Abstract: The process of the present invention is simplified by skipping the die bonding step, the wire bonding step and the trim-forming step of the conventional techniques. A semiconductor device may include: a plurality of bonding pads formed on the surface of the chip for connecting the internal circuit of the chip to an outer circuit; an insulating layer for insulating the surface of the chip, having a height higher than the height of the bonding pads, and formed on the whole surface of the chip except the portions where the bonding pads are formed; a plurality of bumps attached to the bonding pads; a plurality of pad type leads attached to the bumps; and a molding resin for covering the whole surface of the chip except the portions where the leads are disposed.