Abstract: An air conditioner includes an outdoor unit, a plurality of mode change devices including at least one mode changer including a branch duct and a changing valve, and configured to receive a control signal from the outdoor unit to control an operation of the at least one mode changer. A plurality of indoor units are connected to the outdoor unit or the plurality of mode change devices. The outdoor unit may determine an operation mode to operate the plurality of mode change devices a plurality of times. Each of the plurality of indoor units may detect a temperature change of an indoor heat exchanger in response to the operation of the mode change devices, to determine the number of connected mode changers and a connectable mode changer candidate group based on the temperature change of the indoor heat exchanger.

Abstract: Methods and systems for executing tracking and monitoring manufacturing data of a battery are disclosed. One method includes: receiving, by a server system, sensing data of the battery from a sensing system; generating, by the server system, mapping data based on the sensing data; generating, by the server system, identification data of the battery based on the sensing data; generating, by the server system, monitoring data of the battery based on the sensing data, the identification data, and the mapping data; and generating, by the server system, display data for displaying a simulated electrode of the battery on a graphical user interface based on the monitoring data of the battery.

Abstract: Provided are a secondary battery case and a method for manufacturing a secondary battery. The secondary battery case includes a can accommodating an electrode assembly and a top cap sealing an upper opening of the can. The top cap includes a top plate sealing the upper opening of the can, a filling hole passing through the top plate to fill an electrolyte into the can, and a protrusion protruding from the top plate on an upper portion of the filling hole. The protrusion is press-fitted into the filling hole to seal the filling hole. According to the present invention, the protrusion may protrude from the top plate. Thus, the protrusion may be press-fitted into the filling hole and thus broken to seal the filling hole. Therefore, the member for sealing the filling hole may be integrated with the top plate to reduce manufacturing costs and simplify a manufacturing process.

Abstract: Provided are a secondary battery case and a method for manufacturing a secondary battery. The secondary battery case includes a can accommodating an electrode assembly and a top cap sealing an upper opening of the can. The top cap includes a top plate sealing the upper opening of the can, a filling hole passing through the top plate to fill an electrolyte into the can, and a protrusion protruding from the top plate on an upper portion of the filling hole. The protrusion is press-fitted into the filling hole to seal the filling hole. According to the present invention, the protrusion may protrude from the top plate. Thus, the protrusion may be press-fitted into the filling hole and thus broken to seal the filling hole. Therefore, the member for sealing the filling hole may be integrated with the top plate to reduce manufacturing costs and simplify a manufacturing process.

Abstract: A CMOS image sensor and fabricating method thereof are disclosed, by which a light condensing effect is enhanced by providing an inner microlens to a semiconductor substrate. The present invention includes a plurality of photodiodes on a semiconductor substrate, a plurality of inner microlenses on a plurality of the photodiodes, an insulating interlayer on a plurality of the inner microlenses, a plurality of metal lines within the insulating interlayer, a device protecting layer on the insulating interlayer, and a plurality of microlenses on the device protecting layer.

Abstract: A fabricating method of a CMOS image sensor is disclosed, by which a light condensing effect is enhanced by providing an inner microlens to a semiconductor substrate. The CMOS image sensor includes a plurality of photodiodes on a semiconductor substrate, a plurality of inner microlenses on a plurality of the photodiodes, an insulating interlayer on a plurality of the inner microlenses, a plurality of metal lines within the insulating interlayer, a device protecting layer on the insulating interlayer, and a plurality of microlenses on the device protecting layer.