Abstract: A technology related to a pick-and-place apparatus for electronic device inspection equipment is provided. The pick-and-place apparatus includes the guiding unit that can interact with a loading element and can guide the picker to load the electronic devices at a correct position on the loading element. Therefore, the pick-and-place apparatus can allow the electronic devices, for example, semiconductor devices having a ball type of electrical contact lead (BGA, FBGA, etc.), to electrically contact the tester in a stable manner when the tester inspects the electronic devices.

Abstract: A system and method is disclosed that transfers carrier boards in a handler that supports the testing of electronic devices. A carrier board can be transferred from the transfer start position to one of the mid transfer positions and the transfer final position. Carrier boards, which are spaced apart from each other in a chamber, can be gathered adjacent to each other in the circulation direction of carrier board. The transfer speed and the total circulation speed of the carrier boards can be enhanced. The transfer speed of carrier board can be easily controlled according to the test conditions.

Abstract: A technology related to a pick-and-place apparatus for electronic device inspection equipment is provided. The pick-and-place apparatus includes the guiding unit that can interact with a loading element and can guide the picker to load the electronic devices at a correct position on the loading element. Therefore, the pick-and-place apparatus can allow the electronic devices, for example, semiconductor devices having a ball type of electrical contact lead (BGA, FBGA, etc.), to electrically contact the tester in a stable manner when the tester inspects the electronic devices.

Abstract: A technology related to a pick-and-place apparatus for electronic device inspection equipment is provided. The pick-and-place apparatus includes the guiding unit that can interact with a loading element and can guide the picker to load the electronic devices at a correct position on the loading element. Therefore, the pick-and-place apparatus can allow the electronic devices, for example, semiconductor devices having a ball type of electrical contact lead (BGA, FBGA, etc.), to electrically contact the tester in a stable manner when the tester inspects the electronic devices.

Abstract: In a side-docking type test handler, a descending mechanism lowers a horizontally postured test tray, which has been transferred into a soak chamber, down to a descent finish position and a vertical posture changing mechanism changes the posture of the test tray, which has been lowered to the descent finish position, from the horizontal state to a vertical state, to transfer the test tray into a test chamber. Further, a horizontal posture changing mechanism changes the posture of the test tray in the test chamber from the vertical state to the horizontal state while transferring the test tray to an ascent start position in a desoak chamber.

Abstract: A pick-and-place module for test handlers includes a main body, and a kit. The main body has N-th vacuum paths (where N is plural). The kit has M-th pickers. The M-th pickers are provided so as respectively correspond to M-th vacuum passages (where 1?M?N), which are formed to respectively correspond to all or some of the N-th vacuum paths formed in the main body, and holds semiconductor devices or releasing the held semiconductor devices using vacuum pressures. The kit is detachably mounted to the main body.

Abstract: A pick-and-place apparatus for transferring and loading semiconductor devices between first and second loading elements is provided. The pick-and-place apparatus includes a multiplicity of picking unit modules, each of which has at least one or more picking units, and an interval regulation apparatus for regulating intervals between the picking unit modules at the first to third modes. The first to third row interval values are different from each other. The intervals between the picking unit modules are all regulated to be identical to the first row interval at the first mode, are alternately regulated to the second row interval and the third row interval in turn at the second mode, and are alternately regulated to the third row interval and the second row interval in turn at the third mode.

Abstract: A pick and place apparatus includes a plurality of device holing elements in a predetermined arrangement; a power supply mechanism for supplying a power for controlling a horizontal pitch between the plurality of device holding elements; a power transmission mechanism for delivering the power from the power supply mechanism to the plurality of device holding elements as a translational force in a horizontal direction; a first linear motion guide mechanism for guiding horizontal movements of some of the plurality of device holding elements; and a second linear motion guide mechanism disposed below the first linear motion guide mechanism, for guiding horizontal movements of the other device holding elements. The plurality of device holding elements are slidably coupled to the first and the second linear motion guide mechanism alternately.

Abstract: A pick and place apparatus includes a 1st to an nth device holding element arranged in a lengthwise direction, every one of the 1st to the nth device holding element being connected to its neighboring one(s) of the 1st to the nth device holding element by means of at least one pitch setting ring; a belt having a first coupling part at an upper part thereof for being coupled to the 1st device holding element and a second coupling part at a lower part thereof for being coupled to the nth device holding element; and a driven pulley and a differential pulley. The driven and the differential pulley are rotated by being engaged with the belt to move the 1st and the nth device holding element such that the 1st device holding element moves in a direction opposite to the nth device holding element.

Abstract: Operation methods of test handler are disclosed. The pick-and-place apparatus picks up semiconductor devices from first loading compartments arrayed in a matrix on a first loading element, moves, and places onto second loading compartments arrayed in a matrix on a second loading element. Pickers of the pick-and-place apparatus pick up the semiconductor devices from the first loading compartments and place them selectively onto a plurality of adjacent odd rows or a plurality of adjacent even rows of the second loading compartments during one operation. The pick-and-place apparatus includes a relatively large number of the pickers, preferably arrayed in a matrix, and thus performs loading and unloading of semiconductor devices at a relatively high speed.

