Abstract: This application describes cross-scale point cloud segmentation network architecture for and exemplary systems that utilize such network architecture for semantic segmentation of a point cloud. An embodiment of the network architecture includes an encoding path comprising a plurality of sequentially connected encoding nodes, a decoding path following the encoding path and comprising a plurality of sequentially connected decoding nodes, and a plurality of data links respectively corresponding to a plurality of levels of feature resolution, in which each of the plurality of data links connects one of the plurality of encoding nodes and one of the plurality of decoding nodes that have a same level of feature resolution.

Abstract: A learning model may provide a hierarchy of convolutional layers configured to perform convolutions upon image features, each layer other than a topmost layer convoluting the image features at a lower resolution to a higher layer, and each layer other than a bottommost layer returning the image features to a lower layer. Each layer fuses the lower resolution image features received from a higher layer with same resolution image features convoluted at the layer, so as to combine large-scale and small-scale features of images. Layers of the hierarchy may be substantially equal to a number of lateral convolutions at a bottommost convolutional layer. The bottommost convolutional layer ultimately passes the fused features to an attention mapping module, which utilizes two attention mapping pathways in combination to detect non-local dependencies and interactions between large-scale and small-scale features of images without de-emphasizing local interactions.

Abstract: In a Sapphire Collector (SC), one or more features, both structural and parametric, are included for capturing the die-size sapphire chips that are removed from a semiconductor structure during die-level laser lift-off (LLO). These features are designed to increase the likelihood that each sapphire chip is securely captured by the Sapphire Collector immediately after it is released from the semiconductor structure.

Abstract: In a Sapphire Collector (SC), one or more features, both structural and parametric, are included for capturing the die-size sapphire chips that are removed from a semiconductor structure during die-level laser lift-off (LLO). These features are designed to increase the likelihood that each sapphire chip is securely captured by the Sapphire Collector immediately after it is released from the semiconductor structure. The Sapphire Collector includes a vacuum-enhance collector with a pickup element that lifts each released chip into the collector, and air pushers that direct the chips further into the collection tunnel leading to a discard bin.

Abstract: A learning model may provide a hierarchy of convolutional layers configured to perform convolutions upon image features, each layer other than a topmost layer convoluting the image features at a lower resolution to a higher layer, and each layer other than a bottommost layer returning the image features to a lower layer. Each layer fuses the lower resolution image features received from a higher layer with same resolution image features convoluted at the layer, so as to combine large-scale and small-scale features of images. Layers of the hierarchy may be substantially equal to a number of lateral convolutions at a bottommost convolutional layer. The bottommost convolutional layer ultimately passes the fused features to an attention mapping module, which utilizes two attention mapping pathways in combination to detect non-local dependencies and interactions between large-scale and small-scale features of images without de-emphasizing local interactions.

Abstract: In a Sapphire Collector (SC), one or more features, both structural and parametric, are included for capturing the die-size sapphire chips that are removed from a semiconductor structure during die-level laser lift-off (LLO). These features are designed to increase the likelihood that each sapphire chip is securely captured by the Sapphire Collector immediately after it is released from the semiconductor structure.

Abstract: In a Sapphire Collector (SC), one or more features, both structural and parametric, are included for capturing the die-size sapphire chips that are removed from a semiconductor structure during die-level laser lift-off (LLO). These features are designed to increase the likelihood that each sapphire chip is securely captured by the Sapphire Collector immediately after it is released from the semiconductor structure. The Sapphire Collector includes a vacuum-enhance collector with a pickup element that lifts each released chip into the collector, and air pushers that direct the chips further into the collection tunnel leading to a discard bin.

Abstract: A covering assembly includes a base and a cover slidably mating with the base. The base includes a cavity bounded by a plurality of sidewalls, at least one slide-rail set on the sidewalls, a hole defined in at least one of the sidewalls, for allowing cables to extend therethrough, and a protrusion set on the at least one slide-rail. The cover includes a coping for covering the cavity, at least one fixing portion set on one side of the coping, configured for slidably engaging with the at least one slide-rail, and a gap defined in the at least one fixing portion configured for engaging with the protrusion to prevent the cover withdrawing from the base. A notebook computer incorporating the covering assembly is also disclosed.