Abstract: In an optical inspection tool, an image of an object under inspection, such as a semiconductor wafer, may be obtained using imaging optics defining a focal plane. Light comprising the image can be split into portions that are detected using multiple detectors which each register a portion of the image. The image of the object at the focal plane can be split into two, three, or more parts by polarization-based beam splitters and/or lenses positioned tangent to the focal plane. The splitting apparatus may comprise a pair of arrays of half-cylinder lenses comprising a convex side and a flat side. The arrays can be positioned with the cylinder axes perpendicular to one another and the flat sides facing each other. Thus, the pair of arrays can divide incoming light into a plurality of rectangular portions without introducing non-uniformities which would occur if several spherical lenses are configured for use in a rectangular array.

Abstract: A method and an apparatus for estimating bone age by at least one acoustic signal in an ossification-actuated skeletal structure. The apparatus includes an acoustic transmitter and an acoustic receiver positioned facing each other so that the structure is positioned between them. The structure has at least two bones. The transmitter is adapted for transmitting a signal to cross the structure transversely. An electronic moveable gantry is provided for adjusting the position of the acoustic transmitter and the acoustic receiver in relation to the structure. A computer system is enabled to perform one or more functions to position the moveable gantry; transmit the signal by the transmitter; control the signal transmitted by the transmitter; receive the transmitted signal by the receiver; and estimate bone age responsive to the received signal by at least one bone age calculation formula.

Abstract: An inspection system may be configured to inspect objects, such as semiconductor wafers, using narrow-pulse broadband illumination. The illumination may be obtained in some embodiments using a laser configured to emit light into a material having a spectral broadening effect. The inspection system can include various filters which may be selectively placed in the illumination and/or imaging path in order to tune the spectrum of light impinging on the wafer and the light that is detected. The filters may include selectable filters, fixed filters, and filters whose characteristics can be adjusted in-place. In some embodiments, filters may be used to match the illumination/detection spectra of different tools. Additionally, the broadband illumination may be tuned between inspections and/or during inspections for best results. The system may support Fourier filtering whereby light, related to repetitive features of the object and in one or more wavelength sub-bands of the illumination, may be filtered.

Abstract: An optical inspection system or tool can be configured to adjust the distribution of light by using one or more diffusers. The diffusers can be variable in some embodiments. For example, the angular or spatial distribution of the illumination can be adjusted to minimize intensity of illumination outside of an imaged area to thereby reduce illumination loss. The angular or spatial distribution may additionally or alternatively be adjusted so that the illumination across an illuminated area is substantially uniform. The use of one or more diffusers may aid in the inspection of semiconductor objects including, but not limited to, semiconductor wafers and the like.

Abstract: Fast on-line electro-optical detection of wafer defects by illuminating with a short light pulse from a repetitively pulsed laser, a section of the wafer while it is moved across the field of view of an imaging system, and imaging the moving wafer onto a focal plane assembly, optically forming a continuous surface of photo-detectors at the focal plane of the optical imaging system. The continuously moving wafer is illuminated by a laser pulse of duration significantly shorter than the pixel dwell time, such that there is effectively no image smear during the wafer motion. The laser pulse has sufficient energy and brightness to impart the necessary illumination to each sequentially inspected field of view required for creating an image of the inspected wafer die. A novel fiber optical illumination delivery system, which is effective in reducing the effects of source coherence is described.

Abstract: An inspection system may be configured to inspect objects, such as semiconductor wafers, using narrow-pulse broadband illumination. The illumination may be obtained in some embodiments using a laser configured to emit light into a material having a spectral broadening effect. The inspection system can include various filters which may be selectively placed in the illumination and/or imaging path in order to tune the spectrum of light impinging on the wafer and the light that is detected. The filters may include selectable filters, fixed filters, and filters whose characteristics can be adjusted in-place. In some embodiments, filters may be used to match the illumination/detection spectra of different tools. Additionally, the broadband illumination may be tuned between inspections and/or during inspections for best results. The system may support Fourier filtering whereby light, related to repetitive features of the object and in one or more wavelength sub-bands of the illumination, may be filtered.

