Abstract: Methods and apparatus for applying internal features or complex mechanical structures to a surface of a metal part are disclosed. According to one aspect of the present invention, a method for creating an assembly that includes a substrate and a molded piece involves obtaining the substrate, and forming at least one binding feature on a surface of the substrate. The method also includes molding on a surface of the binding feature and the surface of the substrate. Molding on the surface of the binding feature and the surface of the substrate mechanically binds the molded piece to the substrate.

Abstract: A tamping device is disclosed herein which measures a tamp force applied to ground coffee in a portafilter and provides feedback to the user when a desired tamp force has been achieved so that the user can stop the tamping step when preparing the portafilter to brew espresso. The tamping device may also have a plurality of force sensors, which measure how even the user applied force is being applied to the ground coffee in the portafilter so that a density of the ground coffee is even throughout the compressed ground coffee formed by tamping the ground coffee.

Abstract: Techniques, processes and structures are disclosed for providing markings on products, such as electronic devices. For example, the markings can be formed using physical vapor deposition (PVD) processes to deposit a layer of material. The markings or labels may be textual and/or graphic. The markings are deposited on a compliant layer that is disposed on a surface to be marked. The compliant layer is arranged to isolate the surface to be marked from the layer of material deposited using the PVD process.

Abstract: A method for assigning measurement data for cloud-based monitoring of mechanical assets of an industrial facility that includes a measurement data archive, in which measurement data from a multiplicity of measurement points are stored, includes establishing an asset that has a particular type, the asset being assigned a characteristic measurement value with an associated measurement point in the cloud; reading a connection, stored in the cloud for the particular asset type, between measurement values, relevant to the particular asset type, from various measurement points; gradually estimating parameters of the connection, using the characteristic measurement value belonging to the particular asset type and the measurement data of the measurement values relevant to the particular asset; gradually comparing the previously determined connection with the measurement data used for the estimation and determining a residual; and assigning the measurement data to a particular asset based on a statistical evaluation o

Abstract: Methods for improved ceramics component casting. One such method may include vacuuming a ceramic-based slurry mixture and/or vacuuming a component mold. The vacuuming of the ceramic-based slurry mixture and the component mold may be to remove air bubbles from the respective elements. More specifically, the vacuuming may remove air bubbles from the ceramic-based slurry mixture and from a cavity of the component mold, respectively. The method may also include disposing the ceramic-based slurry mixture into the cavity of the component mold, and continuously vacuuming the cavity of the component mold including the ceramic-based slurry mixture for a predetermined time to remove any additional air bubbles included in the ceramic-based slurry mixture. Finally, the method may include forming a ceramic component within the continuously vacuumed cavity of the component mold over the duration of the predetermined time. The ceramic component formed from the ceramic-based slurry mixture.

Abstract: Methods and apparatus for applying internal features or complex mechanical structures to a surface of a metal part are disclosed. According to one aspect of the present invention, a method for creating an assembly that includes a substrate and a molded piece involves obtaining the substrate, and forming at least one binding feature on a surface of the substrate. The method also includes molding on a surface of the binding feature and the surface of the substrate. Molding on the surface of the binding feature and the surface of the substrate mechanically binds the molded piece to the substrate.

Abstract: Methods and apparatus for applying internal features or complex mechanical structures to a surface of a metal part are disclosed. According to one aspect of the present invention, a method for creating an assembly that includes a substrate and a molded piece involves obtaining the substrate, and forming at least one binding feature on a surface of the substrate. The method also includes molding on a surface of the binding feature and the surface of the substrate. Molding on the surface of the binding feature and the surface of the substrate mechanically binds the molded piece to the substrate.

Abstract: Apparatus, systems and methods for improving strength of a thin glass member for an electronic device are disclosed. In one embodiment, the glass member can have improved strength by using multi-bath chemical processing. The multi-bath chemical processing allows greater levels of strengthening to be achieved for glass member. In one embodiment, the glass member can pertain to a glass cover for a housing of an electronic device.

