Abstract: A method of mitigating self-actuation of a switch may comprise generating a tracking signal, based on an input signal that the switch is configured to convey, and combining the tracking signal with an actuating signal to generate a modified actuating signal. The actuating signal may be configured to change a state of the switch from a first state (e.g., ON) to a second state (e.g., OFF). The method further comprises selectively applying the modified actuating signal to a gate of the switch. A switch self-actuation mitigation system may comprise a first coupling device for electrically couple an AC component of a first signal to a node, where the first signal is applied a switch input. The system may further comprise a second coupling device configured to electrically couple an actuating signal to the node, and a driving device configured to selectively couple the node to a gate of the switch.

Abstract: A system and method for displaying sticky notes on a phone are provided. The system for displaying sticky notes on a phone includes a processing system and a controller. The processing system includes a processor that is coupled to a display icon and user input device, to enter and display the sticky notes on the phone. The controller classifies the entered sticky notes on the basis of the action to be performed on them. These sticky notes may be classified, based on user identification associated with a multi-user phone.

Abstract: Disclosed are semiconductor die packages comprising flexible modules having passive components, with the flexible modules and one or more semiconductor dice disposed in a stacked relationship, systems using the same, and methods of making the same. In one exemplary package embodiment, one or more semiconductor dice are disposed on a leadframe that is disposed in a stacked relationship with the flexible module. In another embodiment, one or more semiconductor dice are attached to a surface of a flexible module.

Abstract: Semiconductor die packages, methods of making said packages, and systems using said packages are disclosed. An exemplary package comprises at least one semiconductor die disposed on one surface of a leadframe and electrically coupled to at least one conductive region of the leadframe, and at least one passive electrical component disposed on the other surface of a leadframe and electrically coupled to at least one conductive region of the leadframe. Molding material is disposed over the at least one passive electrical component to provide a molded passive component.

Abstract: A system and method for displaying sticky notes on a phone are provided. The system for displaying sticky notes on a phone includes a processing system and a controller. The processing system includes a processor that is coupled to a display icon and user input device, to enter and display the sticky notes on the phone. The controller classifies the entered sticky notes on the basis of the action to be performed on them. These sticky notes may be classified, based on user identification associated with a multi-user phone.

Abstract: Method and structure for securing a mold compound to a printed circuit board is disclosed. A through hole or a blind hole is fabricated in a printed circuit board adjacent to a die. The hole is then filled with a mold compound. The mold compound also surrounds and covers the die. The mold compound within the hole locks the mold compound to the surface of the printed circuit board. In one embodiment, a through hole or a blind hole is fabricated adjacent to a semiconductor die. The semiconductor die is attached to a layer of gold-plated copper on the printed circuit board. After the semiconductor die is attached to the layer of gold-plated copper on the printed circuit board, the semiconductor die is surrounded and covered by the mold compound and the fabricated hole is filled with the mold compound. The mold compound within the hole has good adhesion to the resin layer which constitutes the printed circuit board. This adhesion locks the mold compound securely to the surface of the printed circuit board.

Abstract: In a cavity down ball grid array integrated circuit package, a metal lid is clamped and soldered to a ground ring of the top tier of the substrate of the package. During the BGA surface mount process, the back side of the metal lid is soldered to the board. This method provides grounded EMI shielding for the integrated circuit's die and bond wires, and an additional thermal path through the lid to ground, improving EMI and thermal conductivity of the package. A thermally conductive mold compound or a thermal pad can be used as the filler material between the lid and the die. The lid can be flat or contoured to the die and the die's surrounding area. Contouring of the lid reduces the distance between the lid and the die, further improving thermal conductivity of the package.