Patents by Inventor Duane Eitzen

Duane Eitzen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods for adapting parameters to increase throughput during laser-based wafer processing
    Patent number: 8076605
    Abstract: Systems and methods automatically modify a laser-based system for processing target specimens such as semiconductor wafers. In one embodiment, the laser-based system detects a trigger associated with a processing model. The processing model corresponds to a set of wafers. In response to the trigger, the system automatically adjusts one or more system parameters based on the processing model. The system then uses the modified system parameters to selectively irradiate structures on or within at least one wafer in the set of wafers. In one embodiment, the trigger includes variations in a thermal state related to a motion stage. In response to the variations in the thermal state, the system operates the motion stage in a series of movements until a thermal equilibrium threshold is reached. The sequence of movements may, for example, simulate movements used to process a particular wafer.
    Type: Grant
    Filed: June 25, 2007
    Date of Patent: December 13, 2011
    Assignee: Electro Scientific Industries, Inc.
    Inventors: Kelly J. Bruland, Clint Vandergiessen, Duane Eitzen
  • SYSTEMS AND METHODS FOR ADAPTING PARAMETERS TO INCREASE THROUGHPUT DURING LASER-BASED WAFER PROCESSING
    Publication number: 20080314879
    Abstract: Systems and methods automatically modify a laser-based system for processing target specimens such as semiconductor wafers. In one embodiment, the laser-based system detects a trigger associated with a processing model. The processing model corresponds to a set of wafers. In response to the trigger, the system automatically adjusts one or more system parameters based on the processing model. The system then uses the modified system parameters to selectively irradiate structures on or within at least one wafer in the set of wafers. In one embodiment, the trigger includes variations in a thermal state related to a motion stage. In response to the variations in the thermal state, the system operates the motion stage in a series of movements until a thermal equilibrium threshold is reached. The sequence of movements may, for example, simulate movements used to process a particular wafer.
    Type: Application
    Filed: June 25, 2007
    Publication date: December 25, 2008
    Applicant: Electro Scientific Industries, Inc.
    Inventors: Kelly J. Bruland, Clint Vandergiessen, Duane Eitzen