Patents by Inventor Dow A. Eichenlaub

Dow A. Eichenlaub has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SYSTEMS INVOLVING SUPER WIDE BAND VERTICAL ANTENNA
    Publication number: 20190356044
    Abstract: An example system incorporates: an antenna structure having a feed structure and a top radiating element attached to the feed structure; the feed structure having a downwardly pointed, contiguous V-shaped body portion with an upper side extending between first and second inwardly extending sides, the first and second sides meeting at an apex of the V-shaped body portion; the top radiating element being attached to the feed structure along the upper side.
    Type: Application
    Filed: May 16, 2019
    Publication date: November 21, 2019
    Inventors: Dow A. Eichenlaub, Phillip Lindsey, Henry George Adamany
  • Periodic array assembly comprising arrays of periodic elements having inwardly extending protrusions
    Patent number: 10218079
    Abstract: Periodic structure assemblies are provided. An example assembly includes: a dielectric layer having a top and a bottom; a first frequency selective layer disposed on the top of the dielectric layer, the first frequency selective layer having a plurality of electrically conductive elements arranged as a first periodic structure; and a second frequency selective layer disposed on the bottom of the dielectric layer, the second frequency selective layer having a plurality of electrically conductive elements arranged as a second periodic structure. Another periodic structure assembly includes: a substrate; and an array of periodic elements defined by a contiguous trace of conductive material supported by the substrate, each of the periodic elements exhibiting side walls, with each of the side walls having an inwardly extending protrusion.
    Type: Grant
    Filed: April 3, 2017
    Date of Patent: February 26, 2019
    Assignee: VENTI GROUP, LLC
    Inventors: Phillip Lindsey, Dow A. Eichenlaub
  • MULTI-BAND PERIODIC STRUCTURE ASSEMBLIES FOR RADIO FREQUENCY DEVICES
    Publication number: 20180062233
    Abstract: Periodic structure assemblies are provided. An example assembly includes: a dielectric layer having a top and a bottom; a first frequency selective layer disposed on the top of the dielectric layer, the first frequency selective layer having a plurality of electrically conductive elements arranged as a first periodic structure; and a second frequency selective layer disposed on the bottom of the dielectric layer, the second frequency selective layer having a plurality of electrically conductive elements arranged as a second periodic structure. Another periodic structure assembly includes: a substrate; and an array of periodic elements defined by a contiguous trace of conductive material supported by the substrate, each of the periodic elements exhibiting side walls, with each of the side walls having an inwardly extending protrusion.
    Type: Application
    Filed: April 3, 2017
    Publication date: March 1, 2018
    Inventors: Phillip Lindsey, Dow A. Eichenlaub