Patents by Inventor Dong-Hae Son

Dong-Hae Son has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • APPARATUS TO PERFORM A NON-CONTACT TEST OF A SEMICONDUCTOR PACKAGE
    Publication number: 20140104411
    Abstract: An apparatus to test a semiconductor package includes a vertical illuminator to supply vertical illumination in the same axial direction as a measurement target and a vertical image unit to capture a vertical image of the measurement target so that a testing apparatus may 2-dimensionally determine information on the shape, size, or position of a solder ball. An inclined illuminator may supply inclined illumination in a different axial direction from the measurement target, and an inclined image capture unit may capture a side image of the measurement target so that the testing apparatus may 3-dimensionally determine information on a state of contact of the solder ball with the ball land. The inclined image capture unit may include a color camera using color information, thereby markedly increasing test reliability and yield.
    Type: Application
    Filed: November 8, 2012
    Publication date: April 17, 2014
    Applicant: SAMSUNG Electronics Co., Ltd
    Inventors: Chang-Hyun RYU, Ssang-Gun LIM, Dong-Hae SON, Poom-Seong PARK
  • Apparatus to perform a non-contact test of a semiconductor package
    Patent number: 8319961
    Abstract: An apparatus to test a semiconductor package includes a vertical illuminator to supply vertical illumination in the same axial direction as a measurement target and a vertical image unit to capture a vertical image of the measurement target so that a testing apparatus may 2-dimensionally determine information on the shape, size, or position of a solder ball. An inclined illuminator may supply inclined illumination in a different axial direction from the measurement target, and an inclined image capture unit may capture a side image of the measurement target so that the testing apparatus may 3-dimensionally determine information on a state of contact of the solder ball with the ball land. The inclined image capture unit may include a color camera using color information, thereby markedly increasing test reliability and yield.
    Type: Grant
    Filed: December 8, 2009
    Date of Patent: November 27, 2012
    Assignees: SAMSUNG Electronics Co., Ltd., INTEKPLUS Co., Ltd.
    Inventors: Chang-Hyun Ryu, Ssang-Gun Lim, Dong-Hae Son, Poom-Seong Park
  • APPARATUS TO PERFORM A NON-CONTACT TEST OF A SEMICONDUCTOR PACKAGE
    Publication number: 20100141937
    Abstract: An apparatus to test a semiconductor package includes a vertical illuminator to supply vertical illumination in the same axial direction as a measurement target and a vertical image unit to capture a vertical image of the measurement target so that a testing apparatus may 2-dimensionally determine information on the shape, size, or position of a solder ball. An inclined illuminator may supply inclined illumination in a different axial direction from the measurement target, and an inclined image capture unit may capture a side image of the measurement target so that the testing apparatus may 3-dimensionally determine information on a state of contact of the solder ball with the ball land. The inclined image capture unit may include a color camera using color information, thereby markedly increasing test reliability and yield.
    Type: Application
    Filed: December 8, 2009
    Publication date: June 10, 2010
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Chang-Hyun Ryu, Ssang-Gun Lim, Dong-Hae Son, Poom-Seong Park