Abstract: Integrated circuit arrangement comprising a field effect transistor, especially a tunnel field effect transistor. An explanation is given of, inter alia, tunnel field effect transistors having a thicker gate dielectric in comparison with other transistors on the same integrated circuit arrangement. As an alternative or in addition, said tunnel field effect transistors have gate regions at mutually remote sides of a channel forming region or an interface between the connection regions of the tunnel field effect transistor.

Abstract: A nanomagnetic logic gate arranged on a substrate according to an embodiment includes at least one nanomagnetic first structure, at least one nanomagnetic second structure and at least two layers including a first layer and a second layer, wherein at least one first structure is arranged in the first layer on or parallel to a main surface of the substrate, wherein at least one second structure is arranged in the second layer parallel to the first layer, and wherein at least one second structure includes an artificial nucleation center arranged such that a magnetic field component essentially perpendicular to the main surface provided by at least one first structure couples to the artificial nucleation center such that a magnetization of the second structure is changeable in response to the magnetic field component coupled into the artificial nucleation center, when a predetermined condition is fulfilled.

Abstract: Integrated circuit arrangement comprising a field effect transistor, especially a tunnel field effect transistor. An explanation is given of, inter alia, tunnel field effect transistors having a thicker gate dielectric in comparison with other transistors on the same integrated circuit arrangement. As an alternative or in addition, said tunnel field effect transistors have gate regions at mutually remote sides of a channel forming region or an interface between the connection regions of the tunnel field effect transistor.

Abstract: A nanomagnetic logic gate arranged on a substrate according to an embodiment includes at least one nanomagnetic first structure, at least one nanomagnetic second structure and at least two layers including a first layer and a second layer, wherein at least one first structure is arranged in the first layer on or parallel to a main surface of the substrate, wherein at least one second structure is arranged in the second layer parallel to the first layer, and wherein at least one second structure includes an artificial nucleation center arranged such that a magnetic field component essentially perpendicular to the main surface provided by at least one first structure couples to the artificial nucleation center such that a magnetization of the second structure is changeable in response to the magnetic field component coupled into the artificial nucleation center, when a predetermined condition is fulfilled.

Abstract: An explanation is given of, inter alia, tunnel field effect transistors having a thicker gate dielectric (GD1) in comparison with other transistors (T2) on the same integrated circuit arrangement (10). As an alternative or in addition, said tunnel field effect transistors have gate regions at mutually remote sides of a channel forming region or an interface between the connection regions (D1, S1) of the tunnel field effect transistor.

Abstract: An integrated circuit includes functional blocks, a power control unit controlling the provision of power to the different functional blocks of the integrated circuit, a detecting unit detecting if a turned off functional block is to be turned on, and a clock signal control unit controlling the provision of the clock signal for the functional blocks. The clock signal control unit interrupts the clock signal for the activated functional blocks of the integrated circuit for a predetermined number of clock cycles. The power control unit provides power to the turned off functional block during the interrupted clock cycles.

Abstract: An intergrated circuit having a drive circuit is disclosed. One embodiment provides an intergrated memory circuit arrangement with a drive circuit for an EEPROM. In one embodiment, the drive circuit contains tunnel field effect transistors and can be produced in particular on a small chip area.

Abstract: An integrated circuit, comprising a first data retention element configured to retain the data, the first data retention element having a first setup time, and a second data retention element configured to retain the data, the second data retention element having a second setup time, the second data retention element further having a data input. The second data retention element is connected in parallel with the first data retention element, and the second data retention element is configurable via the data input such that the second setup time is longer than the first setup time.

Abstract: An explanation is given of, inter alia, tunnel field effect transistors having a thicker gate dielectric (GD1) in comparison with other transistors (T2) on the same integrated circuit arrangement (10). As an alternative or in addition, said tunnel field effect transistors have gate regions at mutually remote sides of a channel forming region or an interface between the connection regions (D1, S1) of the tunnel field effect transistor.

Abstract: The flip-flop according to the invention serves for storing an item of logic state information and has at least one data input and at least one data output. The flip-flop comprises at least one latch stage for storing the state information if the flip-flop is switched on. Furthermore, the flip-flop according to the invention comprises at least one memory cell having a capacitance as storage element. In this case, the at least one memory cell serves for storing the state information if the flip-flop is switched off.

Abstract: A method and an apparatus for switching on a voltage supply of a voltage domain of a semiconductor circuit is disclosed. A voltage supply is connected to a supply voltage of the semiconductor circuit by means of a switchable element. The switchable element is activated in such a way that, for switching on the voltage supply of the voltage domain, a current through the switchable element rises progressively with at least one intermediate value, in particular stepwise manner.

