Abstract: A multilayer printed circuit board is provided having a first conductive layer and a first plating resist selectively positioned within the first conductive layer. A second plating resist may be selectively positioned within a second conductive layer. A through hole extends through the first plating resist in the first conductive layer and the second plating resist in the second conductive layer. An interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist. This forms a partitioned plated through hole having a first via segment electrically isolated from a second via segment.

Abstract: A multilayer printed circuit board is provided having a first conductive layer and a first plating resist selectively positioned within the first conductive layer. A second plating resist may be selectively positioned within a second conductive layer. A through hole extends through the first plating resist in the first conductive layer and the second plating resist in the second conductive layer. An interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist. This forms a partitioned plated through hole having a first via segment electrically isolated from a second via segment.

Abstract: A multilayer printed circuit board is provided having a first conductive layer and a first plating resist selectively positioned within the first conductive layer. A second plating resist may be selectively positioned within a second conductive layer. A through hole extends through the first plating resist in the first conductive layer and the second plating resist in the second conductive layer. An interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist. This forms a partitioned plated through hole having a first via segment electrically isolated from a second via segment.

Abstract: A multilayer printed circuit board is provided having a first conductive layer and a first plating resist selectively positioned within the first conductive layer. A second plating resist may be selectively positioned within a second conductive layer. A through hole extends through the first plating resist in the first conductive layer and the second plating resist in the second conductive layer. An interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist. This forms a partitioned plated through hole having a first via segment electrically isolated from a second via segment.

Abstract: A method and apparatus for equalizing a reflection in a reflective high speed serial link. The method involves obtaining an amplitude and delay time of a compensating pulse that is transmitted in response to a pulse transmitted on the serial link. The apparatus comprises a programmable delay element and a driver stage configured to transmit a delayed and amplitude adjusted version of a pulse transmitted on the serial link. A method for equalizing a plurality of reflections in a reflective high speed serial link. The method involves obtaining an amplitude and delay time of a first compensating pulse and an amplitude and delay time of a second compensating pulse. The method further involves transmitting the first compensating and second compensating pulses in response to a pulse transmitted on the serial link.

Abstract: A method and apparatus for equalizing a reflection in a reflective high speed serial link. The method involves obtaining an amplitude and delay time of a compensating pulse that is transmitted in response to a pulse transmitted on the serial link. The apparatus comprises a programmable delay element and a driver stage configured to transmit a delayed and amplitude adjusted version of a pulse transmitted on the serial link. A method for equalizing a plurality of reflections in a reflective high speed serial link. The method involves obtaining an amplitude and delay time of a first compensating pulse and an amplitude and delay time of a second compensating pulse. The method further involves transmitting the first compensating and second compensating pulses in response to a pulse transmitted on the serial link.

Abstract: A memory system comprising memory modules including memory chips stacked with switching circuits. A memory controller coupled to the memory modules is configured to initiate memory accesses. When a stacked switching circuit detects the memory access, the switching circuit routes the access to another memory module if the access is not directed to a memory chip of the receiving memory module, or processes the access locally if the access is directed to a memory chip of the receiving memory module. The memory controller and memory modules are coupled via bi-directional serial links. Each memory module may include multiple stacked switching circuits, each of which may be coupled to fewer than all of the memory chips within the memory module. Switching circuits further include circuitry configured to de-serialize data prior to conveyance to a memory chip, and serialize data received from a DRAM chip prior to transmitting the received data.