Patents by Inventor Dongsung Hong
Dongsung Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Recessed hardmask used to form heat-assisted magnetic recording near-field transducer with heat sink
Patent number: 11456008Abstract: A method involves depositing a near-field transducer on a substrate of a slider. The near-field transducer comprises a plate-like enlarged portion and a peg portion. A first hard stop extending from the near field transducer and an air bearing surface is formed. A heat sink is formed on the enlarged portion and the first hard stop. A dielectric material is deposited over the near-field transducer and the heat sink. A second hard stop is deposited on the dielectric material away from the air bearing surface. The second hard stop comprises a recess corresponding in size and location to the heat sink. The method involves milling at an oblique angle to the substrate between the first hard stop and second hard stop to cut through the heat sink at the angle. The recess of the second hard stop increases a milling rate over the heat sink compared to a second milling rate of the dielectric away from the heat sink.Type: GrantFiled: March 4, 2019Date of Patent: September 27, 2022Assignee: Seagate Technology LLCInventors: Anusha Natarajarathinam, Yongjun Zhao, Hui Brickner, Dongsung Hong -
Patent number: 11015256Abstract: Methods of forming near field transducers (NFTs) including electrodepositing a plasmonic material.Type: GrantFiled: October 15, 2018Date of Patent: May 25, 2021Assignee: Seagate Technology LLCInventors: Lien Lee, Jie Gong, Venkatram Venkatasamy, Yongjun Zhao, Lijuan Zou, Dongsung Hong, Ibro Tabakovic, Mark Ostrowski
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Publication number: 20190198046Abstract: A method involves depositing a near-field transducer on a substrate of a slider. The near-field transducer comprises a plate-like enlarged portion and a peg portion. A first hard stop extending from the near field transducer and an air bearing surface is formed. A heat sink is formed on the enlarged portion and the first hard stop. A dielectric material is deposited over the near-field transducer and the heat sink. A second hard stop is deposited on the dielectric material away from the air bearing surface. The second hard stop comprises a recess corresponding in size and location to the heat sink. The method involves milling at an oblique angle to the substrate between the first hard stop and second hard stop to cut through the heat sink at the angle. The recess of the second hard stop increases a milling rate over the heat sink compared to a second milling rate of the dielectric away from the heat sink.Type: ApplicationFiled: March 4, 2019Publication date: June 27, 2019Inventors: Anusha Natarajarathinam, Yongjun Zhao, Hui Brickner, Dongsung Hong
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Patent number: 10224064Abstract: A method involves depositing a near-field transducer on a substrate of a slider. The near-field transducer comprises a plate-like enlarged portion and a peg portion. A first hard stop extending from the near field transducer and an air bearing surface is formed. A heat sink is formed on the enlarged portion and the first hard stop. A dielectric material is deposited over the near-field transducer and the heat sink. A second hard stop is deposited on the dielectric material away from the air bearing surface. The second hard stop comprises a recess corresponding in size and location to the heat sink. The method involves milling at an oblique angle to the substrate between the first hard stop and second hard stop to cut through the heat sink at the angle. The recess of the second hard stop increases a milling rate over the heat sink compared to a second milling rate of the dielectric away from the heat sink.Type: GrantFiled: January 4, 2016Date of Patent: March 5, 2019Assignee: Seagate Technology LLCInventors: Anusha Natarajarathinam, Yongjun Zhao, Hui Brickner, Dongsung Hong
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Publication number: 20190048487Abstract: Methods of forming near field transducers (NFTs) including electrodepositing a plasmonic material.Type: ApplicationFiled: October 15, 2018Publication date: February 14, 2019Inventors: Lien Lee, Jie Gong, Venkatram Venkatasamy, Yongjun Zhao, Lijuan Zou, Dongsung Hong, Ibro Tabakovic, Mark Ostrowski
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Patent number: 10100422Abstract: Methods of forming near field transducers (NFTs) including electrodepositing a plasmonic material.Type: GrantFiled: September 25, 2013Date of Patent: October 16, 2018Assignee: Seagate Technology LLCInventors: Lien Lee, Jie Gong, Venkatram Venkatasamy, Yongjun Zhao, Lijuan Zou, Dongsung Hong, Ibro Tabakovic, Mark Ostrowski
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Publication number: 20170194022Abstract: A method involves depositing a near-field transducer on a substrate of a slider. The near-field transducer comprises a plate-like enlarged portion and a peg portion. A first hard stop extending from the near field transducer and an air bearing surface is formed. A heat sink is formed on the enlarged portion and the first hard stop. A dielectric material is deposited over the near-field transducer and the heat sink. A second hard stop is deposited on the dielectric material away from the air bearing surface. The second hard stop comprises a recess corresponding in size and location to the heat sink. The method involves milling at an oblique angle to the substrate between the first hard stop and second hard stop to cut through the heat sink at the angle. The recess of the second hard stop increases a milling rate over the heat sink compared to a second milling rate of the dielectric away from the heat sink.Type: ApplicationFiled: January 4, 2016Publication date: July 6, 2017Inventors: Anusha Natarajarathinam, Yongjun Zhao, Hui Brickner, Dongsung Hong
