Patents by Inventor Douglas Nobbs

Douglas Nobbs has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8439615
    Abstract: An assembly for mounting electronic components includes a face plate comprising a thermoplastic material. The face plate includes a retaining element for securing a captive screw and spring assembly for mounting an electronic printed circuit board. The retaining element includes one or more slots adapted to expand the element to permit insertion of the screw and deformation of the hole upon insertion of the screw, while locking the screw to retain the screw in place. This arrangement permits the elimination of the metal standoff frequently used in similar devices. Methods for preparing the assembly and mounting the printed circuit boards are also described.
    Type: Grant
    Filed: July 26, 2007
    Date of Patent: May 14, 2013
    Assignee: Parker-Hannifin Corporation
    Inventors: Chi H. Wu, Liu C. Lei, Thomas J. Socci, Douglas Nobbs, George R. Watchko
  • Patent number: 7589284
    Abstract: An EMI shielding material is provided for making EMI shielding gaskets, coating and other articles. The EMI shielding material includes a non-conductive polymer, an inherently conductive polymer and a conductive metal powder. These components are intimately combined to prepare EMI shielding materials having superior electrical and mechanical performance when used in applications such as housings for electronic components.
    Type: Grant
    Filed: September 12, 2006
    Date of Patent: September 15, 2009
    Assignee: Parker Hannifin Corporation
    Inventors: Christopher L. Severance, Douglas Nobbs, John D. Reynolds
  • Patent number: 7446265
    Abstract: An apparatus for providing board level shielding of Electromagnetic Interference in a printed circuit board is disclosed. The apparatus includes a plastic part, a metal conformal coating and a form-in-place Electromagnetic Interference gasket. The plastic part is configured in one or more compartments to provide an enclosure, and is attached to the printed circuit board. The metal conformal coating is applied continuously to one or more surfaces of the plastic part. The form-in-place Electromagnetic Interference gasket is applied on top of the metal conformal coating in an area of a part flange.
    Type: Grant
    Filed: April 14, 2006
    Date of Patent: November 4, 2008
    Assignee: Parker Hannifin Corporation
    Inventors: Eric G. Krohto, Lawrence J. Denefrio, Peter Jones, John C. Ariel, Matthew T. Gagnon, Douglas Nobbs, George R. Watchko, Marc E. LaRosse
  • Publication number: 20080121848
    Abstract: The present invention relates to an electrically conductive article. The electrically conductive article is made of an injection moldable polymer. An electrically conductive material is embedded in the injection moldable polymer, and a carbon based material is also embedded in the injection moldable polymer. The electrically conductive article may be in the form of a pellet or a plate, and may be used as an EMI shield.
    Type: Application
    Filed: March 29, 2007
    Publication date: May 29, 2008
    Inventor: Douglas Nobbs
  • Publication number: 20080025813
    Abstract: An assembly for mounting electronic components includes a face plate comprising a thermoplastic material. The face plate includes a retaining element for securing a captive screw and spring assembly for mounting an electronic printed circuit board. The retaining element includes one or more slots adapted to expand the element to permit insertion of the screw and deformation of the hole upon insertion of the screw, while locking the screw to retain the screw in place. This arrangement permits the elimination of the metal standoff frequently used in similar devices. Methods for preparing the assembly and mounting the printed circuit boards are also described.
    Type: Application
    Filed: July 26, 2007
    Publication date: January 31, 2008
    Inventors: Chi Wu, Liu Lei, Thomas Socci, Douglas Nobbs, George Watchko
  • Publication number: 20070056769
    Abstract: An EMI shielding material is provided for making EMI shielding gaskets, coating and other articles. The EMI shielding material includes a non-conductive polymer, an inherently conductive polymer and a conductive metal powder. These components are intimately combined to prepare EMI shielding materials having superior electrical and mechanical performance when used in applications such as housings for electronic components.
    Type: Application
    Filed: September 12, 2006
    Publication date: March 15, 2007
    Inventors: Christopher Severance, Douglas Nobbs, John Reynolds
  • Publication number: 20060260839
    Abstract: An apparatus for providing board level shielding of Electromagnetic Interference in a printed circuit board is disclosed. The apparatus includes a plastic part, a metal conformal coating and a form-in-place Electromagnetic Interference gasket. The plastic part is configured in one or more compartments to provide an enclosure, and is attached to the printed circuit board. The metal conformal coating is applied continuously to one or more surfaces of the plastic part. The form-in-place Electromagnetic Interference gasket is applied on top of the metal conformal coating in an area of a part flange.