Abstract: The present invention relates to a circuit breaker (20, 40) comprising a handle (33) connected to a switching and trip mechanism (25) in the base unit (20a), and capable of opening and closing a system (24) of electrical contacts in normal operation, ensuring the interchangeability between a pluggable electronic trip module (20b) and/or a pluggable thermomagnetic trip module (20b), using the same structural base unit (20a). The device comprises a main electric circuit “1” and a secondary circuit “2” or “2b”, wherein the main circuit “1”, using a current transformer (29) in the base unit (20a) which converts a current flowing in the main circuit “1” of the power line (23) to power the secondary circuit “2” or “2b”, issues a trip command to protect the main circuit “1”, opening the contact system (24) when predefined current limits are exceeded.

Abstract: A device for moving coffee grounds from the coffee grinder into a portafilter or other coffee brewing device without spilling coffee grinds. The device may consist of 3 separate parts—a main body, a plug, and a cap—that fit together such that when shaken or agitated coffee grinds on the inside cannot spill out. This allows for easy homogenization without mess of the grinds before brewing, a process that is becoming more prominent in the industry with the advance of specialty coffee. The device fits onto the lip of a portafilter such that removal of the cap and plug allow all of the homogenized coffee grinds to fall directly into the portafilter basket.

Abstract: A device for grinding coffee beans one shot at a time. The device may consist of an inlet funnel attached to a main body, wherein the beans are gravity fed to a set of burrs that grind the coffee into a grounds chamber, where they are then expunged into a grounds receptacle. The grounds receptacle may be adjusted in height via arms attached to the grinder depending on the workflow of the user and the type of receptacle being used. The grounds chamber is a clamshell design easily removable by the user for cleaning and held in place with magnets and alignment pins. As the grinder grinds coffee, wipers on the mounts for the burr create a positive pressure air flow to expunge the ground beans in addition to physically manipulating them out of the exit chute. This allows for grinding and expulsion of all of the input coffee without retention, a common problem in the industry when grinders are used for single shot grinding.

Abstract: Techniques, processes and structures are disclosed for providing markings on products, such as electronic devices. For example, the markings can be formed using physical vapor deposition (PVD) processes to deposit a layer of material. The markings or labels may be textual and/or graphic. The markings are deposited on a compliant layer that is disposed on a surface to be marked. The compliant layer is arranged to isolate the surface to be marked from the layer of material deposited using the PVD process.

Abstract: Techniques, processes and structures are disclosed for providing markings on products, such as electronic devices. For example, the markings can be formed using physical vapor deposition (PVD) processes to deposit a layer of material. The markings or labels may be textual and/or graphic. The markings are deposited on a compliant layer that is disposed on a surface to be marked. The compliant layer is arranged to isolate the surface to be marked from the layer of material deposited using the PVD process.

Abstract: Methods and apparatuses for monitoring and regulating physiological states and functions are disclosed. Several embodiments include application of one or more microelectrode arrays to a dorsal root ganglion for measurement of sensory neuron activity, or stimulation of sensory reflex circuits. The methods and apparatuses can be used, for example, for monitoring or controlling bladder function in a patient.

Abstract: Methods and apparatuses for monitoring and regulating physiological states and functions are disclosed. Several embodiments include application of one or more microelectrode arrays to a dorsal root ganglion for measurement of sensory neuron activity, or stimulation of sensory reflex circuits. The methods and apparatuses can be used, for example, for monitoring or controlling bladder function in a patient.

Abstract: Methods and apparatus for applying internal features or complex mechanical structures to a surface of a metal part are disclosed. According to one aspect of the present invention, a method for creating an assembly that includes a substrate and a molded piece involves obtaining the substrate, and forming at least one binding feature on a surface of the substrate. The method also includes molding on a surface of the binding feature and the surface of the substrate. Molding on the surface of the binding feature and the surface of the substrate mechanically binds the molded piece to the substrate.

Abstract: Electronic devices and methods for creating various haptic effects. In one example, an electronic device may include a first haptic module for creating a first haptic effect, the first haptic module having a first weight member that selectively moves in a substantially vertical orientation relative to the first haptic module; a second haptic module for creating a second haptic effect, the second haptic module having a second weight member that selectively moves in a substantially horizontal orientation relative to the second haptic module; and a processor for controlling the first and second haptic modules. In one example, the processor selectively activates either the first haptic module or the second haptic module based on one or more events or conditions, such as the current orientation or position of the electronic device.