Abstract: A microbe-specific medium, containing specific chromogenic substrates, for the detection of vancomycin-resistant enterococci in a biological sample, whereby both the detection and identification of vancomycin-resistant enterococci at the species level is achieved utilizing one sample and one test.

Abstract: A seat (1000) may include mounting components (1054a. 1054b) that may mate with corresponding components on other assemblies. The seat may include one or more features that may rotate or move to provide for coupling to the one or more assemblies. Assemblies include, but are not limited to, a stroller, a bicycle adapter, a wagon, a booster seat, a camping chair, a high chair, a stadium seat/picnic table, a hiking pack, an infant carrier, a car seat, a booster car seat, or an airline seat.

Abstract: A hair wrap article, as disclosed, is a regular or irregular geometric-shaped swath of cloth comprising a cloth area and a cloth edge perimeter; and a securing tab affixed, generally stitched, upon the swath of cloth to receive and secure a portion of the swath of cloth. The securing tab affixes upon the cloth at least a discrete distance, described further herein, from the cloth edge perimeter. The securing tab generally comprises a planar configuration, and may embody any regular or irregular geometric shape. A secondary tab may be further employed and stitched proximate to the securing tab. Representative embodiments may employ slits in the cloth, rather than affixed tabs, to receive and secure a portion of the swath of cloth; and such slits are similarly positioned at least a discrete distance from the cloth edge. Various embodiments may employ a combination of securing tabs, secondary tabs, and slits.

Abstract: A hair wrap article comprises a plurality of swaths of cloth dimensionally cut and stitched together to form the article comprising a volume, wherein an article first end comprises a first volume opening greater than a second volume opening at an article second end. The article comprises a securing tab at an exterior portion of the article first end or a plurality of through slits, either one to receive and secure the article second end. The article may comprise the following: the securing tab comprising an isosceles trapezoid geometric configuration; a secondary securing tab proximate the securing tab to alternately operate to receive and secure the article second end; a semi-rigid ribbing stitched into the stitched together portion of the article; and a portion of the second volume opening may be stitched together to close the second volume opening to create an article second end internal volume.

Abstract: A microbe-specific medium, containing specific chromogenic substrates, for the detection of vancomycin-resistant enterococci in a biological sample, whereby both the detection and identification of vancomycin-resistant enterococci at the species level is achieved utilizing one sample and one test.

Abstract: A microbe-specific medium, containing specific chromogenic substrates, for the detection of vancomycin-resistant enterococci in a biological sample, whereby both the detection and identification of vancomycin-resistant enterococci at the species level is achieved utilizing one sample and one test.

Abstract: A hair wrap article comprises a plurality of swaths of cloth dimensionally cut and stitched together to form the article comprising a volume, wherein an article first end comprises a first volume opening greater than a second volume opening at an article second end. The article comprises a securing tab at an exterior portion of the article first end or a plurality of through slits, either one to receive and secure the article second end. The article may comprise the following: the securing tab comprising an isosceles trapezoid geometric configuration; a secondary securing tab proximate the securing tab to alternately operate to receive and secure the article second end; a semi-rigid ribbing stitched into the stitched together portion of the article; and a portion of the second volume opening may be stitched together to close the second volume opening to create an article second end internal volume.

Abstract: Polyethylene films having a good balance of optical and mechanical properties are disclosed. The films are derived from ethylene copolymer compositions made with a suitably substituted phosphinimine catalyst. The ethylene copolymers have very narrow molecular weight distributions and broadened comonomer distributions.

Abstract: Supported catalyst system for the polymerization of olefins, having at least two different monocyclopentadienyl transition metal compounds, one or more activators including an ionic compound having (i) a cation and (ii) an anion having up to 100 non-hydrogen atoms and the anion containing at least one substituent comprising a moiety having an active hydrogen, and one or more support materials. The supported “mixed or dual site” catalyst systems having different monocyclopentadienyl catalysts when activated by specific ionic activators lead to catalyst systems showing an improved balance of properties which may be used to prepare LLDPE polymers having broad melt flow ratios.

Abstract: Polyethylene films having a good balance of optical and mechanical properties are disclosed. The films are derived from ethylene copolymer compositions made with a suitably substituted phosphinimine catalyst. The ethylene copolymers have very narrow molecular weight distributions and broadened comonomer distributions.

