Abstract: A method and apparatus is provided for control of plural optical phase shifters in an optical device, such as a Mach-Zehnder Interferometer switch. Drive signal magnitude is set using a level setting input and is used for operating both phase shifters, which may have similar characteristics due to co-location and co-manufacture. A device state control signal selects which of the phase shifters receives the drive signal. One or more switches may be used to route the drive signal to the selected phase shifter. Separate level control circuits and state control circuits operating at different speeds may be employed. When the phase shifters are asymmetrically conducting (e.g. carrier injection) phase shifters, a bi-polar drive circuit can be employed. In this case, the phase shifters can be connected in reverse-parallel, and the drive signal polarity can be switchably reversed in order to drive a selected one of the phase shifters.

Abstract: A photonic integrated circuit is provided that is adapted to compensate for an unintentional manufactured refractive index profile, such as a gradient, that arises due to manufacturing variance. The photonic integrated circuit including at least a thermal source and a spaced thermal sink to induce a thermal gradient in the photonic integrated circuit between the thermal source and the spaced thermal sink, the thermal gradient imparts an opposing thermal refractive index profile to correct for the manufactured refractive index profile. In some embodiments the photonic integrated circuit may be constructed with features that have an intentional structured refractive index profile that ensures any unintentional manufactured refractive index profile is correctable by the opposing thermal refractive index profile induced by the thermal source.

Abstract: A method and apparatus is provided for control of plural optical phase shifters in an optical device, such as a Mach-Zehnder Interferometer switch. Drive signal magnitude is set using a level setting input and is used for operating both phase shifters, which may have similar characteristics due to co-location and co-manufacture. A device state control signal selects which of the phase shifters receives the drive signal. One or more switches may be used to route the drive signal to the selected phase shifter. Separate level control circuits and state control circuits operating at different speeds may be employed. When the phase shifters are asymmetrically conducting (e.g. carrier injection) phase shifters, a bi-polar drive circuit can be employed. In this case, the phase shifters can be connected in reverse-parallel, and the drive signal polarity can be switchably reversed in order to drive a selected one of the phase shifters.

Abstract: A photonic integrated circuit is provided that is adapted to compensate for an unintentional manufactured refractive index profile, such as a gradient, that arises due to manufacturing variance. The photonic integrated circuit including at least a thermal source and a spaced thermal sink to induce a thermal gradient in the photonic integrated circuit between the thermal source and the spaced thermal sink, the thermal gradient imparts an opposing thermal refractive index profile to correct for the manufactured refractive index profile. In some embodiments the photonic integrated circuit may be constructed with features that have an intentional structured refractive index profile that ensures any unintentional manufactured refractive index profile is correctable by the opposing thermal refractive index profile induced by the thermal source.

Abstract: An assembly with optical gain assisted optical transposer is provided. The optical transposer which optically couples a fibre array unit and a photonic integrated circuit. The optical transposer includes one or more optical gain elements which are configured to provide optical compensation, for example optical gain to mitigate optical losses associated with multistage photonic integrated devices. According to some embodiments, the optical gain element is a semiconductor optical amplifier (SOA). According to some embodiments the photonic integrated circuit is a SiPh PIC.

Abstract: An assembly with optical gain assisted optical transposer is provided. The optical transposer which optically couples a fibre array unit and a photonic integrated circuit. The optical transposer includes one or more optical gain elements which are configured to provide optical compensation, for example optical gain to mitigate optical losses associated with multistage photonic integrated devices. According to some embodiments, the optical gain element is a semiconductor optical amplifier (SOA). According to some embodiments the photonic integrated circuit is a SiPh PIC.

Abstract: A carrier-effect based optical switch, a method of operating the carrier-effect based switch, and a controller module for controlling a carrier-effect based optical switch are provided. The carrier-effect based optical switch comprises input and output optical couplers, first and second optical waveguide arms each connecting the input optical coupler to the output optical coupler, a first junction diode proximate to the first optical waveguide arm for providing a first optical phase delay thereto due to at least a carrier-based effect, and a first resistive heater proximate to the second optical waveguide arm for providing a second optical phase delay thereto due to a thermo-optic effect.

Abstract: A carrier-effect based optical switch, a method of operating the carrier-effect based switch, and a controller module for controlling a carrier-effect based optical switch are provided. The carrier-effect based optical switch comprises input and output optical couplers, first and second optical waveguide arms each connecting the input optical coupler to the output optical coupler, a first junction diode proximate to the first optical waveguide arm for providing a first optical phase delay thereto due to at least a carrier-based effect, and a first resistive heater proximate to the second optical waveguide arm for providing a second optical phase delay thereto due to a thermo-optic effect.

Abstract: An optical transmitter including an optical waveguide and N microring resonators (MRRs) coupled to the optical waveguide is provided. In such an optical transmitter each of the N MRRs having a different coupling coefficient determining the amount of coupling to the optical waveguide, wherein N>1. In some embodiments, each of the N MRRs has a different spacing distance from the optical waveguide, wherein the coupling coefficient for each MRR is dependent on the spacing. In some embodiments the optical transmitter further includes an input for receiving N drive signals from a controller, each drive signal shifting the resonant wavelength of the corresponding MRR to control the optical power coupled in the corresponding MRR from the optical waveguide in which an optical signal propagates.