    Type: Application
    Filed: April 14, 2006
    Publication date: November 23, 2006
    Inventors: Eric Krohto, Lawrence Denefrio, Peter Jones, John Ariel, Matthew Gagnon, Douglas Nobbs, George Watchko, Marc LaRosse
  • Patent number: 7005573
    Abstract: An EMI shield having at least one compartment for enclosing circuitry of an electronic device. The shield includes a first member formed of a first material such as a thin metal sheet or screen, or a metal-plated fabric or other electrically-conductive mesh, and a second member formed of a second material different than the first material which second material is an admixture of a plastic or other polymeric component and an electrically-conductive particulate filler component. The second member is integrally joined to the first member, and has at least one wall which extends from the first member and which together with the first member defines at least a portion of the compartment.
    Type: Grant
    Filed: February 12, 2004
    Date of Patent: February 28, 2006
    Assignee: Parker-Hannifin Corporation
    Inventors: William G. Lionetta, Louis M. Yantosca, Jr., Daniel S. Ventura, Christopher L. Severance, Douglas Nobbs, Robert E. Stiffler, David C. Rich
  • Publication number: 20040172502
    Abstract: An EMI shield having at least one compartment for enclosing circuitry of an electronic device. The shield includes a first member formed of a first material such as a thin metal sheet or screen, or a metal-plated fabric or other electrically-conductive mesh, and a second member formed of a second material different than the first material which second material is an admixture of a plastic or other polymeric component and an electrically-conductive particulate filler component. The second member is integrally joined to the first member, and has at least one wall which extends from the first member and which together with the first member defines at least a portion of the compartment.
    Type: Application
    Filed: February 12, 2004
    Publication date: September 2, 2004
    Inventors: William G. Lionetta, Louis M. Yantosca, Daniel S. Ventura, Christopher L. Severance, Douglas Nobbs, Robert E. Stiffler, David C. Rich
  • Patent number: 6763576
    Abstract: Manufacture of an electromagnetic interference (EMI) shielding cover or other enclosure part for housing circuitry of an electronic device. The enclosure part has an exterior surface and an opposing interior surface metallized with an electrically-conductive EMI shielding layer. The layer is sprayed onto the interior surface in a molten state and is solidified to form a corrosion-resistant, self-adherent coating.
    Type: Grant
    Filed: May 1, 2002
    Date of Patent: July 20, 2004
    Assignee: Parker-Hannifin Corporation
    Inventors: George R. Watchko, Brian F. Flaherty, Matthew T. Gagnon, Douglas Nobbs, Steven L. Thornton, Walter H. Dolbier, Jr., George A. Lee, James J. Sauer
  • Publication number: 20020166682
    Abstract: Manufacture of an electromagnetic interference (EMI) shielding cover or other enclosure part for housing circuitry of an electronic device. The enclosure part has an exterior surface and an opposing interior surface metallized with an electrically-conductive EMI shielding layer. The layer is sprayed onto the interior surface in a molten state and is solidified to form a corrosion-resistant, self-adherent coating.
    Type: Application
    Filed: May 1, 2002
    Publication date: November 14, 2002
    Inventors: George R. Watchko, Brian F. Flaherty, Matthew T. Gagnon, Douglas Nobbs, Steven L. Thornton, Walter H. Dolbier, George A. Lee, James J. Sauer
  • Patent number: 5328651
    Abstract: A method for manufacturing an automobile trim component includes the step of coextruding a plastic unfoamed material and foamed material into a multilayer parison, which is thereafter blow molded to a desired form. After the layers are cured, the article is removed from the blow mold and sectioned into multilayer skin halves, and one skin is placed in an injection mold. The core resin, either thermoplastic or thermoset in nature, is then injected into the injection mold and onto the skin, and then compresses the resin against the skin to produce a shell comprising a resin core layer, intermediate foam layer, and decorative outer layer.
    Type: Grant
    Filed: March 5, 1993
    Date of Patent: July 12, 1994
    Assignee: Davidson Textron Inc.
    Inventors: Michael J. Gallagher, Douglas Nobbs