Abstract: A vehicular air-conditioning apparatus includes a photocatalytic module in which light is radiated on a photocatalytic filter to sterilize the photocatalytic filter. In particular, vehicular air-conditioning apparatus incudes: a duct to allow conditioned air to flow therethrough; the photocatalytic filter mounted in the duct and coated with a photocatalytic material to remove harmful substances in reaction to light energy; and a rotation unit rotatably mounted in the duct. In particular, the rotation unit is provided with a light source to radiate light toward the photocatalytic filter. When the rotation unit is rotated, a position of the light source is changed in a rotational direction of the rotation unit such that the light is radiated on the photocatalytic filter over an increased range. Thus, a filter sterilization effect is improved over the entire area of the photocatalytic filter with reduced number of light sources.

Abstract: The present invention relates to a culture device and culture method for culturing a 3D cell aggregation and, specifically, to an overall technique for effectively culturing a 3D cell aggregation by using a culture device including a porous microwell, a membrane, and other additive components.

Abstract: A seat-interlocking leg rest control system includes: a first actuator configured to move a seat for a vehicle, the seat including a seat cushion and a seatback, in a forward-backward direction or an upward-downward direction of the vehicle; a second actuator configured to rotate a leg rest, rotatably coupled to the front end portion of the seat cushion, in the upward-downward direction; and a controller connected to the first actuator and the second actuator to control operation of the second actuator such that the rotation angle of the leg rest is limited based on the position of the seat.

Abstract: A sensor device includes: a sensor panel including sensors arranged in a matrix form and sensor lines electrically connected to the sensors one-to-one; and a sensor driver configured to receive sensing signals from the sensors through the sensor lines, wherein the sensor driver is configured to simultaneously receive a first sensing signal from a first sensor using a first reference signal and a second sensing signal from a second sensor using a second reference signal, wherein the first reference signal and the second reference signal have a same waveform, a phase of the second reference signal is different from a phase of the first reference signal, and wherein a phase of the second sensing signal is different from a phase of the first sensing signal.

Abstract: A data scrambling method for controlling a code density according to an exemplary embodiment of the present disclosure includes receiving a plain code which is a code to be stored in the non-volatile memory device and a storage address at which the plain code is recorded; determining a rank corresponding to the plain code, using an ET table including appearance frequency rank information corresponding to individual plain code; calculating an adjustment rank corresponding to the plain code, using the rank and a random number that is generated based on the address of storage address; determining a cipher code corresponding to the appearance frequency rank of the plain code, using the adjustment rank and an ECC table including rank information determined by an objective function for individual cipher code; and storing the cipher code in the storage address.

Abstract: An electronic device includes a display device, which may be fabricated using a described method. The display device includes a glass substrate including a first surface, a second surface opposite the first surface, and a side surface between the first surface and the second surface, an outermost structure on the first surface of the glass substrate and located adjacent to an edge of one side of the glass substrate, and a display area including a plurality of light emitting areas on the first surface of the glass substrate and located farther from the edge of the one side of the glass substrate than the outermost structure is. A minimum distance from the side surface of the glass substrate to the outermost structure is equal to 130 ?m or less.

Abstract: An apparatus for performing non-contact material characterization includes a wafer carrier adapted to hold a plurality of substrates and a material characterization device, such as a device for performing photoluminescence spectroscopy. The apparatus is adapted to perform non-contact material characterization on at least a portion of the wafer carrier, including the substrates disposed thereon.

Abstract: An apparatus for performing non-contact material characterization includes a wafer carrier adapted to hold a plurality of substrates and a material characterization device, such as a device for performing photoluminescence spectroscopy. The apparatus is adapted to perform non-contact material characterization on at least a portion of the wafer carrier, including the substrates disposed thereon.

Abstract: An apparatus for performing non-contact material characterization includes a wafer carrier adapted to hold a plurality of substrates and a material characterization device, such as a device for performing photoluminescence spectroscopy. The apparatus is adapted to perform non-contact material characterization on at least a portion of the wafer carrier, including the substrates disposed thereon.

Abstract: An apparatus for performing non-contact material characterization includes a wafer carrier adapted to hold a plurality of substrates and a material characterization device, such as a device for performing photoluminescence spectroscopy. The apparatus is adapted to perform non-contact material characterization on at least a portion of the wafer carrier, including the substrates disposed thereon.

Abstract: An apparatus for performing non-contact material characterization includes a wafer carrier adapted to hold a plurality of substrates and a material characterization device, such as a device for performing photoluminescence spectroscopy. The apparatus is adapted to perform non-contact material characterization on at least a portion of the wafer carrier, including the substrates disposed thereon.

Abstract: An apparatus for performing non-contact material characterization includes a wafer carrier adapted to hold a plurality of substrates and a material characterization device, such as a device for performing photoluminescence spectroscopy. The apparatus is adapted to perform non-contact material characterization on at least a portion of the wafer carrier, including the substrates disposed thereon.

Abstract: An apparatus for performing non-contact material characterization includes a wafer carrier adapted to hold a plurality of substrates and a material characterization device, such as a device for performing photoluminescence spectroscopy. The apparatus is adapted to perform non-contact material characterization on at least a portion of the wafer carrier, including the substrates disposed thereon.