Patents by Inventor Dongshun TIAN

Dongshun TIAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Server node ID address recognition device
    Patent number: 11646949
    Abstract: Disclosed is a server node ID address recognition device, including: a first recognition module, arranged in a cabinet and provided with a light entrance hole and a plurality of light exit holes; a plurality of case vertical plates arranged in the cabinet, each including a light exit hole and a plurality of light entrance holes, and a number and positions of the light entrance holes in each case vertical plate are configured to be associated with an ID address; and a second recognition module arranged on a server, including a light source, the second recognition module is provided with a light exit hole and a plurality of light entrance holes corresponding to the first recognition module.
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: May 9, 2023
    Assignee: INSPUR SUZHOU INTELLIGENT TECHNOLOGY CO., LTD.
    Inventors: Dongshun Tian, Ziqiang Cheng
  • SERVER NODE ID ADDRESS RECOGNITION DEVICE
    Publication number: 20230043550
    Abstract: Disclosed is a server node ID address recognition device, including: a first recognition module, arranged in a cabinet and provided with a light entrance hole and a plurality of light exit holes; a plurality of case vertical plates arranged in the cabinet, each including a light exit hole and a plurality of light entrance holes, and a number and positions of the light entrance holes in each case vertical plate are configured to be associated with an ID address; and a second recognition module arranged on a server, including a light source, the second recognition module is provided with a light exit hole and a plurality of light entrance holes corresponding to the first recognition module.
    Type: Application
    Filed: February 24, 2021
    Publication date: February 9, 2023
    Inventors: Dongshun TIAN, Ziqiang CHENG