Abstract: Generally, this disclosure provides systems, devices and methods for improved electrical coupling of multiple ground planes of a device. The device may include a plurality of ground planes and an electrically conductive ground clip. The ground clip may include a base portion configured to secure the ground clip to the device and a plurality of spring fingers. Each of the spring fingers may be configured to contact and electrically couple to one of the plurality of ground planes, wherein the ground clip is to provide a conduction path between each of the spring fingers. One of the spring fingers may pass through an opening or cut-through in a first ground plane to contact a second ground plane. The device may be a mobile communication or computing platform.

Abstract: Generally, this disclosure provides systems, devices and methods for improved electrical coupling of multiple ground planes of a device. The device may include a plurality of ground planes and an electrically conductive ground clip. The ground clip may include a base portion configured to secure the ground clip to the device and a plurality of spring fingers. Each of the spring fingers may be configured to contact and electrically couple to one of the plurality of ground planes, wherein the ground clip is to provide a conduction path between each of the spring fingers. One of the spring fingers may pass through an opening or cut-through in a first ground plane to contact a second ground plane. The device may be a mobile communication or computing platform.

Abstract: Generally, this disclosure provides systems, devices and methods for improved electrical coupling of multiple ground planes of a device. The device may include a plurality of ground planes and an electrically conductive ground clip. The ground clip may include a base portion configured to secure the ground clip to the device and a plurality of spring fingers. Each of the spring fingers may be configured to contact and electrically couple to one of the plurality of ground planes, wherein the ground clip is to provide a conduction path between each of the spring fingers. One of the spring fingers may pass through an opening or cut-through in a first ground plane to contact a second ground plane. The device may be a mobile communication or computing platform.

Abstract: Generally, this disclosure provides systems, devices and methods for improved electrical coupling of multiple ground planes of a device. The device may include a plurality of ground planes and an electrically conductive ground clip. The ground clip may include a base portion configured to secure the ground clip to the device and a plurality of spring fingers. Each of the spring fingers may be configured to contact and electrically couple to one of the plurality of ground planes, wherein the ground clip is to provide a conduction path between each of the spring fingers. One of the spring fingers may pass through an opening or cut-through in a first ground plane to contact a second ground plane. The device may be a mobile communication or computing platform.

Abstract: A hot swap disk drive carrier and drive bay with improved EMI/RVI/ESD suppression characteristics is disclosed. The disk drive carrier comprises a frame that has a base, and first and second arms that are coupled to the base. The carrier further includes a handle, which is coupled to the base, and slide rails that are coupled to the first and second arms. The disk drive bay comprises a plate that has first and second sides. The plate is coupled to first and second walls. These walls have grooves for receiving the disk drive carrier's slide rails.

Abstract: A dual processor retention module for holding one or two edge connector processors. The dual processor retention module includes a first and second retention slot. Each retention slot includes a first and second horizontal bar, with each bar having a first end and a second end. Each retention slot also includes a first upright member connected to the first ends of the first and second horizontal bars, and a second upright member connected to the second ends of the first and second horizontal bars. The dual processor retention module has a first pair of connectors connecting the first upright members, and a second pair of connectors connecting the second upright members. The connectors are placed such that the horizontal bars for the first retention slot are parallel to the horizontal bars for the second retention slot.