Patents by Inventor Dong Su Ryu
Dong Su Ryu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240165824Abstract: Disclosed herein is an inspection robot system for the customs inspection of container-loaded cargo. The inspection robot system includes: an attachment-type mobile robot configured to drive in the state of being attached to the top surface of a container; and a flexible robot system configured to interface with the attachment-type mobile robot, to selectively accommodate and extend a flexible robot having multiple degrees of freedom, and to perform inspection on cargo.Type: ApplicationFiled: August 23, 2023Publication date: May 23, 2024Applicants: Korea Advanced Institute of Science and Technology, UJIN Technology, Inc.Inventors: Ki Uk KYUNG, Jee Hwan RYU, Ye Sung YI, Hee Ju MUN, Ji Sung KIM, Dong Geol LEE, Joong Ku LEE, Young Geun KIM, Gee Joon EUM, Hyun Su KIM, Hyun Soo JO
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Publication number: 20240162113Abstract: In one example, an electronic device comprises a substrate comprising a conductive structure and an inner side and an outer side, a first electronic component over the inner side of the substrate and coupled with the conductive structure, a lid over the substrate and the first electronic component and comprising a first hole in the lid, and a thermal interface material between the first electronic component and the lid. The thermal interface material is in the first hole. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: November 11, 2022Publication date: May 16, 2024Applicants: Amkor Technology Singapore Holding Pte. Ltd., Amkor Technology Singapore Holding Pte. Ltd.Inventors: Dong Hyeon Park, Yun Ah Kim, Seok Ho Na, Won Ho Choi, Dong Su Ryu, Jo Hyun Bae, Min Jae Kong, Jin Young Khim, Jae Yeong Bae, Dong Hee Kang
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Patent number: 11955755Abstract: Provided are an electric appliance and a method of manufacturing the same, the electric appliance having a smaller size and a reduced overall weight by preventing a fluid from flowing into a space unrelated to a heating component in a state where the fluid fills its case. The electric appliance includes: a case including a first space and a second space communicated to each other; a first component disposed in the first space; a second component disposed in the second space; a connection portion electrically connecting the first component and the second component to each other; and a potting pattern including a resin material and formed in the first space.Type: GrantFiled: November 18, 2021Date of Patent: April 9, 2024Assignee: SOLUM CO., LTD.Inventors: Young Jun Jang, Hyun Su Kim, Jun Kyu Lee, Pill Ju Kim, Sang Keun Ji, Dong Kyun Ryu
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Publication number: 20240088432Abstract: An embodiment sulfur dioxide-based inorganic electrolyte is provided in which the sulfur dioxide-based inorganic electrolyte is represented by a chemical formula M·(A1·Cl(4-x)Fx)z·ySO2. In this formula, M is a first element selected from the group consisting of Li, Na, K, Ca, and Mg, A1 is a second element selected from the group consisting of Al, Fe, Ga, and Cu, x satisfies a first equation 0?x?4, y satisfies a second equation 0?y?6, and z satisfies a third equation 1?z?2.Type: ApplicationFiled: April 12, 2023Publication date: March 14, 2024Inventors: Kyu Ju Kwak, Won Keun Kim, Eun Ji Kwon, Samuel Seo, Yeon Jong Oh, Kyoung Han Ryu, Dong Hyun Lee, Han Su Kim, Ji Whan Lee, Seong Hoon Choi, Seung Do Mun
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Publication number: 20240006337Abstract: In one example, an electronic device includes a substrate having an upper side, a lower side opposite to the upper side, a lateral side connecting the upper side to the lower side, and a conductive structure. An electronic component is coupled to the conductive structure at the upper side of the substrate. An encapsulant covers a lateral side of the electronic component and the upper side of the substrate and having an encapsulant top side and an encapsulant lateral side. The electronic device includes first metallic coating having a first metallic coating top side, a first metallic coating sidewall; and a first metallic coating thickness. The electronic device includes a second metallic coating having a second metallic coating thickness that is greater than the first metallic coating thickness.Type: ApplicationFiled: June 29, 2022Publication date: January 4, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Akito YOSHIDA, Glen SIEW, Dong Su RYU, Min Jae KONG, Jo Hyun BAE
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Publication number: 20230411342Abstract: In one example, a system comprises a laser assisted bonding (LAB) tool. The LAB tool comprises a stage block and a first lateral laser source facing the stage block from a lateral side of the stage block. The stage block is configured to support a substrate and a first electronic component coupled with the substrate, and the first electronic component comprises a first interconnect. The first lateral laser source is configured to emit a first lateral laser beam laterally toward the stage block to induce a first heat on the first interconnect to bond the first interconnect with the substrate. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: August 31, 2023Publication date: December 21, 2023Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Dong Hyeon Park, Min Ho Kim, Dong Su Ryu, Seok Ho Na, Choong Hoe Kim, Yun Seok Song, Woo Kyung Ju, Dong Joo Park
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Patent number: 11749637Abstract: In one example, a method to manufacture a semiconductor device comprises providing an electronic component over a substrate, wherein an interconnect of the electronic component contacts a conductive structure of the substrate, providing the substrate over a laser assisted bonding (LAB) tool, wherein the LAB tool comprises a stage block with a window, and heating the interconnect with a laser beam through the window until the interconnect is bonded with the conductive structure. Other examples and related methods are also disclosed herein.Type: GrantFiled: June 23, 2020Date of Patent: September 5, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Min Ho Kim, Seok Ho Na, Dong Hyeon Park, Choong Hoe Kim, Woo Kyung Ju, Yun Seok Song, Dong Su Ryu
