Abstract: A protective device (10) for protecting thermal interface material (30) spread on a central surface (512) of a bottom of a base (51) of a heat sink (50). The device includes a case (12) and a tab (18) extending from an edge of the case. The heat sink (50) has air channels (552) extending vertically therethrough and around the base. The case comprises an annular frame (120) and a cap (15) protruding downwardly from inside edges of the frame. The cap covers the thermal interface material. The frame is attached to the heat sink around the thermal interface material. The frame blocks portions of the air channels adjacent to the base, thereby to prevent dust or foreign particles from contaminating the thermal interface material through the air channels.

Abstract: A foam device for use in an electronic device includes a foam and a foam cover for supporting and fixing the foam in position. The foam cover includes a supporting layer and an isolating layer disposed between the supporting layer and a first end of the foam. The isolating layer nonadhesively contacts the foam. The supporting layer adhesively contacts a second end of the foam.

Abstract: An electronic system comprises an enclosure, a printed circuit board in the enclosure, and a heat sink assembly comprising a holding member. The enclosure comprises a first panel and a second panel perpendicularly connecting with the first panel. The printed circuit board is mounted on the first panel of the enclosure. The heat sink assembly has a first end mounted on the printed circuit board for contacting a heat-generating electronic device on the printed circuit board, and a second end opposite to the first end. The holding member connects the second panel of the enclosure with the second end of the heat sink assembly.

Abstract: A heat sink assembly includes a heat sink and a clip for mounting the heat sink to an electronic component of a printed circuit board. The heat sink includes a base and a plurality of fins extending from the base. The clip includes a pressing member and a pair of elongated arms formed on opposite ends of the pressing member. The pressing member has a lower portion protruding toward the base of the heat sink. A middle one of the fins extends upwardly through the pressing member in a manner such that the lower portion of the pressing member resiliently abuts against the heat sink. The two arms are located on opposite lateral sides of the heat sink and bent downwardly to engage with the printed circuit board so that the pressing member exerts a force on the heat sink toward the electronic component.

Abstract: A heat dissipation device assembly includes a heat dissipation device mounted on a printed circuit board and a retainer device mounted below the printed circuit board. The retainer device includes a back plate and a crank pivotably mounted to the back plate. The crank includes a pressing portion and a handle for receiving a rotation force. Posts are extended from the heat dissipation device through the printed circuit board to engage with the back plate, thereby to pre-assemble the heat dissipation device on the printed circuit board. The handle is pushed to rotate between a released position and a locked position. In the locked position, the pressing portion extends through the back plate to push the printed circuit board toward the heat dissipation device, whereby an electronic component on the printed circuit board has an intimate contact with the heat dissipation device.

Abstract: A heat dissipation device includes a heat sink (10) and a fan (30) mounted on the heat sink via a pair of fan holders (20) and clips (40). The fan holders each have a supporting plate (24) attached on the heat sink and a sleeve (26) connected to the supporting plate and spaced from the supporting plate. The fan has upper and lower flanges (32, 34). The lower flange is sandwiched between the sleeve and the supporting plate. The clips each include a shaft (42) extending through the sleeve, a spring (44) mounted around and received in sleeve, and a handle (46) pivotably mounted on the shaft and movable between unlocked and locked positions. When the handle is positioned at the locked position, the shaft is inserted in the lower flange of the fan to thereby secure the fan on the heat sink.

Abstract: A heat sink assembly includes an unit and a plurality of fasteners extending through the unit for fixing the unit to a heat-generating electronic component. Each fastener comprises a bolt and a supporting clip mounted on the bolt and located at a bottom of the heat sink. The supporting clip comprises a body and a support extending from the body. When the bolt of each fastener extends through the unit and the body of the supporting clip, a distance between the bottom of the unit and the heat-generating electronic component remains unchanged with the help of the support of the supporting clip.

Abstract: A heat sink assembly includes an unit and a plurality of fasteners extending through the unit for fixing the unit to a heat-generating electronic component. Each fastener comprises a bolt and a supporting clip mounted on the bolt and located at a bottom of the heat sink. The supporting clip comprises a body and a support extending from the body. When the bolt of each fastener extends through the unit and the body of the supporting clip, a distance between the bottom of the unit and the heat-generating electronic component remains unchanged with the help of the support of the supporting clip.

Abstract: A locking device used for locking a heat sink to an electronic device, includes two clips each having a clamping portion. The clamping portion of each has a first pressing portion, a second pressing portion spaced from and in alignment with the first pressing portion, and a catch depending between the first and second pressing portions. An operating portion extends from the second pressing portion of the clamping portion. The retention module includes a bottom with an opening defined therein, and two pairs of first and second clasps extending from the bottom for locking the two clips. When the retention module and the clips are in a locked position, the catches of the clips engage with the first clasps of the retention module, the operating portions engage with the second clasps of the retention module.

Abstract: A protective device (10) for protecting thermal interface material (30) spread on a central surface (512) of a bottom of a base (51) of a heat sink (50). The device includes a case (12) and a tab (18) extending from an edge of the case. The heat sink (50) has air channels (552) extending vertically therethrough and around the base. The case comprises an annular frame (120) and a cap (15) protruding downwardly from inside edges of the frame. The cap covers the thermal interface material. The frame is attached to the heat sink around the thermal interface material. The frame blocks portions of the air channels adjacent to the base, thereby to prevent dust or foreign particles from contaminating the thermal interface material through the air channels.

Abstract: An electronic system comprises an enclosure, a printed circuit board in the enclosure, and a heat sink assembly comprising a holding member. The enclosure comprises a first panel and a second panel perpendicularly connecting with the first panel. The printed circuit board is mounted on the first panel of the enclosure. The heat sink assembly has a first end mounted on the printed circuit board for contacting a heat-generating electronic device on the printed circuit board, and a second end opposite to the first end. The holding member connects the second panel of the enclosure with the second end of the heat sink assembly.