Abstract: An inspection system can support operation in multiple states. For instance, when inspecting an article, such as a semiconductor wafer, the tool can switch between imaging multiple locations using respective detectors to another operating state wherein multiple detectors operating in multiple imaging modes inspect a single location. An inspection system may combine the use of multiple detectors for multiple locations and the use of multiple viewing angles or modes for the same locations and thereby achieve high throughput. The different imaging modes can comprise, for example, different collection angles, polarizations, different spectral bands, different attenuations, different focal positions relative to the wafer, and other different types of imaging.

Abstract: Fast on-line electro-optical detection of wafer defects by illuminating with a short light pulse from a repetitively pulsed laser, a section of the wafer while it is moved across the field of view of an imaging system, and imaging the moving wafer onto a focal plane assembly, optically forming a continuous surface of photo-detectors at the focal plane of the optical imaging system. The continuously moving wafer is illuminated by a laser pulse of duration significantly shorter than the pixel dwell time, such that there is effectively no image smear during the wafer motion. The laser pulse has sufficient energy and brightness to impart the necessary illumination to each sequentially inspected field of view required for creating an image of the inspected wafer die. A novel fiber optical illumination delivery system, which is effective in reducing the effects of source coherence is described.

Abstract: An inspection system for inspecting an object, the system comprising an illuminator including at least one pulsed light source, a detector assembly, and a relative motion provider operative to provide motion of the object relative to the detector assembly, along an axis of motion, the detector assembly comprising a plurality of 2-dimensional detector units whose active areas are arranged at intervals.

Abstract: A fiber optical illumination delivery system, which is effective in reducing the effects of source coherence. The system preferably utilizes either a single bundle of optical fibers, or serial bundles of optical fibers. In the single bundle embodiment, the differences in optical lengths between different fibers of the bundle is preferably made to be equal to even less than the coherence length of the source illumination. In the serial bundle embodiment, the fibers in the other bundle are arranged as groups of fibers of the same length, and it is the difference in lengths of these groups which is made equal to, or even more preferably, less than the overall difference in length between the shortest and the longest fibers in the other bundle. Both of these fiber systems enable construction of illumination systems delivering a higher level of illumination, but without greatly affecting the coherence breaking abilities of the system, thus enabling a generally more applicable system to be constructed.

Abstract: An inspection system for inspecting an object, the system comprising an illuminator including at least one pulsed light source, a detector assembly, and a relative motion provider operative to provide motion of the object relative to the detector assembly, alone an axis of motion, the detector assembly comprising a plurality of 2-dimensional detector units whose active areas are arranged at intervals.

Abstract: Fast on-line electro-optical detection of wafer defects by illuminating with a short light pulse from a repetitively pulsed laser, a section of the wafer while it is moved across the field of view of an imaging system, and imaging the moving wafer onto a focal plane assembly, optically forming a continuous surface of photo-detectors at the focal plane of the optical imaging system. The continuously moving wafer is illuminated by a laser pulse of duration significantly shorter than the pixel dwell time, such that there is effectively no image smear during the wafer motion. The laser pulse has sufficient energy and brightness to impart the necessary illumination to each sequentially inspected field of view required for creating an image of the inspected wafer die. A novel fiber optical illumination delivery system, which is effective in reducing the effects of source coherence is described.

Abstract: In an optical inspection tool, an image of an object under inspection, such as a semiconductor wafer, may be obtained using imaging optics defining a focal plane. Light comprising the image can be split into portions that are detected using multiple detectors which each register a portion of the image. The image of the object at the focal plane can be split into two, three, or more parts by polarization-based beam splitters and/or lenses positioned tangent to the focal plane. The splitting apparatus may comprise a pair of arrays of half-cylinder lenses comprising a convex side and a flat side. The arrays can be positioned with the cylinder axes perpendicular to one another and the flat sides facing each other. Thus, the pair of arrays can divide incoming light into a plurality of rectangular portions without introducing non-uniformities which would occur if several spherical lenses are configured for use in a rectangular array.