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Patent number: 9385089Abstract: When opaque films are deposited on semi-conductor wafers, underlying alignment marks may be concealed. The re-exposure of such alignment marks is one source of resulting surface topography. In accordance with one implementation, alignment marks embedded in a wafer may be exposed by removing material from one or more layers and by replacing such material with a transparent material. In accordance with another implementation, the amount of material removed in an alignment mark recovery process may be mitigated by selectively ashing or etching above a stop layer.Type: GrantFiled: January 30, 2013Date of Patent: July 5, 2016Assignee: SEAGATE TECHNOLOGY LLCInventors: Dongsung Hong, Lijuan Zou, Daniel Sullivan, Lily Horng Youtt
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Patent number: 9378757Abstract: The disclosed methods enable the production of plasmonic near-field transducers that are useful in heat-assisted magnetic recording. The plasmonic near-field transducers have an enlarged region and a peg region. The peg region includes a peg region in proximity to an air-bearing surface above a recording medium and also includes a flared region between and in contact with the enlarged region and the peg region. The flared region can act as a heat sink and can lower the thermal resistance of the peg portion of the near-field transducer, thus reducing its temperature.Type: GrantFiled: March 7, 2013Date of Patent: June 28, 2016Assignee: SEAGATE TECHNOLOGY LLCInventors: Yongjun Zhao, Dongsung Hong, Lijuan Zou, Mark Ostrowski
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Patent number: 9343089Abstract: Nanoimprint lithography can be used in a variety of ways to improve resolution, pattern fidelity and symmetry of microelectronic structures for thin film head manufacturing. For example, write poles, readers, and near-field transducers can be manufactured with tighter tolerances that improve the performance of the microelectronic structures. Further, entire bars of thin film heads can be manufactured simultaneously using nanoimprint lithography, which reduces or eliminated alignment errors between neighboring thin film heads in a bar of thin film heads.Type: GrantFiled: March 8, 2013Date of Patent: May 17, 2016Assignee: SEAGATE TECHNOLOGY LLCInventors: Andrew David Habermas, Dongsung Hong, Daniel Boyd Sullivan
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Publication number: 20150083601Abstract: Methods of forming near field transducers (NFTs) including electrodepositing a plasmonic material.Type: ApplicationFiled: September 25, 2013Publication date: March 26, 2015Applicant: SEAGATE TECHNOLOGY LLCInventors: Lien Lee, Jie Gong, Venkatram Venkatasamy, Yongjun Zhao, Lijuan Zou, Dongsung Hong, Ibro Tabakovic, Mark Ostrowski
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Publication number: 20140254338Abstract: Nanoimprint lithography can be used in a variety of ways to improve resolution, pattern fidelity and symmetry of microelectronic structures for thin film head manufacturing. For example, write poles, readers, and near-field transducers can be manufactured with tighter tolerances that improve the performance of the microelectronic structures. Further, entire bars of thin film heads can be manufactured simultaneously using nanoimprint lithography, which reduces or eliminated alignment errors between neighboring thin film heads in a bar of thin film heads.Type: ApplicationFiled: March 8, 2013Publication date: September 11, 2014Applicant: Seagate Technology LLCInventors: Andrew David Habermas, Dongsung Hong, Daniel Boyd Sullivan
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Publication number: 20140251948Abstract: The disclosed methods enable the production of plasmonic near-field transducers that are useful in heat-assisted magnetic recording. The plasmonic near-field transducers have an enlarged region and a peg region. The peg region includes a peg region in proximity to an air-bearing surface above a recording medium and also includes a flared region between and in contact with the enlarged region and the peg region. The flared region can act as a heat sink and can lower the thermal resistance of the peg portion of the near-field transducer, thus reducing its temperature.Type: ApplicationFiled: March 7, 2013Publication date: September 11, 2014Applicant: Seagate Technology LLCInventors: Yongjun Zhao, Dongsung Hong, Lijuan Zou, Mark Ostrowski
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Publication number: 20140210113Abstract: When opaque films are deposited on semi-conductor wafers, underlying alignment marks may be concealed. The re-exposure of such alignment marks is one source of resulting surface topography. In accordance with one implementation, alignment marks embedded in a wafer may be exposed by removing material from one or more layers and by replacing such material with a transparent material. In accordance with another implementation, the amount of material removed in an alignment mark recovery process may be mitigated by selectively ashing or etching above a stop layer.Type: ApplicationFiled: January 30, 2013Publication date: July 31, 2014Applicant: SEAGATE TECHNOLOGY LLCInventors: Dongsung Hong, Lijuan Zou, Daniel Sullivan, Lily Horng Youtt
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Patent number: 6834262Abstract: A mask simulation process is introduced into a conventional OPC procedure, prior to simulation of a photoresist pattern. Reticle simulation may be achieved using very short wavelengths of light as compared to the mask feature size. Alternatively, reticle simulation may be made through adjustments in a computer aided design process.Type: GrantFiled: June 30, 2000Date of Patent: December 21, 2004Assignee: Cypress Semiconductor CorporationInventors: Artur E. Balasinski, Dianna L. Coburn, Keeho E. Kim, Dongsung Hong