Abstract: An optical attenuator and/or optical terminator is provided. The device includes an optical channel having two regions with different optical properties, such as an undoped silicon region which is less optically absorptive and a doped silicon region which is more optically absorptive. Other materials may also be used. A facet at the interface between the two regions is oriented at a non-perpendicular angle relative to a longitudinal axis of the channel. The angle can be configured to mitigate back reflection. Multiple facets may be included between different pairs of regions. The device may further include curved and/or tapers to further facilitate attenuation and/or optical termination.

Abstract: A temperature compensated carrier effect switching cell controls phase shifts to compensate for phase errors induced by temperature difference between arms of the switching cell. The temperature difference may be generated by driving the carrier effect region of the switching cell. Temperature sensors within the arms of the switching cell provide signals indicative of the temperature difference.

Abstract: The present application provides an electrostatic discharge guard structure for photonic platform based photodiode systems. In particular this application provides a photodiode assembly comprising: a photodiode (such as a Si or SiGe photodiode); a waveguide (such as a silicon waveguide); and a guard structure, wherein the guard structure comprises a diode, extends about all or substantially all of the periphery of the Si or SiGe photodiode and allows propagation of light from the silicon waveguide into the Si or SiGe photodiode.

Abstract: The present application provides an electrostatic discharge guard structure for photonic platform based photodiode systems. In particular this application provides a photodiode assembly comprising: a photodiode (such as a Si or SiGe photodiode); a waveguide (such as a silicon waveguide); and a guard structure, wherein the guard structure comprises a diode, extends about all or substantially all of the periphery of the Si or SiGe photodiode and allows propagation of light from the silicon waveguide into the Si or SiGe photodiode.

Abstract: System and method embodiments are provided for optical I/O arrays for wafer scale testing. A wafer includes a plurality of dies of PIC chips. Each die includes a plurality of first and second optical I/O elements each configured to couple to a testing probe array. A row of I/O elements includes alternating ones of the first and second optical I/O elements. Each die also includes a first waveguide and a second waveguide coupling a first one of the first and second optical I/O elements to a second one of the first and second optical I/O elements, respectively. The first and second optical I/O elements configured such that the testing probe array couples to at least some of the first optical I/O elements from a first side of the PIC chip and couples to at least some of the second optical I/O elements from a second side of the PIC chip.

Abstract: An alignment system for aligning a field space concentrator (FSC) joined to a fiber array unit (FAU) with a photonic integrated circuit (PIC) chip includes a first sensor on the PIC chip that responds electrically to interaction with a first alignment element on the FSC, a second sensor on the PIC chip that responds electrically to interaction with a second alignment element on the FSC, and a processor electrically connected to the first and second sensors for receiving and processing signals from the first and second sensors to determine an alignment of the FSC with the PIC chip.

Abstract: An optical attenuator and/or optical terminator is provided. The device includes an optical channel having two regions with different optical properties, such as an undoped silicon region which is less optically absorptive and a doped silicon region which is more optically absorptive. Other materials may also be used. A facet at the interface between the two regions is oriented at a non-perpendicular angle relative to a longitudinal axis of the channel. The angle can be configured to mitigate back reflection. Multiple facets may be included between different pairs of regions. The device may further include curved and/or tapers to further facilitate attenuation and/or optical termination.

Abstract: System and method embodiments are provided for optical I/O arrays for wafer scale testing. A wafer includes a plurality of dies of PIC chips. Each die includes a plurality of first and second optical I/O elements each configured to couple to a testing probe array. A row of I/O elements includes alternating ones of the first and second optical I/O elements. Each die also includes a first waveguide and a second waveguide coupling a first one of the first and second optical I/O elements to a second one of the first and second optical I/O elements, respectively. The first and second optical I/O elements configured such that the testing probe array couples to at least some of the first optical I/O elements from a first side of the PIC chip and couples to at least some of the second optical I/O elements from a second side of the PIC chip.

Abstract: An apparatus comprising a first photonic device comprising a waveguide loop configured to guide a first light from a first location of a surface to a second location of the surface, and a second photonic device comprising a light source configured to provide the first light, and a first alignment coupler optically coupled to the light source and configured to optically couple to the waveguide loop at the first location, a second alignment coupler configured to optically couple to the waveguide loop at the second location, and a photodetector optically coupled to the second alignment coupler and configured to detect the first light when the waveguide loop is aligned with the first alignment coupler and the second alignment coupler, and generate, based on the detection and on the received light, an electrical signal.

Abstract: An optical coupling input/output interface including a multilayer ribbon comprising a plurality of layers with each layer having a plurality of waveguides. The I/O interface further includes a coupling interface section, wherein the plurality of layers are staggered to allow for evanescent coupling of the waveguides of each layer with a corresponding layer of waveguides in a photonic device.

Abstract: An apparatus comprising a first photonic device comprising a waveguide loop configured to guide a first light from a first location of a surface to a second location of the surface, and a second photonic device comprising a light source configured to provide the first light, and a first alignment coupler optically coupled to the light source and configured to optically couple to the waveguide loop at the first location, a second alignment coupler configured to optically couple to the waveguide loop at the second location, and a photodetector optically coupled to the second alignment coupler and configured to detect the first light when the waveguide loop is aligned with the first alignment coupler and the second alignment coupler, and generate, based on the detection and on the received light, an electrical signal.