Abstract: An optical component package, in which a transfer molded layer of material (e.g., syntactic foam in one embodiment) is formed at least partially around, or entirely around, the optical component to provide structural and thermal insulation around the component. The optical component may be a planar lightwave circuit (PLC), with a protective passivation layer formed between the PLC and the layer of syntactic foam, to de-couple stresses and thermal transfer between the PLC and the layer of syntactic foam. Strengthening caps, fiber assemblies, and a heater may be provided with the PLC assembly, around which the layer of syntactic foam can also be formed. The protective passivation layer can also be formed between these structures and the syntactic foam; in one embodiment between at least two strengthening caps formed on opposing edges of the PLC. The disclosed package provides numerous structural, thermal and size benefits.

Abstract: An optical component package, having an insulative buffer placed against the component, enclosing a first insulative cavity against a temperature-sensitive portion of the component. An outer package provides additional insulation for the component. The buffer may be formed of a soft insulative material, and pressed against the component by an inner surface of the outer package. For the PLC embodiments disclosed, the buffer is planar and includes a frame projecting from its perimeter toward the component to form the cavity. A heater may be positioned proximate the optical component to control its temperature, in which case a second buffer may be placed against the heater, enclosing a second insulative cavity against the heater, aligned with the temperature-sensitive portion of the component. The buffers and insulative cavities of the present invention provide important insulation for optical areas requiring precise temperature control for proper operation.

Abstract: An optical component package, having an insulative buffer placed against the component, enclosing a first insulative cavity against a temperature-sensitive portion of the component. An outer package provides additional insulation for the component. The buffer may be formed of a soft insulative material, and pressed against the component by an inner surface of the outer package. For the PLC embodiments disclosed, the buffer is planar and includes a frame projecting from its perimeter toward the component to form the cavity. A heater may be positioned proximate the optical component to control its temperature, in which case a second buffer may be placed against the heater, enclosing a second insulative cavity against the heater, aligned with the temperature-sensitive portion of the component. The buffers and insulative cavities of the present invention provide important insulation for optical areas requiring precise temperature control for proper operation.

Abstract: A package for optical components includes an inner package enclosing the optical component, and an outer package enclosing the inner package. A heater may be disposed in the inner package proximate the optical component to control its temperature, and to maintain this temperature control, the outer package creates an isolated air pocket around the inner package, which thermally insulates the inner package from the outside environment. The outer package is formed of a material having low thermal conductivity, to promote this insulating function. This package is especially useful if the optical component comprises a planar light-wave circuit (PLC), e.g. an arrayed waveguide grating (AWG), which requires tight temperature control and structural integrity to maintain the integrity of the optical paths.

Abstract: An apparatus and a method for holding and aligning a fiber optic component. One embodiment includes a collimator tube with a collar to house a portion of an optical fiber, and a clamping device coupled to a support structure to support the collar. The clamping device applies a normal force to the collar when the collar is disposed between the clamping device and the support structure, releasably coupling the collar to the support structure. After alignment, the collar can be affixed to the support structure with epoxy in a manner that reduces or eliminates misalignment caused by curing of the epoxy.

Abstract: A technique for fabricating a plurality of thin film filters (“TFFs”), and other optical devices, from a wafer. A device or TFF wafer is affixed to a carrier having a pattern of notches formed thereon corresponding to a pattern into which the wafer is to be diced to form the TFFs. The notches are sized to allow clearance of a dicing apparatus. The wafer is diced at least partially into the notches to form the TFFs, and the TFFs may be individually optically tested with a light source aligned thereto, while they remain affixed to the carrier. The TFFs are removed from the carrier for operation, and the carrier can be re-used. To facilitate re-use, a releasable adhesive is applied to the wafer and/or the carrier, and the notches receive any excess adhesive when the wafer is being affixed to the carrier.

Abstract: A method and apparatus for aligning eccentricities in optical fibers arrayed in a fiber optic bundle is disclosed. The optical fibers are initially constrained from movement in a lateral or longitudinal direction. A light meter is used to detect the orientation of the eccentricity in the core of at least one optical fiber. The orientations of the optical fibers can be aligned such that all optical fiber cores have the same orientation relative to the fiber optic bundle.

Abstract: A redundant package for optical components includes an inner package enclosing the optical component, and an outer package enclosing the inner package. A heater may be disposed in the inner package proximate the optical component to control its temperature, and to maintain this temperature control, the outer package creates an isolated air pocket around the inner package which thermally insulates the inner package from the outside environment. The outer package is formed of a material having low thermal conductivity, to promote this insulating function. This package is especially useful if the optical component comprises a planar lightwave circuit (PLC), e.g., an arrayed waveguide grating (AWG), which requires tight temperature control and structural integrity to maintain the integrity of the optical paths.

Abstract: A method and apparatus for aligning eccentricities in optical fibers arrayed in a fiber optic bundle is disclosed. The optical fibers are initially constrained from movement in a lateral or longitudinal direction. A light meter is used to detect the orientation of the eccentricity in the core of at least one optical fiber. The orientations of the optical fibers can be aligned such that all optical fiber cores have the same orientation relative to the fiber optic bundle.

Abstract: A method and apparatus for aligning eccentricities in optical fibers arrayed in a fiber optic bundle is disclosed. The optical fibers are initially constrained from movement in a lateral or longitudinal direction. A light meter is used to detect the orientation of the eccentricity in the core of at least one optical fiber. The orientations of the optical fibers can be aligned such that all optical fiber cores have the same orientation relative to the fiber optic bundle.

