Abstract: A light-emitting structure includes two outer shells configured to be joined together to cooperatively define a receiving space therein, a connecting assembly configured to join the two outer shells together, and two light-emitting assemblies coupled to the connecting assembly and configured to emit light inside the receiving space. The two outer shells define a number of viewing holes therein for viewing inside the receiving space. The light-emitting assemblies shine light from a number of different angles inside the receiving space.

Abstract: A light-emitting structure includes two outer shells configured to be joined together to cooperatively define a receiving space therein, a connecting assembly configured to join the two outer shells together, and two light-emitting assemblies coupled to the connecting assembly and configured to emit light inside the receiving space. The two outer shells define a number of viewing holes therein for viewing inside the receiving space. The light-emitting assemblies shine light from a number of different angles inside the receiving space.

Abstract: In a method for checking installation positions of probes of a star prober using a coordinate measurement device, the star prober is fixed vertically on a platform and supported by a movable arm, and a standard ball placed on the platform. The first probe measures a first point on a top surface of the standard ball, and the second probe measures a second point on the top surface of the standard ball. An X-Y coordinate system based on the first and second points is established, and a value of any deviation angle between the first probe and the second probe is calculated based on the X-Y coordinate system. The information is displayed for indicating whether the installations of the first and second probes are precise or not according to any deviation value, and the respective installations of the other individual probes are checked against the X-Y coordinate system.

Abstract: An optical module includes a first sleeve, a second sleeve, a connecting member and a beam splitter. The first sleeve defines a first hollow cavity and includes a first light source and a pattern plate. The second sleeve defines a second hollow cavity and a second light source. The connecting member is connected to the first sleeve and the second sleeve, and communicates with the first hollow cavity and the second hollow cavity. The beam splitter is positioned in the connecting member. Light from the first light source passes through the pattern plate, and the beam splitter, light from the second light source passes through the beam splitter, the beam splitter refracts the light from the first light source and the second light source to a tested workpiece.

Abstract: An integrated circuit system comprised by forming a first region, a second region and a third region within a dielectric over a substrate. The first region includes tungsten plugs. The second region is formed adjacent at least a portion of the perimeter of the first region and the third region is formed between the first region and the second region. An opening is formed in the third region and a material is deposited within the opening for preventing erosion of the first region.

Abstract: An integrated circuit system comprised by forming a first region, a second region and a third region within a dielectric over a substrate. The first region includes tungsten plugs. The second region is formed adjacent at least a portion of the perimeter of the first region and the third region is formed between the first region and the second region. An opening is formed in the third region and a material is deposited within the opening for preventing erosion of the first region.

Abstract: An integrated circuit system comprised by forming a first region, a second region and a third region within a dielectric over a substrate. The first region includes tungsten plugs. The second region is formed adjacent at least a portion of the perimeter of the first region and the third region is formed between the first region and the second region. An opening is formed in the third region and a material is deposited within the opening for preventing erosion of the first region.

Abstract: An integrated circuit system comprised by forming a first region, a second region and a third region within a dielectric over a substrate. The first region includes tungsten plugs. The second region is formed adjacent at least a portion of the perimeter of the first region and the third region is formed between the first region and the second region. An opening is formed in the third region and a material is deposited within the opening for preventing erosion of the first region.