Patents by Inventor Doo Yul BAEK

Doo Yul BAEK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing FCCL capable of controlling flexibility and stiffness of conductive pattern
    Patent number: 11665828
    Abstract: Disclosed is a method for manufacturing an FCCL capable of controlling flexibility and stiffness of a conductive pattern. The method for manufacturing an FCCL (Flexible Copper Clad Laminate) includes: an electroforming step of forming a conductive pattern on a mold for electroforming through electroforming; and a transfer step of transferring the conductive pattern from the mold for electroforming to the bottom of a polymer plastic film, wherein the electroforming process is performed in a plating bath equipped with a first metal, a second metal and a third metal, wherein the first metal is copper (Cu), the second metal serves to add flexibility and is one of tin (Sn), gold (Au), silver (Ag) and aluminum (Al), and the third metal serves to add stiffness and is one of nickel (Ni), cobalt (Co), chrome (Cr), iron (Fe), tungsten (W) and titanium (Ti).
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: May 30, 2023
    Assignee: SAMWON ACT CO., LTD.
    Inventors: Kyung Yul Lee, Kwang Jong Choi, Pyoung Woo Lee, Doo Yul Baek
  • METHOD FOR MANUFACTURING FCCL CAPABLE OF CONTROLLING FLEXIBILITY AND STIFFNESS OF CONDUCTIVE PATTERN
    Publication number: 20220007514
    Abstract: Disclosed is a method for manufacturing an FCCL capable of controlling flexibility and stiffness of a conductive pattern. The method for manufacturing an FCCL (Flexible Copper Clad Laminate) includes: an electroforming step of forming a conductive pattern on a mold for electroforming through electroforming; and a transfer step of transferring the conductive pattern from the mold for electroforming to the bottom of a polymer plastic film, wherein the electroforming process is performed in a plating bath equipped with a first metal, a second metal and a third metal, wherein the first metal is copper (Cu), the second metal serves to add flexibility and is one of tin (Sn), gold (Au), silver (Ag) and aluminum (Al), and the third metal serves to add stiffness and is one of nickel (Ni), cobalt (Co), chrome (Cr), iron (Fe), tungsten (W) and titanium (Ti).
    Type: Application
    Filed: November 27, 2019
    Publication date: January 6, 2022
    Inventors: Kyung Yul LEE, Kwang Jong CHOI, Pyoung Woo LEE, Doo Yul BAEK