Patents by Inventor Douglas E. Chrzanowski

Douglas E. Chrzanowski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire bonding method and apparatus
    Patent number: 6488198
    Abstract: A process and apparatus are described for wire bonding circuit pads of large scale integrated design. The bonding process employs a capillary tool that applies heat and pressure to the wires in order to bond them to the circuit pad. The circuit pad is supported upon a closed woven, fiberglass mesh, which supports the circuit pad during the bonding process.
    Type: Grant
    Filed: July 1, 1999
    Date of Patent: December 3, 2002
    Assignee: International Business Machines Corporation
    Inventors: Douglas E. Chrzanowski, John A. Welsh, James W. Wilson, Jeffrey A. Zimmerman
  • Wire bonding method and apparatus
    Publication number: 20010016462
    Abstract: A process and apparatus are described for wire bonding circuit devices of large scale integrated design. The bonding process employs a capillary tool that applies heat and pressure to the wires in order to bond them to the circuit device. The circuit device, or pad, is supported upon a closed woven, fiberglass mesh, which supports the circuit device during the bonding process.
    Type: Application
    Filed: April 9, 2001
    Publication date: August 23, 2001
    Applicant: International Business Machines Corporation
    Inventors: Douglas E. Chrzanowski, John A. Welsh, James W. Wilson, Jeffrey A. Zimmerman