Patents by Inventor Dongyao Li

Dongyao Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230332247
    Abstract: Provided herein are methods, compositions and systems for identifying spatial gene expression of analytes from glioblastoma derived tissue. The methods discloses herein include using templated ligation probe pairs to identify location of a disease proliferating region in a glioblastoma-derived sample by detecting analytes in the region and hybridizing a ligation product comprising the probe pairs to a capture probe on a spatial array.
    Type: Application
    Filed: June 23, 2023
    Publication date: October 19, 2023
    Inventors: Hardeep Pal Singh, David Sukovich, Seayar Mohabbat, Dongyao Li, Hanyoup Kim, Augusto Manuel Tentori
  • Publication number: 20230306593
    Abstract: Systems and methods for spatial analysis of analytes are provided. A data structure is obtained comprising an image, as an array of pixel values, of a sample on a substrate having intersecting border regions, fiducial markers encoding N-digit codes, and a set of capture spots, where at least two border regions includes a fiducial marker. The pixel values are analyzed to identify locations of fiducial markers. The locations are aligned with locations of reference fiducial markers in a template using an alignment algorithm to obtain a final transformation between the fiducial markers in the image and the reference fiducial markers in the template. The final transformation and a coordinate system of the template are used to register the image to the set of capture spots. The registered image is then analyzed in conjunction with spatial analyte data associated with each capture spot, thereby performing spatial analysis of analytes.
    Type: Application
    Filed: February 14, 2023
    Publication date: September 28, 2023
    Inventor: Dongyao Li
  • Patent number: 10977405
    Abstract: Provided herein are systems and methods for optimizing feature fill processes. The feature fill optimization systems and methods may be used to optimize feature fill from a small number of patterned wafer tests. The systems and methods may be used for optimizing enhanced feature fill processes including those that include inhibition and/or etch operations along with deposition operations. Results from experiments may be used to calibrate a feature scale behavioral model. Once calibrated, parameter space may be iteratively explored to optimize the process.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: April 13, 2021
    Assignee: Lam Research Corporation
    Inventors: Michael Bowes, Atashi Basu, Kapil Sawlani, Dongyao Li, Anand Chandrashekar, David M. Fried, Michal Danek
  • Publication number: 20200242209
    Abstract: Provided herein are systems and methods for optimizing feature fill processes. The feature fill optimization systems and methods may be used to optimize feature fill from a small number of patterned wafer tests. The systems and methods may be used for optimizing enhanced feature fill processes including those that include inhibition and/or etch operations along with deposition operations. Results from experiments may be used to calibrate a feature scale behavioral model. Once calibrated, parameter space may be iteratively explored to optimize the process.
    Type: Application
    Filed: January 29, 2019
    Publication date: July 30, 2020
    Inventors: Michael Bowes, Atashi Basu, Kapil Sawlani, Dongyao Li, Anand Chandrashekar, David M. Fried, Michal Danek