Abstract: A cooling configuration is provided for chassis-mounted electronics boards. In one embodiment, the chassis comprises a housing and at least two electronics boards. The electronics boards may comprise communication boards having a plurality of ports. Cooling air spaces are defined above and below each board, permitting cooling air to be drawn over both sides of each board. Baffles may be provided at both sides of the boards for controlling the flow of air through the various air spaces, such as baffles extending down from a top of the housing or up from a bottom of the housing, or baffles located between the boards.

Abstract: A cooling configuration is provided for chassis-mounted electronics boards. In one embodiment, the chassis comprises a housing and at least two electronics boards. The electronics boards may comprise communication boards having a plurality of ports. Cooling air spaces are defined above and below each board, permitting cooling air to be drawn over both sides of each board. Baffles may be provided at both sides of the boards for controlling the flow of air through the various air spaces, such as baffles extending down from a top of the housing or up from a bottom of the housing, or baffles located between the boards.

Abstract: A cooling distribution configuration is provided for chassis-mounted electronics boards. In one embodiment, the chassis comprises a housing and at least one electronics board. The electronics board may comprise a communication board having a plurality of ports. Cooling air spaces are defined above and below the board, permitting cooling air to be drawn over both sides of the board. Notches extend inwardly from an edge of the board, the notches serving as air flow paths between the cooling air spaces and serving to distribute cooling air flowing into the housing from one or more intakes to the cooling air spaces.

Abstract: A cooling distribution configuration is provided for chassis-mounted electronics boards. In one embodiment, the chassis comprises a housing and at least one electronics board. The electronics board may comprise a communication board having a plurality of ports. Cooling air spaces are defined above and below the board, permitting cooling air to be drawn over both sides of the board. Notches extend inwardly from an edge of the board, the notches serving as air flow paths between the cooling air spaces and serving to distribute cooling air flowing into the housing from one or more intakes to the cooling air spaces.

Abstract: A cooling configuration is provided for chassis-mounted electronics boards. In one embodiment, the chassis comprises a housing and at least two electronics boards. The electronics boards may comprise communication boards having a plurality of ports. Cooling air spaces are defined above and below each board, permitting cooling air to be drawn over both sides of each board. Baffles may be provided at both sides of the boards for controlling the flow of air through the various air spaces, such as baffles extending down from a top of the housing or up from a bottom of the housing, or baffles located between the boards.