Abstract: Logic activation circuit for switching a logic circuit having at least one supply voltage line on or off, said logic activation circuit having: (a) at least one voltage supply switching device for connecting a supply voltage to a supply voltage line of the logic circuit in a manner dependent on a changeover control signal that is applied to a control terminal of the voltage supply switching device; and having (b) a charge equalization switching device which, in a manner dependent on a control switching pulse, connects the supply voltage line of the logic circuit to the control terminal of the voltage supply switching device for the duration of the control switching pulse so that charge equalization is effected between the supply voltage line and the control terminal of the voltage supply switching device in order to generate the changeover control signal.

Abstract: An intergrated circuit having a drive circuit is disclosed. One embodiment provides an intergrated memory circuit arrangement with a drive circuit for an EEPROM. In one embodiment, the drive circuit contains tunnel field effect transistors and can be produced in particular on a small chip area.

Abstract: A method and an apparatus for switching on a voltage supply of a voltage domain of a semiconductor circuit is disclosed. A voltage supply is connected to a supply voltage of the semiconductor circuit by means of a switchable element. The switchable element is activated in such a way that, for switching on the voltage supply of the voltage domain, a current through the switchable element rises progressively with at least one intermediate value, in particular stepwise manner.

Abstract: An integrated circuit includes functional blocks, a power control unit controlling the provision of power to the different functional blocks of the integrated circuit, a detecting unit detecting if a turned off functional block is to be turned on, and a clock signal control unit controlling the provision of the clock signal for the functional blocks. The clock signal control unit interrupts the clock signal for the activated functional blocks of the integrated circuit for a predetermined number of clock cycles. The power control unit provides power to the turned off functional block during the interrupted clock cycles.

Abstract: A master latch circuit (10) with signal level displacement for a flip-flop (1) clocked by a clock pulse signal (Clk), wherein the master latch circuit (10) comprises a signal delay circuit (13) which delays and inverts the clock pulse signal (ClK) resulting in a specific time delay (AT), and a circuit node (14) which, in a charging phase wherein the clock pulse signal (Clk) is logically low, is charged to an operational voltage (VB) an which, in an evaluation phase when the clock pulse signal (Clk) and delayed, inverted clock pulse signal (Clk<SB>DELAY</SB>) are logically high, is discharged according to a specific data signal (D), wherein the data signal controls only transistors of a single type (either only N-channel or only P-channel). The master latch circuit (10) has only one supply voltage.

Abstract: A differential current evaluation circuit has a differential amplifier and a circuit for setting an input resistance of the current evaluation circuit. The circuit is connected to the outputs and the inputs of the differential amplifier and to signal lines. A sense amplifier circuit has a circuit section, in which a signal is available at an output in a temporally continuous manner even if, after the deactivation of the circuit connected upstream, a signal, in particular a signal supplied by the current evaluation circuit, is no longer present at its input. The differential current evaluation circuit and the sense amplifier circuit are disposed in a circuit configuration for reading out and evaluating a memory state of a semiconductor memory cell. The current evaluation circuit can be activated by a circuit section for automatic deactivation before a read operation and be automatically deactivated directly after the read operation has ended.

Abstract: The flip-flop according to the invention serves for storing an item of logic state information and has at least one data input and at least one data output. The flip-flop comprises at least one latch stage for storing the state information if the flip-flop is switched on. Furthermore, the flip-flop according to the invention comprises at least one memory cell having a capacitance as storage element. In this case, the at least one memory cell serves for storing the state information if the flip-flop is switched off.

Abstract: Logic activation circuit for switching a logic circuit having at least one supply voltage line on or off, said logic activation circuit having: (a) at least one voltage supply switching device for connecting a supply voltage to a supply voltage line of the logic circuit in a manner dependent on a changeover control signal that is applied to a control terminal of the voltage supply switching device; and having (b) a charge equalization switching device which, in a manner dependent on a control switching pulse, connects the supply voltage line of the logic circuit to the control terminal of the voltage supply switching device for the duration of the control switching pulse so that charge equalization is effected between the supply voltage line and the control terminal of the voltage supply switching device in order to generate the changeover control signal.

Abstract: A circuit configuration for providing a capacitance includes short-channel MOS transistors that are reverse-connected in series or in parallel, and that have the same channel type. When the short-channel MOS transistors are operated exclusively in the depletion mode in the required voltage range, the useful capacitance is increased, because of intrinsic capacitances, as compared with circuit configurations having conventional long-channel MOS transistors. These circuits greatly reduce the area taken up and reduce the costs.