Abstract: In an optical inspection tool, an image of an object under inspection, such as a semiconductor wafer, may be obtained using imaging optics defining a focal plane. Light comprising the image can be detected using multiple detectors which each register a portion of the image. The image of the object at the focal plane can be split into two, three, or more parts by mirrors or other suitable reflecting elements positioned tangent to the focal plane and/or with at least some portion at the focal plane with additional portions past the focal plane so that the focal plane lies between the imaging optics and the splitting apparatus. In some embodiments, reflective planes may be arranged to direct different portions to different detectors. Some reflective planes may be separated by a gap so that some portions of the light are directed while some portions pass through the gap.

Abstract: Illumination of objects in an optical inspection system may utilize an at least partially-coherent light source optically connected to a fiber optic bundle that is linked to a light guide comprising a single optical element. The combination of the bundle and element provides coherence-breaking effects and serves to smooth out angular and spatial non-uniformities. The end face of the light guide may be tapered such that the output end of the light guide is wider than the input end. The illumination system may be configured to illuminate an object such as a semiconductor wafer with critical, Kohler, or other illumination, and may further include a diffuser or other optical elements. The light guide and fiber bundle combination may be used alone or as part of a larger illumination system.

Abstract: An inspection system for inspecting an object, the system comprising an illuminator including at least one pulsed light source, a detector assembly, and a relative motion provider operative to provide motion of the object relative to the detector assembly, alone an axis of motion, the detector assembly comprising a plurality of 2-dimensional detector units whose active areas are arranged at intervals.

Abstract: An inspection system may be configured to inspect objects, such as semiconductor wafers, using narrow-pulse broadband illumination. The illumination may be obtained in some embodiments using a laser configured to emit light into a material having a spectral broadening effect. The inspection system can include various filters which may be selectively placed in the illumination and/or imaging path in order to tune the spectrum of light impinging on the wafer and the light that is detected. The filters may include selectable filters, fixed filters, and filters whose characteristics can be adjusted in-place. In some embodiments, filters may be used to match the illumination/detection spectra of different tools. Additionally, the broadband illumination may be tuned between inspections and/or during inspections for best results. The system may support Fourier filtering whereby light, related to repetitive features of the object and in one or more wavelength sub-bands of the illumination, may be filtered.

Abstract: An inspection system for inspecting an object, the system comprising an illuminator including at least one pulsed light source, a detector assembly, and a relative motion provider operative to provide motion of the object relative to the detector assembly, along an axis of motion, the detector assembly comprising a plurality of 2-dimensional detector units whose active areas are arranged at intervals.

Abstract: A fiber optical illumination delivery system, which is effective in reducing the effects of source coherence. The system preferably utilizes either a single bundle of optical fibers, or serial bundles of optical fibers. In the single bundle embodiment, the differences in optical lengths between different fibers of the bundle is preferably made to be equal to even less than the coherence length of the source illumination. In the serial bundle embodiment, the fibers in the other bundle are arranged as groups of fibers of the same length, and it is the difference in lengths of these groups which is made equal to, or even more preferably, less than the overall difference in length between the shortest and the longest fibers in the other bundle. Both of these fiber systems enable construction of illumination systems delivering a higher level of illumination, but without greatly affecting the coherence breaking abilities of the system, thus enabling a generally more applicable system to be constructed.

Abstract: A fiber optical illumination delivery system, which is effective in reducing the effects of source coherence. The system preferably utilizes either a single bundle of optical fibers, or serial bundles of optical fibers. In the single bundle embodiment, the differences in optical lengths between different fibers of the bundle is preferably made to be equal to even less than the coherence length of the source illumination. In the serial bundle embodiment, the fibers in the other bundle are arranged as groups of fibers of the same length, and it is the difference in lengths of these groups which is made equal to, or even more preferably, less than the overall difference in length between the shortest and the longest fibers in the other bundle. Both of these fiber systems enable construction of illumination systems delivering a higher level of illumination, but without greatly affecting the coherence breaking abilities of the system, thus enabling a generally more applicable system to be constructed.