Abstract: A heat dissipation device assembly includes a heat dissipation device mounted on a printed circuit board and a retainer device mounted below the printed circuit board. The retainer device includes a back plate and a crank pivotably mounted to the back plate. The crank includes a pressing portion and a handle for receiving a rotation force. Posts are extended from the heat dissipation device through the printed circuit board to engage with the back plate, thereby to pre-assemble the heat dissipation device on the printed circuit board. The handle is pushed to rotate between a released position and a locked position. In the locked position, the pressing portion extends through the back plate to push the printed circuit board toward the heat dissipation device, whereby an electronic component on the printed circuit board has an intimate contact with the heat dissipation device.

Abstract: A heat dissipation device includes a retention module (60), a heat sink (10), a fan bracket (50), a fan (70) mounted on the fan bracket, and a pair of wire clips (30) cooperating with the fan bracket and the retention module to secure the heat sink to a heat-generating electronic element (82). The retention module forms a pair of fixture blocks (64) at a pair of lateral sidewalls thereof. The heat sink defines grooves (160) at lateral sides thereof. Each of the clips includes an operating portion (356) fastened to the fan bracket, a central axle (33) connecting with the operating portion and a locking portion (31) connecting with the central axle. Each central axle is slidably engaged in corresponding grooves of the heat sink and the locking portions of the clips engage with the fixture blocks of the retention module.

Abstract: A heat sink assembly comprises a heat sink (20) and a locking device assembly (30) for mounting the heat sink to an electronic component (44) of a printed circuit board (40). A channel (25) is defined in the heat sink. The locking device assembly comprises a pressing member (31) and a pair of wire clips (33) pivotably engaging with opposite ends of the pressing member. The pressing member spans across the channel in a manner such that the pressing member resiliently abuts against the heat sink. The wire clips are located at opposite lateral sides of the heat sink and engage with clasps (42) on the printed circuit board. Use of the locking device assembly can prevent the heat sink from being held at a slant relative to the electronic component.

Abstract: A heat sink assembly includes a heat sink and a clip for mounting the heat sink to an electronic component of a printed circuit board. The heat sink includes a base and a plurality of fins extending from the base. The clip includes a pressing member and a pair of elongated arms formed on opposite ends of the pressing member. The pressing member has a lower portion protruding toward the base of the heat sink. A middle one of the fins extends upwardly through the pressing member in a manner such that the lower portion of the pressing member resiliently abuts against the heat sink. The two arms are located on opposite lateral sides of the heat sink and bent downwardly to engage with the printed circuit board so that the pressing member exerts a force on the heat sink toward the electronic component.

Abstract: A heat dissipation device includes a retention module (40) and a heat sink (10) both mounted on the printed circuit board (50). The retention module forms a pair of opposite fixture blocks (44) thereon. The heat sink received in the retention module has protective hollow sleeves (28) positioned corresponding to the blocks. Each sleeve has a supporting pad (286) therein. A pair of braces (32) each extend through the sleeve and comprise a baffle portion (321) located above the pad and a fastening portion (324) below a bottom end of the sleeve. A spring (33) is compressed between the baffle portion of the brace and the pad of each of the sleeves. The fastening portions of the braces securely fasten the blocks of the retention module after the first springs are stretched a distance with an upward movement of the braces.

Abstract: A heat dissipation device with a heat pipe includes a base for thermally engaging with an electronic device, a first fin assembly and a second fin assembly arranged on the base, and a heat pipe thermally connecting the first and second fin assemblies with the base. The first fin assembly has a first contacting face defining two grooves and the second assembly has a second contacting face facing to the first contacting face defining two grooves. The heat pipe includes an evaporation section thermally connecting with the base and the first and second fin assemblies, a first condensation section and a second condensation section respectively thermally engaging in the grooves of the first contacting face of the first fin assembly and the second contacting face of the second fin assembly.

Abstract: A heat sink assembly comprises a heat sink (20) and a locking device assembly (30) for mounting the heat sink to an electronic component (44) of a printed circuit board (40). A channel (25) is defined in the heat sink. The locking device assembly comprises a pressing member (31) and a pair of wire clips (33) pivotably engaging with opposite ends of the pressing member. The pressing member spans across the channel in a manner such that the pressing member resiliently abuts against the heat sink. The wire clips are located at opposite lateral sides of the heat sink and engage with clasps (42) on the printed circuit board. Use of the locking device assembly can prevent the heat sink from being held at a slant relative to the electronic component.

Abstract: A heat dissipation device adapted for dissipating heat of a CPU and other electronic components such as MOSFETS mounted on a printed circuit board, includes a base mounted on the CPU, a fin set disposed on the base and a fan attached to a lateral side of the base and the fin set. The lateral side of the base is provided with an air-guiding part facing the fan, to guide a lower portion of airflow generated by the fan to pass through the electronic components such as MOSFETS mounted on the printed circuit board and around the CPU. An upper portion of the airflow flows through the fin set.

Abstract: An electronic device assembly includes a PCB (10), a heat sink (30) mounted on the PCB, a back plate (20) attached below the PCB, a fan holder (40) mounted on a top of the heat sink and a fan mounted on the fan holder. The fan holder has a plurality of sleeves (46). A plurality of clips (50) is assembled on the fan holder. Each clip includes a locking column (52) received in a corresponding sleeve of the fan holder, a shank (56) extending through the column, a spring (54) mounted around the column and sandwiched between a top of the column and a bottom of the shank, and an operating member (58) pivotably connected to the shank. The back plate forms a plurality of studs snappingly engaging with the locking columns to securely mount the heat sink on the PCB.