Abstract: An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The PCIA comprises a motherboard parallel to the semiconductor wafer having an upper surface and an opposing lower planar mounting surface, a reference plane defined by a least three points located between the lower surface of the motherboard and the wafer, at least one component located below the motherboard mounting surface, and a mechanism for adjusting the planarity of the reference plane with respect to the wafer. A probe chip having a plurality of spring probes extending there from is mountable and demountable from the PCIA, without the need for further planarity adjustment. The interconnection structures and methods preferably provide improved fabrication cycles.

Abstract: An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The PCIA comprises a motherboard parallel to the semiconductor wafer having an upper surface and an opposing lower planar mounting surface, a reference plane defined by a least three points located between the lower surface of the motherboard and the wafer, at least one component located below the motherboard mounting surface, and a mechanism for adjusting the planarity of the reference plane with respect to the wafer. A probe chip having a plurality of spring probes extending there from is mountable and demountable from the PCIA, without the need for further planarity adjustment. The interconnection structures and methods preferably provide improved fabrication cycles.

Abstract: An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The PCIA comprises a motherboard parallel to the semiconductor wafer having an upper surface and an opposing lower planar mounting surface, a reference plane defined by a least three points located between the lower surface of the motherboard and the wafer, at least one component located below the motherboard mounting surface, and a mechanism for adjusting the planarity of the reference plane with respect to the wafer. A probe chip having a plurality of spring probes extending there from is mountable and demountable from the PCIA, without the need for further planarity adjustment. The interconnection structures and methods preferably provide improved fabrication cycles.

Abstract: An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The PCIA comprises a motherboard parallel to the semiconductor wafer having an upper surface and an opposing lower planar mounting surface, a reference plane defined by a least three points located between the lower surface of the motherboard and the wafer, at least one component located below the motherboard mounting surface, and a mechanism for adjusting the planarity of the reference plane with respect to the wafer. A probe chip having a plurality of spring probes extending there from is mountable and demountable from the PCIA, without the need for further planarity adjustment. The interconnection structures and methods preferably provide improved fabrication cycles.

Abstract: A microbe-specific medium, containing specific chromogenic substrates, for the detection of vancomycin-resistant enterococci in a biological sample, whereby both the detection and identification of vancomycin-resistant enterococci at the species level is achieved utilizing one sample and one test.

Abstract: Supported catalyst systems for the polymerisation of olefins, comprise (a) at least two different monocyclopentadienyl transition metal compounds, (b) one or more activators comprising an ionic compound comprising (i) a cation and (ii) an anion having up to 100 non-hydrogen atoms and the anion containing at least one substituent comprising a moiety having an active hydrogen, and (c) one or more support materials. The, supported “mixed or dual site” catalyst systems comprising different monocyclopentadienyl catalysts when activated by specific ionic activators lead to catalyst systems showing an improved balance of properties which may be used to prepare LLDPE polymers having broad melt flow ratios.

Abstract: An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The PCIA comprises a motherboard parallel to the semiconductor wafer having an upper surface and an opposing lower planar mounting surface, a reference plane defined by a least three points located between the lower surface of the motherboard and the wafer, at least one component located below the motherboard mounting surface, and a mechanism for adjusting the planarity of the reference plane with respect to the wafer. A probe chip having a plurality of spring probes extending there from is mountable and demountable from the PCIA, without the need for further planarity adjustment. The interconnection structures and methods preferably provide improved fabrication cycles.

Abstract: A solid composition stick applicator is provided. The applicator comprises an applicator body having a first and second end, the second end having an opening through which a solid composition stick is dispensed. Within the applicator is housed a helical tension spring having a first spring end and a second spring end, the first spring end, second spring end, or both the first and second spring end held at a fixed position with respect to the applicator body. The helical tension spring is wound around a guide system that is housed within the applicator body. A pushing assembly is attached to the helical tension spring and the pushing assembly is movable from a first position at or near the first end of the applicator body, to a second position at or near the second end of the applicator body. Tension within the helical tension spring is greater in the first position than in the second position thereby urging the pushing assembly towards the second end of the applicator body.