Abstract: An alignment system comprising a rectangular leadframe from the interior of which extend leads to terminations arrangement for alignment and registration with the braze pads of a ceramic integrated circuit package, the alignment and registration being maintained and defined by a web bar interconnecting the leads adjacent the between those braze pads and the leadframe. The leadframe, leads and web bar being integrally formed by etching and lying in a plane.

Abstract: Ceramic packages for encapsulating integrated circuit (IC) chips are made of layers which are laminated together in a co-firing process. A signal layer includes leads electrically connecting external pins with the chip itself. Other layers supply ground and power to the chip by way of the signal layer. The layers are designed so that when a new chip is to be introduced, only one layer of the package, called a "VIA layer," needs to be re-designed for the new chip. The VIA layer is programmed with connections or "vias" at specific locations between the signal layer and a power or ground layer above or below the signal layer. The "vias" are conductive dots that extend through the VIA layer. The layer opposite the signal layer on the other side of the VIA layer contains "internal supply and ground bars" that are electrically connected to internal supply and ground layers.