Patents by Inventor Douglas Alan Hawks

Douglas Alan Hawks has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microelectromechanical systems microphone packaging systems
    Patent number: 8421168
    Abstract: This document discusses, among other things, a conductive frame, a silicon die coupled to the conductive frame, the silicon die including a vibratory diaphragm, the die having a silicon die top opposite a silicon die bottom, with a silicon die port extending through the silicon die to the vibratory diaphragm, with a silicon die terminal in electrical communication with the conductive frame and an insulator affixed to the conductive frame and the silicon die, with the insulator extending through interstices in the conductive frame to a conductive frame bottom of the conductive frame, and around an exterior of the silicon die to the silicon die top, with the insulator physically affixed to the silicon die and to the conductive frame, with the silicon die port exposed and with a conductive frame terminal disposed at the conductive frame bottom in electrical communication with the silicon die terminal.
    Type: Grant
    Filed: November 16, 2010
    Date of Patent: April 16, 2013
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Howard Allen, Luke England, Douglas Alan Hawks, Yong Liu, Stephen Martin
  • Method of making micromodules including integrated thin film inductors
    Patent number: 8110474
    Abstract: Micromodules and methods of making them are disclosed. An exemplary micromodule includes a substrate having a thin film inductor, and a bumped die mounted on the substrate and over the thin film inductor.
    Type: Grant
    Filed: October 18, 2010
    Date of Patent: February 7, 2012
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Francesco Carobolante, Douglas Alan Hawks
  • MICROELECTROMECHANICAL SYSTEMS MICROPHONE PACKAGING SYSTEMS
    Publication number: 20110121413
    Abstract: This document discusses, among other things, a conductive frame, a silicon die coupled to the conductive frame, the silicon die including a vibratory diaphragm, the die having a silicon die top opposite a silicon die bottom, with a silicon die port extending through the silicon die to the vibratory diaphragm, with a silicon die terminal in electrical communication with the conductive frame and an insulator affixed to the conductive frame and the silicon die, with the insulator extending through interstices in the conductive frame to a conductive frame bottom of the conductive frame, and around an exterior of the silicon die to the silicon die top, with the insulator physically affixed to the silicon die and to the conductive frame, with the silicon die port exposed and with a conductive frame terminal disposed at the conductive frame bottom in electrical communication with the silicon die terminal.
    Type: Application
    Filed: November 16, 2010
    Publication date: May 26, 2011
    Inventors: Howard Allen, Luke England, Douglas Alan Hawks, Yong Liu, Stephen Martin
  • MICROMODULES INCLUDING INTEGRATED THIN FILM INDUCTORS AND METHODS OF MAKING THE SAME
    Publication number: 20110030206
    Abstract: Micromodules and methods of making them are disclosed. An exemplary micromodule includes a substrate having a thin film inductor, and a bumped die mounted on the substrate and over the thin film inductor.
    Type: Application
    Filed: October 18, 2010
    Publication date: February 10, 2011
    Inventors: Francesco Carobolante, Douglas Alan Hawks
  • Micromodules including integrated thin film inductors
    Patent number: 7838964
    Abstract: Micromodules and methods of making them are disclosed. An exemplary micromodule includes a substrate having a thin film inductor, and a bumped die mounted on the substrate and over the thin film inductor.
    Type: Grant
    Filed: February 25, 2009
    Date of Patent: November 23, 2010
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Francesco Carobolante, Douglas Alan Hawks
  • Micromodules Including Integrated Thin Film Inductors and Methods of Making the Same
    Publication number: 20090212391
    Abstract: Micromodules and methods of making them are disclosed. An exemplary micromodule includes a substrate having a thin film inductor, and a bumped die mounted on the substrate and over the thin film inductor.
    Type: Application
    Filed: February 25, 2009
    Publication date: August 27, 2009
    Inventors: Francesco Carobolante, Douglas Alan Hawks