Abstract: A technology related to a pick-and-place apparatus for electronic device inspection equipment is provided. The pick-and-place apparatus includes the guiding unit that can interact with a loading element and can guide the picker to load the electronic devices at a correct position on the loading element. Therefore, the pick-and-place apparatus can allow the electronic devices, for example, semiconductor devices having a ball type of electrical contact lead (BGA, FBGA, etc.), to electrically contact the tester in a stable manner when the tester inspects the electronic devices.

Abstract: A system and method is disclosed that transfers carrier boards in a handler that supports the testing of electronic devices. A carrier board can be transferred from the transfer start position to one of the mid transfer positions and the transfer final position. Carrier boards, which are spaced apart from each other in a chamber, can be gathered adjacent to each other in the circulation direction of carrier board. The transfer speed and the total circulation speed of the carrier boards can be enhanced. The transfer speed of carrier board can be easily controlled according to the test conditions.

Abstract: A pick-and-place module for test handlers includes a main body, and a kit. The main body has N-th vacuum paths (where N is plural). The kit has M-th pickers. The M-th pickers are provided so as respectively correspond to M-th vacuum path parts (where 1?M?N), which are formed to respectively correspond to all or some of the N-th vacuum paths formed in the main body, and holds semiconductor devices or releasing the held semiconductor devices using vacuum pressures. The kit is detachably mounted to the main body.

Abstract: A test handler is disclosed. First and second gripping blocks for respective front and rear test trays to be transferred along a circulation path move together in a circulation direction, but move independently in a direction perpendicular to the circulation path and grip and release independently. The test trays can be transferred by a single power source and interference between an assisting a test and a transferring can be minimized.

Abstract: Operation methods of test handler are disclosed. The pick-and-place apparatus picks up semiconductor devices from first loading compartments arrayed in a matrix on a first loading element, moves, and places onto second loading compartments arrayed in a matrix on a second loading element. Pickers of the pick-and-place apparatus pick up the semiconductor devices from the first loading compartments and place them selectively onto a plurality of adjacent odd rows or a plurality of adjacent even rows of the second loading compartments during one operation. The pick-and-place apparatus includes a relatively large number of the pickers, preferably arrayed in a matrix, and thus performs loading and unloading of semiconductor devices at a relatively high speed.

Abstract: Operation methods of test handler are disclosed. The pick-and-place apparatus picks up semiconductor devices from first loading compartments arrayed in a matrix on a first loading element, moves, and places onto second loading compartments arrayed in a matrix on a second loading element. Pickers of the pick-and-place apparatus pick up the semiconductor devices from the first loading compartments and place them selectively onto a plurality of adjacent odd rows or a plurality of adjacent even rows of the second loading compartments during one operation. The pick-and-place apparatus includes a relatively large number of the pickers, preferably arrayed in a matrix, and thus performs loading and unloading of semiconductor devices at a relatively high speed.

Abstract: A pick-and-place apparatus is disclosed, which transfers and loads semiconductor devices between first and second loading elements. The semiconductor devices are loadable and arrangeable at a first row interval in the first loading element, and alternatively arrangeable at second and third row intervals in the second loading element. The pick-and-place apparatus includes a multiplicity of picking unit modules, each of which has at least one or more picking units; and an interval regulation apparatus for regulating intervals between the picking unit modules at the first to third modes. The first to third row interval values are different from each other. The intervals between the picking unit modules are all regulated to be identical to the first row interval at the first mode. The intervals between the picking unit modules are alternately regulated to the second row interval and the third row interval in turn at the second mode.

Abstract: In a side-docking type test handler, a descending mechanism lowers a horizontally postured test tray, which has been transferred into a soak chamber, down to a descent finish position and a vertical posture changing mechanism changes the posture of the test tray, which has been lowered to the descent finish position, from the horizontal state to a vertical state, to transfer the test tray into a test chamber. Further, a horizontal posture changing mechanism changes the posture of the test tray in the test chamber from the vertical state to the horizontal state while transferring the test tray to an ascent start position in a desoak chamber.

Abstract: A pick and place apparatus includes a 1st to an nth device holding element arranged in a lengthwise direction, every one of the 1st to the nth device holding element being connected to its neighboring one(s) of the 1st to the nth device holding element by means of at least one pitch setting ring; a belt having a first coupling part at an upper part thereof for being coupled to the 1st device holding element and a second coupling part at a lower part thereof for being coupled to the nth device holding element; and a driven pulley and a differential pulley. The driven and the differential pulley are rotated by being engaged with the belt to move the 1st and the nth device holding element such that the 1st device holding element moves in a direction opposite to the nth device holding element.

Abstract: Operation methods of test handler are disclosed. The pick-and-place apparatus picks up semiconductor devices from first loading compartments arrayed in a matrix on a first loading element, moves, and places onto second loading compartments arrayed in a matrix on a second loading element. Pickers of the pick-and-place apparatus pick up the semiconductor devices from the first loading compartments and place them selectively onto a plurality of adjacent odd rows or a plurality of adjacent even rows of the second loading compartments during one operation. The pick-and-place apparatus includes a relatively large number of the pickers, preferably arrayed in a matrix, and thus performs loading and unloading of semiconductor devices at a relatively high speed.