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Publication number: 20230088061Abstract: In one example, a system comprises a laser assisted bonding (LAB) tool. The LAB tool comprises a stage block and a first lateral laser source facing the stage block from a lateral side of the stage block. The stage block is configured to support a substrate and a first electronic component coupled with the substrate, and the first electronic component comprises a first interconnect. The first lateral laser source is configured to emit a first lateral laser beam laterally toward the stage block to induce a first heat on the first interconnect to bond the first interconnect with the substrate. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: November 29, 2022Publication date: March 23, 2023Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Dong Hyeon Park, Min Ho Kim, Dong Su Ryu, Seok Ho Na, Choong Hoe Kim, Yun Seok Song, Woo Kyung Ju, Dong Joo Park
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Publication number: 20210398940Abstract: In one example, a method to manufacture a semiconductor device comprises providing an electronic component over a substrate, wherein an interconnect of the electronic component contacts a conductive structure of the substrate, providing the substrate over a laser assisted bonding (LAB) tool, wherein the LAB tool comprises a stage block with a window, and heating the interconnect with a laser beam through the window until the interconnect is bonded with the conductive structure. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: June 23, 2020Publication date: December 23, 2021Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Min Ho Kim, Seok Ho Na, Dong Hyeon Park, Choong Hoe Kim, Woo Kyung Ju, Yun Seok Song, Dong Su Ryu
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Publication number: 20210398936Abstract: In one example, a system can comprise a laser assisted bonding (LAB) tool comprising a stage block and a laser source facing the stage block. The stage block can be configured to support a first substrate and a first electronic component coupled with the first substrate, the first electronic component comprising a first interconnect. The laser source can be configured to emit a first laser towards the stage block to induce a first heat on the first interconnect to bond the first interconnect with the first substrate. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: April 29, 2021Publication date: December 23, 2021Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Dong Hyeon Park, Min Ho Kim, Dong Su Ryu, Seok Ho Na, Choong Hoe Kim, Yun Seok Song, Woo Kyung Ju
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Patent number: 9627348Abstract: Laser assisted bonding for semiconductor die interconnections is disclosed and may, for example, include forming flux on a circuit pattern on a circuit board, placing a semiconductor die on the circuit board where a bump on the semiconductor die contacts the flux, and reflowing the bump by directing a laser beam toward the semiconductor die. The laser beam may volatize the flux and make an electrical connection between the bump and the circuit pattern. A jig plate may be placed on the semiconductor die when the laser beam is directed toward the semiconductor die. Warpage may be reduced during heating or cooling of the semiconductor die by applying pressure to the jig plate. Jig bars may extend outward from the jig plate and may be in contact with the circuit board during the application of pressure to the jig plate. The jig plate may comprise one or more of: silicon, silicon carbide, and glass.Type: GrantFiled: January 8, 2015Date of Patent: April 18, 2017Assignee: AMKOR TECHNOLOGY, INC.Inventors: Dong Su Ryu, Choon Heung Lee, Min Ho Kim, Choong Hoe Kim, Ju Hoon Yoon, Chan Ha Hwang, Yang Gyoo Jung
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Publication number: 20160049381Abstract: Laser assisted bonding for semiconductor die interconnections is disclosed and may, for example, include forming flux on a circuit pattern on a circuit board, placing a semiconductor die on the circuit board where a bump on the semiconductor die contacts the flux, and reflowing the bump by directing a laser beam toward the semiconductor die. The laser beam may volatize the flux and make an electrical connection between the bump and the circuit pattern. A jig plate may be placed on the semiconductor die when the laser beam is directed toward the semiconductor die. Warpage may be reduced during heating or cooling of the semiconductor die by applying pressure to the jig plate. Jig bars may extend outward from the jig plate and may be in contact with the circuit board during the application of pressure to the jig plate. The jig plate may comprise one or more of: silicon, silicon carbide, and glass.Type: ApplicationFiled: January 8, 2015Publication date: February 18, 2016Inventors: Dong Su Ryu, Choon Heung Lee, Min Ho Kim, Choong Hoe Kim, Ju Hoon Yoon, Chan Ha Hwang, Yang Gyoo Jung
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Patent number: 7030508Abstract: Disclosed is a substrate for semiconductor package and a wire bonding method using thereof. The substrate is provided with at least one reference mark on its surface to check a loading position and a shift state of a solder mask. The reference mark is composed of a combination of a reference pattern and a solder mask opening and is positioned in any location on an outer peripheral edge of a die attachment region. The reference mark may take various shapes. A method for checking a solder mask shift using the reference mark includes comparing a design value of the reference pattern and the solder mask opening with the reference pattern and the solder mask opening, which are formed in an actual material. After the solder mask shift is calculated, a wire bonding coordinate is newly constructed in consideration of the solder mask shift. This minimizes the wire bonding error.Type: GrantFiled: July 1, 2004Date of Patent: April 18, 2006Assignee: Amkor Technology, Inc.Inventors: Dong Su Ryu, Doo Hyun Park, Ho Seok Kim