Abstract: The present invention relates to a polyurethane resin composition for a support pad including a polyurethane resin, a DMF solvent, an anionic surfactant, and polyethylene glycol (PEG), and a polyurethane support pad including the polyurethane resin composition for a support pad. According to the present invention, long and large pores may be uniformly formed therein, and thus a support pad having an excellent compression rate and compression recovery rate may be provided.

Abstract: A fingerprint authentication apparatus and method which processes fingerprint data input through a plurality of fingerprint sensors and uses the processed fingerprint data in authentication to thereby increase security and performance. The fingerprint authentication apparatus includes a first sensor configured to acquire first fingerprint data from a user; a second sensor configured to acquire second fingerprint data that is different from the first fingerprint data; and a control unit configured to determine whether or not to authenticate the user based on similarities obtained from the comparison of each of the first fingerprint data and the second fingerprint data with registered fingerprint data.

Abstract: This disclosure relates to a polyurethane resin composition for a mounting pad, including a polyurethane resin, C9-15 alkyl benzene sulfonic acid or a salt thereof, and a DMF solvent, and a polyurethane mounting pad using the same, whereby long and large pores may be uniformly formed thereinside to provide a mounting pad having low hardness, excellent compressibility, and a high compression modulus.

Abstract: The present invention relates to a polyurethane resin composition including a first polyurethane resin and a second polyurethane resin that are different from each other in their compositions, an organic solvent, and a surfactant, and a polyurethane mounting pad manufactured from the resin composition.

Abstract: In a method for preparing cerium carbonate powder by mixing a cerium precursor solution with a urea solution and carrying out a precipitation reaction, wherein the cerium carbonate powder has a hexagonal crystal structure, by using at least one type of organic solvent as a solvent for either or both the cerium precursor solution and the urea solution, and adjusting temperature of the precipitation reaction within a range of 120° C. to 300° C. Also, the method can yield cerium carbonate powder, cerium oxide powder from the cerium carbonate powder, and CMP slurry including the cerium oxide powder as an abrasive. In the method, urea as a precipitant can improve the uniformity of a reaction, and thus it is possible to easily and inexpensively obtain cerium carbonate powder with a hexagonal crystal structure without the danger by high-temperature high-pressure and the need for an expensive system in hydrothermal synthesis.

Abstract: The present invention relates to a CMP slurry composition comprising an abrasive particle; a dispersant; an ionic polymer additive; and a non-ionic polymer additive including a polyolefin-polyethylene glycol copolymer including at least two polyethylene glycol repeat unit as a backbone and at least a polyethylene glycol repeating unit as a side chain, and a polishing method with using the slurry composition. The CMP slurry composition shows a low polishing rate to a single-crystalline silicon layer or a polysilicon layer and a high polishing rate to a silicon oxide layer, resulting in having an excellent polishing selectivity.

Abstract: An optical structure for acquiring a fingerprint image with high resolution and minimum distortion is provided. The optical structure includes a prism configured to comprise an input surface to which light is irradiated, a contact surface formed horizontally to be in contact with a finger, and an output surface through which the light that has been irradiated to the input surface and reflected from the finger in contact with the contact surface passes; a lighting unit configured to emit a beam to the input surface of the prism; a reflector unit configured to reflect a fingerprint image passing through the output surface of the prism; a lens unit configured to comprise two or more lenses, each being configured to receive the fingerprint image reflected from the reflector unit; and an image sensor on which the fingerprint image passing through the lens unit is formed.

Abstract: A fingerprint authentication apparatus and method which processes fingerprint data input through a plurality of fingerprint sensors and uses the processed fingerprint data in authentication to thereby increase security and performance. The fingerprint authentication apparatus includes a first sensor configured to acquire first fingerprint data from a user; a second sensor configured to acquire second fingerprint data that is different from the first fingerprint data; and a control unit configured to determine whether or not to authenticate the user based on similarities obtained from the comparison of each of the first fingerprint data and the second fingerprint data with registered fingerprint data.

Abstract: The present invention relates to a slurry for chemical mechanical polishing, comprising an abrasive; an oxidant; an organic acid; and a polymeric additive comprising polyolefin-polyalkyleneoxide copolymer, wherein the polyolefin-polyalkyleneoxide copolymer comprises a polyolefin repeat unit and two or more polyalkyleneoxide repeat units, and at least one polyalkyleneoxide repeat unit is branched.

