Abstract: An apparatus for supporting a substrate such as a printed circuit board (PCB) having various electronic components installed on one side with that side down so that other components can be installed on the opposite side. An assembly of three perforated plates has deformable, typically rubber-like, pins projecting through the perforations. Springs below the assembly bias the pins to a position extending above the plate. When a PCB is laid on the pins with mounted electronic components downward, the components with pres the pins down distances corresponding to component thickness. The pins provide uniform support while working on the opposite side. The center perforated plate of the three is moved to the side, clamping the pins in position, so that the PCB can be removed and replaced with another identical PCB. Different devices for causing the plate clamping action and devices for indexing PCB position and for maintaining the PCB flat and level are also provided.

Abstract: A kit tools for use in repairing bent leads on fine pitch surface mount electronic components and a method of repairing such bent leads. The kit basically comprises a plate having a precisely flat surface and a template having a plurality of recesses corresponding to the lead pattern on a component to be repaired. The template is secured to the plate surface, such as by tape extending across tabs extending from the template. A means such as a vacuum pen is used to lift and move the component without touching the leads. A variety of probes, tweezers and the like are used to bend leads back to proper positions. The component may be placed directly against the surface when checking and correcting lack of lead coplanarity and linearity. Grossly bent leads may be corrected with the component on the surface, while precise positioning is accomplished with the component in the template, since fine adjustments can be made and the minor non-alignment can be easily observed and corrected.

Abstract: A method and kit for precisely placing fine pitch surface-mount electronic components onto printed circuit boards. An alignment substrate having a pattern of solder pads and holes or transverse edges corresponding to the pattern of solder pads and holes or edges on a printed circuit board is secured to a base by registration pins fastened to the base and inserted into contact with said holes or edges. Generally, the alignment substrate is preferably another circuit board identical with the board to be bonded to the electrical component. A template having a pattern of recesses corresponding to the component lead pattern is secured over the alignment substrate. A component is placed on the template with leads in the recesses. The component is lifted away, a printed circuit board is placed over the template and the component is lower onto the board. The board with component in place can then be removed for soldering.