Abstract: Improvements in a molecular-dynamic simulator provide ways to save energy during computation and reduce die area consumed on an integrated circuit. Examples of such improvements include different interaction modules for different ranges, the use of streaming along rows while multicasting along columns in an array of interaction modules, the selection of computation units based on balancing computational costs and communication costs, the use of fences in networks that connect computation units, and the use of bond calculators to carry out specialized bond calculations.

Abstract: A three-part epoxy grout composition comprises a liquid epoxy blend, a liquid hardener, and a graded particulate aggregate, wherein the dry aggregate particles are pretreated with an applied adhesion promoter in an amount of 0.01 to 5% by weight. The volume of pretreated aggregate particles, when mixed with the epoxy blend and the hardener, comprises at least 70% by volume of the cured grout. Pretreatment of the aggregate by coating with adhesion promoter allows more efficient use of chemicals along with improved strength. Related methods are also disclosed.

Abstract: Disclosed herein is a computer-implemented method comprising aggregating PFAS remediation evaluation data for a plurality of remediation options and for a plurality of predefined criteria; graphically displaying the user modifiable chart comprising the plurality of graphical representations of the aggregated PFAS remediation evaluation data, wherein: each graphical representation depicts data points visually plotted with weights, the plurality of graphical representations for the plurality of predefined criteria are visually ordered according to a rank of the plurality of predefined criteria, and the weights are based on the rank of the plurality of predefined criteria; detecting a first user input modifying the rank of at least one predefined criterion; in accordance with the first user input, automatically updating the weights of the data points; and displaying an updated user modifiable chart comprising the plurality of graphical representations of the aggregated PFAS remediation evaluation data.

Abstract: Disclosed herein are glass pharmaceutical vials having sidewalls of reduced thickness. In embodiments, the glass pharmaceutical vial may include a glass body comprising a sidewall enclosing an interior volume. An outer diameter D of the glass body is equal to a diameter d1 of a glass vial of size X as defined by ISO 8362-1, wherein X is one of 2R, 3R, 4R, 6R, 8R, 10R, 15R, 20R, 25R, 30R, 50R, and 100R as defined by ISO 8362-1. However, the sidewall of the glass pharmaceutical vial comprises an average wall thickness Ti that is less than or equal to 0.85*s1, wherein s1 is a wall thickness of the glass vial of size X as defined by ISO 8362-1 and X is one of 2R, 3R, 4R, 6R, 8R, 10R, 15R, 20R, 25R, 30R, 50R, and 100R as defined by ISO 8362-1.

Abstract: Disclosed herein are glass pharmaceutical vials having sidewalls of reduced thickness. In embodiments, the glass pharmaceutical vial may include a glass body comprising a sidewall enclosing an interior volume. An outer diameter D of the glass body is equal to a diameter d1 of a glass vial of size X as defined by ISO 8362-1, wherein X is one of 2R, 3R, 4R, 6R, 8R, 10R, 15R, 20R, 25R, 30R, 50R, and 100R as defined by ISO 8362-1. However, the sidewall of the glass pharmaceutical vial comprises an average wall thickness Ti that is less than or equal to 0.85*s1, wherein s1 is a wall thickness of the glass vial of size X as defined by ISO 8362-1 and X is one of 2R, 3R, 4R, 6R, 8R, 10R, 15R, 20R, 25R, 30R, 50R, and 100R as defined by ISO 8362-1.

Abstract: A method for controlling a robotic system includes determining a location and/or a pose of a power system component based on data received from one or more sensors, and determining a mapping of a location of a robotic system within a model of an external environment of the robotic system based on the data. The model of the external environment provides locations of objects external to the robotic system. A sequence of movements of components of the robotic system is determined to perform maintenance on the power system component based on the locations of the objects external to the robotic system and/or the location or pose of the power system component. One or more control signals are communicated to remotely control movement of the components of the robotic system based on the sequence or movements of the components to perform maintenance on the power system component.

Abstract: A minimally invasive dilation device includes a plurality of rigid arms radially arrayed about a center and a dilating member positioned between the arms. A stylus may occupy the center. An outer flexible sleeve may be circumferentially secured to the arms, lying within or without the plurality of arms. An inner mesh may surround the stylus and dilating member. The device may be introduced into tissue toward a targeted area, while in a closed configuration. The dilating member may be a balloon, wherein upon inflation of the balloon, the arms are pushed radially outward, expanding the device and dilating the surrounding tissue. The dilating member may be a tube, wherein upon insertion of the tube, the arms are pushed radially outward. A cannula may be inserted inside the plurality of arms to keep the arms in an open configuration, and the dilating member may be withdrawn, providing an open passageway through the device to the targeted area. The device may be used with a neural monitoring system.

Abstract: A method of controlling an agricultural facility for housing a plurality of animals includes the step of regulating the environment within the agricultural facility with an automated building operational system. An automated thermal event controller is operationally coupled with the automated building operational system and generates a thermal event signal in response to a thermal event in progress, whereby the automated thermal event controller, upon receipt of the thermal event signal indicating that the thermal event is in progress, activates an alarm state. In the alarm state, the automated thermal event controller: sends an alarm signal to a system administrator; places the automated building operational system in a safety-mode condition for a first predetermined time interval; and places the automated building operational system in a normal-mode operational condition after the first predetermined time interval and if a confirmatory signal is not yet then received from the system administrator.