Abstract: This disclosure relates to a polishing pad for chemical mechanical polishing, having a shape where 3 or more semi-oval or semicircular curves that connect 2 valleys neighboring on the plane are connected, and including 2 or more modified patterns that are formed to a determined thickness on the polishing pad, wherein a peak of one modified pattern and a valley of another modified pattern neighboring thereto are sequentially located on the same line. The polishing pad may uniformly disperse slurry over the whole area during a polishing process to provide improved polishing uniformity, and appropriately control residence time of the slurry to increase polishing rate.

Abstract: Disclosed is CMP slurry, which includes a pyridine-based compound including at least two pyridinyl groups, and minimizes the occurrence of dishing and erosion of a wiring line.

Abstract: This disclosure relates to a polyurethane resin composition for a mounting pad, including a polyurethane resin, C9-15 alkyl benzene sulfonic acid or a salt thereof, and a DMF solvent, and a polyurethane mounting pad using the same, whereby long and large pores may be uniformly formed thereinside to provide a mounting pad having low hardness, excellent compressibility, and a high compression modulus.

Abstract: The present invention relates to an aqueous slurry composition for chemical mechanical polishing that can show good polishing rate to the target layer, and yet has a high polishing selectivity and can maintain superior surface condition of the target layer after polishing, and a chemical mechanical polishing method. The aqueous slurry composition for chemical mechanical polishing (CMP) includes abrasives; an oxidant; a complexing agent; and a polymeric additive including at least one selected from the group consisting of a polypropyleneoxide, a propyleneoxide-ethyleneoxide copolymer, and a compound represented by Chemical Formula 1.

Abstract: The present invention relates to a slurry composition for primary chemical mechanical polishing that can show more improved WIWNU (Within Wafer Non-Uniformity) while exhibiting excellent polishing rate and polishing selectivity, and a chemical mechanical polishing method. The slurry composition for primary chemical mechanical polishing comprises an abrasive; an oxidant, an organic acid; a specific corrosion inhibitor, and, a polymeric additive comprising polyvinylpyrrolidone having weight average molecular weight of about 3000 to 100000, and has polishing selectivity of polishing rates between a copper layer:a tantalum layer of about 30:1 or more.

Abstract: Disclosed is CMP slurry, which includes a pyridine-based compound including at least two pyridinyl groups, and minimizes the occurrence of dishing and erosion of a wiring line.

Abstract: A cerium oxide powder for one-component CMP slurry, which has a specific surface area of 5 m2/g or more, and a ratio of volume fraction of pores with a diameter of 3 nm or more to that of pores with a diameter less than 3 nm of 8:2˜2:8, is disclosed. A method for preparing the same, a one-component CMP slurry comprising the same as an abrasive material, and a method of shallow trench isolation using the one-component CMP slurry are also disclosed. The CMP slurry causes no precipitation of the cerium oxide powder even if it is provided as a one-component CMP slurry, because the CMP slurry uses, as an abrasive material, cerium oxide powder that is obtained via a low-temperature calcination step, optionally a pulverization step, and a high-temperature calcination step and has a high pore fraction and low strength.

Abstract: Disclosed is chemical mechanical polishing (CMP) slurry comprising: abrasive particles; an oxidant; a compound having at least two amine groups; a polycarboxylic acid; and water. The CMP slurry comprising a compound having at least two amine groups and a polycarboxylic acid provides an improved removal rate and selectivity of copper, while not adversely affecting the overall polishing rate, increases the planarization, and minimizes dishing and erosion problems.

Abstract: A method for modeling a roadway and a method for recognizing lane markers based on the modeling method. The method for recognizing lane markers of roadway for a vehicle by getting image information about the roadway and information about the speed and steering angle using a camera and a sensor attached to the vehicle, includes the steps of modeling the actual roadway on which the vehicle travels, as a structure having a plurality of rectangular plates linked to each other. The modeled plates are overlayed onto the image information about the actual roadway, photographed by the camera, pixels forming the lane markers are extracted, and linear lane marker information is then obtained from the pixels forming the land markers.