    Publication date: February 29, 2024
    Inventors: Yi Kyung Ko, Ah Reum Han, Jin Hee Park, Yeong Deok Lee, Hye Rim Im, Kyun Eun Kim, Dong Keun Hwang, Su Been Nam, Myung Hoe Heo, Se Rin Cho, Eun Hwa Ko, Sung Hwan Kim, Hwan Geun Choi
  • Publication number: 20170036509
    Abstract: The present invention relates to a heat exchanger that is disposed in an automotive air conditioner and provides cold air or hot air through heat exchange with air supplied by a fan and, more particularly, to an integrated module of an evaporator core and a heater core for an automotive air conditioner whereby the integrated module can simplify an automotive air conditioner by integrating an evaporator for cooling and a heater core for heating in the automotive air conditioner. According to the present invention, evaporator headers and heater headers are stacked and fixed in an integrated unit, so it is possible to simplify a facility. Accordingly, installation is easy and a volume can be reduced, as compared with the related art, whereby it is possible to reduce the weight of a vehicle.
    Type: Application
    Filed: August 3, 2016
    Publication date: February 9, 2017
    Inventor: Dong Hwan Ko
  • Publication number: 20170038104
    Abstract: The present invention provides an evaporator having a vertical arrangement of header pipes for a vehicle air conditioner, the evaporator including: a pair of header pipes disposed to face each other with a gap therebetween, providing a circulation path for a coolant supplied in the cooling cycle, and discharging the coolant that has exchanged heat; a plurality of tubes laterally arranged between the pair of header pipes to communicate with the header pipes, connected in a longitudinal direction of the header pipes, and allowing a coolant flowing inside through inlets of the header pipes to exchange heat with air while flowing in a zigzag pattern toward outlets of the header pipes; and heat-dissipating fins disposed among the tubes and dissipating heat of vaporization from the tubes while passing the air supplied from the fan.
    Type: Application
    Filed: August 3, 2016
    Publication date: February 9, 2017
    Inventor: Dong Hwan Ko
  • Publication number: 20170036515
    Abstract: Disclosed is a drain pan structure having a drain pan storing and draining condensate water generated from an evaporator installed in a casing of the bus air conditioner, the drain pan including: a bottom plate provided at a position below the evaporator, the bottom plate including: an inclined portion having at least one surface having at least one downward inclination; and a drain channel formed by extending to distal ends of a side direction of the bottom plate such that height of the drain channel is lowest at the distal ends of the side direction of the bottom plate so as to move the condensate water drained from the bottom plate, in a drain direction of the condensate water.
    Type: Application
    Filed: August 3, 2016
    Publication date: February 9, 2017
    Inventor: Dong Hwan Ko
  • Patent number: 6686266
    Abstract: A method for forming a fuse pattern for repairing a bad cell includes forming a metal wiring pattern on a substrate and successively forming an insulating layer on the metal wiring pattern and the substrate. The insulating layer of a region for defining the fuse pattern is etched by using an etching gas including a fluorocarbon-type compound and a fluorosilicate-type compound, which substantially suppresses a generation of by-products. A partially exposed metal layer of the metal wiring pattern is removed to form a fuse. Accordingly, a structure such as a fence is not formed on the residue of insulating layer. Therefore, the removal process for the fence is unnecessary. As a result, the process for forming the fuse is simplified.
    Type: Grant
    Filed: July 5, 2002
    Date of Patent: February 3, 2004
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dong-Hwan Ko, Seog-Hun Yoon, Jae-Hyun Park
  • Publication number: 20030013289
    Abstract: A method for forming a fuse pattern for repairing a bad cell includes forming a metal wiring pattern on a substrate and successively forming an insulating layer on the metal wiring pattern and the substrate. The insulating layer of a region for defining the fuse pattern is etched by using an etching gas including a fluorocarbon-type compound and a fluorosilicate-type compound, which substantially suppresses a generation of by-products. A partially exposed metal layer of the metal wiring pattern is removed to form a fuse. Accordingly, a structure such as a fence is not formed on the residue of insulating layer. Therefore, the removal process for the fence is unnecessary. As a result, the process for forming the fuse is simplified.
    Type: Application
    Filed: July 5, 2002
    Publication date: January 16, 2003
    Inventors: Dong-Hwan Ko, Seog-Hun Yoon, Jae-Hyun Park
  • Patent number: 6123805
    Abstract: A process chamber of a dry etching facility for manufacturing semiconductor devices uniformly forms the ion density of plasma over a wafer, and reduces the volume of the process chamber by installing a plurality of discharge openings in an electrode housing which supports the electrode plate of a lower electrode. The lower electrode is a discharge electrode which is constructed such that a plurality of discharge openings are symmetrically provided in the side wall of the electrode housing supporting the electrode plate on which a wafer is mounted, and the discharge openings form a discharge passage which is connected to a discharge pipe at a pipe connection opening.
    Type: Grant
    Filed: September 22, 1999
    Date of Patent: September 26, 2000
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Tae-hoon Kim, Byung-chul Kim, Dong-hwan Ko
  • Patent number: D514210
    Type: Grant
    Filed: March 16, 2001
    Date of Patent: January 31, 2006
    Assignee: Dong Hwan Ind. Ltd.
    Inventor: Dong-Hwan Ko
  • Patent number: D1025167
    Type: Grant
    Filed: April 28, 2023
    Date of Patent: April 30, 2024
    Inventors: Han Wool Choi, Jun Hwan Park, Seok Young Youn, Hun Keon Ko, Ho Seong Kang, Hyeon Jeong An, Gyu Jong Hwang, Soo Kyoung Kang, Dong Jin Hyun, Geun Sang Yu
  • Patent number: D1025168
    Type: Grant
    Filed: April 28, 2023
    Date of Patent: April 30, 2024
    Inventors: Han Wool Choi, Jun Hwan Park, Seok Young Youn, Hun Keon Ko, Ho Seong Kang, Hyeon Jeong An, Gyu Jong Hwang, Soo Kyoung Kang, Dong Jin Hyun, Geun Sang Yu