Abstract: Devices and techniques for loading contexts in a coarse-grained reconfigurable array processor are described herein. A system or apparatus may include context load circuitry operable to load context for a coarse-grained reconfigurable array processor, where the context load circuitry is configured to: (a) receive a kernel identifier; (b) access a first registry to obtain a context mask base address; (c) determine a context mask address from the context mask base address and the kernel identifier; (d) access a second registry to obtain a context state base address; (e) determine a context state address from the context state base address and the kernel identifier; (f) use a context mask at the context mask address to determine corresponding active context state; and (g) load the corresponding active context state into the coarse-grained reconfigurable array processor.

Abstract: The present disclosure generally relates to partial integrated core-shell investment casting molds that can be assembled into complete molds. Each section of the partial mold may contain both a portion of a core and portion of a shell. Each section can then be assembled into a mold for casting of a metal part. The partial integrated core-shell investment casting molds and the complete molds may be provided with filament structures corresponding to cooling hole patterns on the surface of the turbine blade or the stator vane, which provides a leaching pathway for the core portion after metal casting. The invention also relates to core filaments that can be used to supplement the leaching pathway, for example in a core tip portion of the mold.

Abstract: A climate-control system may include first and second compressors and a suction manifold. The first compressor includes a first shell, a first compression mechanism, and a first suction inlet through which working fluid is drawn into the first compressor. The second compressor includes a second shell, a second compression mechanism, and a second suction inlet through which working fluid is drawn into the second compressor. The suction manifold includes first and second arms. The first arm provides working fluid to the first suction inlet. The second arm provides working fluid to the second suction inlet. The second arm includes a first suction pipe, a second suction pipe, and a suction valve. The suction valve is movable between a first position in which working fluid is allowed to flow through the first suction pipe and a second position in which working fluid is allowed to flow through the second suction pipe.

Abstract: Backplane employing floating backplane network interconnects for electrical coupling with blade computer systems and related methods. To provide a displacement tolerant interconnection system between the backplane interconnects and respective blade backplane interconnects of blade computer systems to establish electrical connections therebetween, the backplane interconnects are provided as floating backplane interconnections. The floating backplane interconnects are configured to move and be displaced relative to the backplane while still retaining an electrical connection to the backplane. The backplane interconnects each include one or more flex circuits connected to electrical interconnects on the backplane on a first end, and electrical interconnects on a backplane connector on a second end.

Abstract: The description relates to cooling electronic components, such as computing devices. One example includes a rack defining a volume and multiple sealed chassis modules removably fluidly coupled to a two-phase condenser tank via a vapor coupler and a liquid coupler. Individual sealed chassis modules can contain one or more electronic components immersed in two-phase coolant that when heated by operation of the electronic components experiences a phase change from a liquid phase to a gas phase and travels to the two-phase condenser tank via the vapor coupler and is cooled in the two-phase condenser tank until experiencing a phase change back into the liquid phase. Individual sealed chassis modules can be decoupled from the two-phase condenser tank without releasing two-phase coolant and an entirety of the multiple sealed chassis modules and the condenser tank are contained in the volume of the rack.

Abstract: A processor includes a first die, a second die connected to the first die with a microfluidic volume positioned between the first die and the second die, a wicking heat spreader positioned in the microfluidic volume; and a boiling enhancement surface feature positioned on at least one surface of the wicking heat spreader.

Abstract: A thermal management device includes a wicking heat spreader and a boiling enhancement surface feature positioned on at least one interior surface of the wicking heat spreader.

Abstract: In some embodiments, a thermal management system includes an immersion tank defining an immersion chamber, a two-phase working fluid positioned in the immersion chamber, and a pressure trim device in fluid communication with the immersion chamber. The pressure trim device includes at least one of a cold thermal sink and a hot thermal sink. The cold thermal sink is maintained at a suppressed temperature less than a boiling temperature of the two-phase working fluid. The hot thermal sink is maintained at an elevated temperature greater than a boiling temperature of the two-phase working fluid.

Abstract: A heat sink includes a body with an expansion chamber therein. The body is configured to receive heat from a heat source. The expansion chamber is configured to expand a working fluid from an inlet port to an outlet port of the heat sink. An immersion system includes a heat sink and a pressurizing mechanism for pressurizing the working fluid prior to the inlet port.

Abstract: An immersion cooling thermal management system includes a heat duct thermally coupled to a heat-generating electronic component. The heat duct has an inlet at a first longitudinal end of a channel and an outlet at an opposite second longitudinal end of the channel. The heat-generating electronic component is thermally coupled with the channel longitudinally between the inlet and the outlet. The outlet of the channel is higher than the inlet relative to a direction of gravity.

Abstract: Systems with indium application to heat transfer surfaces and related methods are described. A system includes a chassis, arranged inside a housing, having at least one slot for receiving a blade. The blade, arranged in a slot of the chassis, includes a first circuit board having a plurality of components mounted on a substrate. The blade further includes a first heat spreader comprising a metal. The first heat spreader including metal is arranged to transfer heat from the first circuit board to a cooling system via a first interface between a first surface of the first heat spreader and a second surface of the chassis, and where indium is permanently bonded to either the first surface of the first heat spreader, or the second surface of the chassis, or both the first surface of the first heat spreader and the second surface of the chassis.

Abstract: The description relates to cooling electronic components, such as computing devices. One example includes a rack defining a volume and multiple sealed chassis modules removably fluidly coupled to a two-phase condenser tank via a vapor coupler and a liquid coupler. Individual sealed chassis modules can contain one or more electronic components immersed in two-phase coolant that when heated by operation of the electronic components experiences a phase change from a liquid phase to a gas phase and travels to the two-phase condenser tank via the vapor coupler and is cooled in the two-phase condenser tank until experiencing a phase change back into the liquid phase. Individual sealed chassis modules can be decoupled from the two-phase condenser tank without releasing two-phase coolant and an entirety of the multiple sealed chassis modules and the condenser tank are contained in the volume of the rack.