Abstract: A redundant package for optical components includes an inner package enclosing the optical component, and an outer package enclosing the inner package. A heater may be disposed in the inner package proximate the optical component to control its temperature, and to maintain this temperature control, the outer package creates an isolated air pocket around the inner package which thermally insulates the inner package from the outside environment. The outer package is formed of a material having low thermal conductivity, to promote this insulating function. This package is especially useful if the optical component comprises a planar lightwave circuit (PLC), e.g., an arrayed waveguide grating (AWG), which requires tight temperature control and structural integrity to maintain the integrity of the optical paths.

Abstract: A technique for fabricating a plurality of thin film filters (“TFFs”), and other optical devices, from a wafer. A device or TFF wafer is affixed to a carrier having a pattern of notches formed thereon corresponding to a pattern into which the wafer is to be diced to form the TFFs. The notches are sized to allow clearance of a dicing apparatus. The wafer is diced at least partially into the notches to form the TFFs, and the TFFs may be individually optically tested with a light source aligned thereto, while they remain affixed to the carrier. The TFFs are removed from the carrier for operation, and the carrier can be re-used. To facilitate re-use, a releasable adhesive is applied to the wafer and/or the carrier, and the notches receive any excess adhesive when the wafer is being affixed to the carrier.

Abstract: An apparatus and a method for centering a core of a waveguide amplifier. One embodiment of the invention comprises axially rotating a waveguide which has a core, shining a light through a light transmission pathway in the core of the waveguide, and shaping an outer surface of the waveguide in a predetermined pattern with respect to the light transmission pathway.

Abstract: An apparatus and a method for holding and aligning a fiber optic component. One embodiment includes a collimator tube with a collar to house a portion of an optical fiber, and a clamping device coupled to a support structure to support the collar. The clamping device applies a normal force to the collar when the collar is disposed between the clamping device and the support structure, releasably coupling the collar to the support structure. After alignment, the collar can be affixed to the support structure with epoxy in a manner that reduces or eliminates misalignment caused by curing of the epoxy.

Abstract: A device and method of aligning two or more optical fibers on an array waveguide is achieved by etching grooves into the array waveguide. The two or more optical fibers are attached together by a retainer and placed into the grooves of the array waveguide. Channels within the array waveguide are coursely aligned to the two or more optical fibers and may be more finely aligned by manual adjustment.

Abstract: A cathode contact device is provided for providing particle deposition from an anode source onto a target surface of a working piece. The working piece has a first electrically conductive continuous contact surrounding the target surface. The cathode contact device includes a second electrically conductive continuous contact adapted for frictionally contacting the first contact along a continuous path located on the first contact. The second contact further has an inner periphery defining an aperture for passing therethrough the particles onto the target surface. Additionally, the cathode contact device includes a circuit for electrically coupling the second contact to an electrical current supply.

Abstract: A cathode contact device is provided for providing particle deposition from an anode source onto a target surface of a working piece. The working piece has a first electrically conductive continuous contact surrounding the target surface. The cathode contact device includes a second electrically conductive continuous contact adapted for frictionally contacting the first contact along a continuous path located on the first contact. The second contact further has an inner periphery defining an aperture for passing therethrough the particles onto the target surface. Additionally, the cathode contact device includes a circuit for electrically coupling the second contact to an electrical current supply.

Abstract: A method for removing Ball Limiting Metallurgy (BLM) layers from the surface of a wafer in the presence of Pb/Sn solder bumps. In one embodiment, the BLM comprises two layers: titanium and copper. After Pb/Sn solder bumps have been formed over the electrical contact pads of the wafer, the BLM copper layer is etched with a H.sub.2 SO.sub.4 +H.sub.2 O.sub.2 +H.sub.2 O solution. While removing the copper layer, the H.sub.2 SO.sub.4 +H.sub.2 O.sub.2 +H.sub.2 O etchant also reacts with the Pb/Sn solder bumps to form a thin PbO protective layer over the surface of the bumps. When the copper layer has been etched away, the titanium layer is etched with a CH.sub.3 COOH+NH.sub.4 F+H.sub.2 O solution. The PbO layer formed over the surface of the Pb/Sn solder bumps remain insoluble when exposed to the CH.sub.3 COOH+NH.sub.4 F+H.sub.2 O etchant, thereby preventing the solder bumps from being etched in the presence of the CH.sub.3 COOH+NH.sub.4 F+H.sub.2 O etchant.

Abstract: An apparatus for delivery of a liquid. The apparatus includes a housing and a cradle for holding a container containing the liquid. The cradle is rotatably coupled to the housing. The cradle is rotatable between a first position and a second position. The apparatus further includes a reservoir for receiving the liquid from the container. The reservoir is coupled to the cradle and rotates with the cradle. The reservoir includes a passageway through which the liquid is able to flow downward for all positions the cradle is permitted to rotate to. The reservoir includes a cylinder for minimizing back flow of the liquid from the reservoir to the container. The reservoir also includes a first orifice for allowing the liquid to pass out of the reservoir, a second orifice for allowing an air bubble in the liquid to return to the reservoir, and a check valve for allowing air to pass into the reservoir.

Abstract: The present invention is an anode cathode parallelism gap gauge. The gauge is for determining the relative parallelism between two planar surfaces such as an anode and cathode in a relative ion chamber. The gauge sits on the anode on three points and then has the cathode extended into its volume. The cathode will then contact the measuring arms, of which there must be at least three, that statically latch measurement values onto a scalar device. Thus, the present invention provides a reliable and clean method of determining parallelism and distance between an anode and cathode or other surfaces.