Abstract: A semiconductor package including: a first package; a second package on the first package, the second package including a second package substrate, first and second semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the first and second semiconductor chips; and a fill part between the first package and the second package, a first through hole that penetrates the second package substrate, the first through hole being between the first and second semiconductor chips, a second through hole that penetrates the second molding part, the second through hole being connected to the first through hole, and wherein the fill part has an extension disposed in the first through hole and the second through hole.

Abstract: The present invention provides an anti-transfer floor tile including a high hardness layer and a method for manufacturing the same.

Abstract: The present invention provides an anti-transfer floor tile including a high hardness layer and a method for manufacturing the same.

Abstract: Disclosed is a patch antenna module, which receives a signal for position information and a signal for vehicle communication by using one patch antenna, thereby minimizing a mounting space. The disclosed patch antenna module includes a dielectric; an upper patch formed on one surface of the dielectric and for receiving a signal for position information; a lower patch formed on the other surface of the dielectric; and a feed pin for penetrating the dielectric, the upper patch, and the lower patch, formed in a length within a predetermined range, and for receiving a signal for vehicle communication.

Abstract: Disclosed is a patch antenna, which is formed so that the upper surface of a dielectric layer has a wider area than the lower surface thereof and is mounted on a printed circuit board to form an air gap, thus maximizing antenna performance while implementing lightweight. The disclosed patch antenna includes a dielectric layer, a radiation patch formed on the upper surface of the dielectric layer, and a lower patch formed on the lower surface of the dielectric layer; and the dielectric layer is formed so that an area of the upper surface is wider than an area of the lower surface to form an air gap between the printed circuit board and the dielectric layer.

Abstract: Disclosed is a patch antenna, which is formed so that the upper surface of a dielectric layer has a wider area than the lower surface thereof and is mounted on a printed circuit board to form an air gap, thus maximizing antenna performance while implementing lightweight. The disclosed patch antenna includes a dielectric layer, a radiation patch formed on the upper surface of the dielectric layer, and a lower patch formed on the lower surface of the dielectric layer; and the dielectric layer is formed so that an area of the upper surface is wider than an area of the lower surface to form an air gap between the printed circuit board and the dielectric layer.

Abstract: Disclosed herein are a rigid tile including a foam cushion layer and a reinforcing layer, and a production method thereof.

Abstract: Disclosed is a wideband patch antenna module where two feeding points are formed on a lower patch at a preset angle therebetween, whereby ultra-wideband characteristics receiving both a GPS signal and a GLONASS signal may be realized, and antenna size and manufacturing costs may be minimized. The wideband patch antenna module includes a base layer; a radiation patch provided on a top surface of the base layer; a lower patch provided at a bottom surface of the base layer; a first feeding point provided at a bottom surface of the lower patch; and a second feeding point provided at the bottom surface of the lower patch, wherein an imaginary line connecting the first feeding point and a center point of the lower patch intersects with an imaginary line connecting the second feeding point and the center point of the lower patch.

Abstract: The disclosed broadband antenna module for LTE includes: a feeding pin and a direct short pin that are spaced apart from each other on one surface of a printed circuit board; a coupling short pin formed of a conductive material on the other surface of the printed circuit board and connected to a ground plane; and a radiation patch antenna including a dielectric and a radiation pattern formed on an outer circumference of the dielectric and mounted on one surface of the printed circuit board, in which the radiation pattern of the radiation patch antenna is directly connected to the feeding pin and direct short pin and coupled to the coupling short pin in an overlapping manner.

Abstract: Disclosed is a multi-band patch antenna module, which forms an inner radiation patch having different horizontal and vertical lengths and an outer radiation patch spaced from the inner radiation patch on one surface of a dielectric layer, and transmits and receives signals of a 2.4 GHz band and a 5 GHz band. The multi-band patch antenna module disclosed includes the dielectric layer, the outer radiation patch formed with an insertion hole and formed on one surface of the dielectric layer, and the inner radiation patch inserted into the insertion hole and formed on one surface of the dielectric layer; and a horizontal length of the inner radiation patch is different from a vertical length of the inner radiation patch.

Abstract: Disclosed is a patch antenna module, which receives a signal for position information and a signal for vehicle communication by using one patch antenna, thereby minimizing a mounting space. The disclosed patch antenna module includes a dielectric; an upper patch formed on one surface of the dielectric and for receiving a signal for position information; a lower patch formed on the other surface of the dielectric; and a feed pin for penetrating the dielectric, the upper patch, and the lower patch, formed in a length within a predetermined range, and for receiving a signal for vehicle communication.

Abstract: Disclosed is a multi-band patch antenna module, which forms an inner radiation patch having different horizontal and vertical lengths and an outer radiation patch spaced from the inner radiation patch on one surface of a dielectric layer, and transmits and receives signals of a 2.4 GHz band and a 5 GHz band. The multi-band patch antenna module disclosed includes the dielectric layer, the outer radiation patch formed with an insertion hole and formed on one surface of the dielectric layer, and the inner radiation patch inserted into the insertion hole and formed on one surface of the dielectric layer; and a horizontal length of the inner radiation patch is different from a vertical length of the inner radiation patch.

Abstract: The disclosed broadband antenna module for LTE includes: a feeding pin and a direct short pin that are spaced apart from each other on one surface of a printed circuit board; a coupling short pin formed of a conductive material on the other surface of the printed circuit board and connected to a ground plane; and a radiation patch antenna including a dielectric and a radiation pattern formed on an outer circumference of the dielectric and mounted on one surface of the printed circuit board, in which the radiation pattern of the radiation patch antenna is directly connected to the feeding pin and direct short pin and coupled to the coupling short pin in an overlapping manner.

Abstract: Disclosed herein are a rigid tile including a foam cushion layer and a reinforcing layer, and a production method thereof.

Abstract: Disclosed is a wideband patch antenna module where two feeding points are formed on a lower patch at a preset angle therebetween, whereby ultra-wideband characteristics receiving both a GPS signal and a GLONASS signal may be realized, and antenna size and manufacturing costs may be minimized. The wideband patch antenna module includes a base layer; a radiation patch provided on a top surface of the base layer; a lower patch provided at a bottom surface of the base layer; a first feeding point provided at a bottom surface of the lower patch; and a second feeding point provided at the bottom surface of the lower patch, wherein an imaginary line connecting the first feeding point and a center point of the lower patch intersects with an imaginary line connecting the second feeding point and the center point of the lower patch.